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반도체부품 생산공정 자원의 부하 측정방법 비교분석 사례연구

A Case Study of Comparing the Measuring Methods for Workloads of Resources in a Manufacturing Processes of Semiconductor-Parts

  • 김동수 (창원대학교 산업시스템공학과) ;
  • 문덕희 (창원대학교 산업시스템공학과)
  • 투고 : 2011.05.05
  • 심사 : 2011.08.30
  • 발행 : 2011.09.30

초록

설비나 작업자에 대한 부하효율은 제조공장에서 생산용량계획을 수립하는데 중요한 정보다. 즉 공장에서 신제품을 개발하거나, 생산량을 증가시킬 경우, 새로운 투자계획을 수립할 경우에도 항상 설비나 작업자에 대한 부하효율을 검토한다. 이러한 부하효율을 추정하기 위해서 다양한 측정방법이 사용된다. 본 본문에서는 설문조사, 순간관측법, 동영상 촬영을 이용한 미세동작연구방법, ERP시스템에서 자료를 취득하는 방법, 시뮬레이션방법 등 다양한 측정방법의 정확성에 대해 실제 사례를 이용해 비교분석하였다. 본 사례연구는 리드프레임이나 패키징용 부품을 생산하는 국내 반도체부품 생산공장을 대상으로 수행하였다.

The workloads of facilities and laborers are important for the capacity planning in a factory. They are always referenced whenever a factory develops a new product, increases the production quantity and makes a plan of new investment. There are many measuring methods for estimating the workload effectiveness of facilities and laborers. In this paper, various measuring methods including survey, work sampling, micro-motion study, data gathering from ERP system and simulation, are analyzed for comparing the accuracy of workload. This case study is conducted in a Korean company that produces semiconductor parts like leadframe and packaging substrate.

키워드

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피인용 문헌

  1. A Case Study on Productivity Improvement by a Discrete Event-Driven Simulation System vol.38, pp.4, 2015, https://doi.org/10.11627/jkise.2015.38.4.149
  2. A Comparison of the Effects of Worker-Related Variables on Process Efficiency in a Manufacturing System Simulation vol.38, pp.1, 2013, https://doi.org/10.5307/JBE.2013.38.1.033