Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 15 Issue 1
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- Pages.45-50
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- 2008
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
The Effects of Additives on the Electropolishing of Copper Through Via
구리 Through Via 전해연마에 미치는 첨가제의 영향 연구
- Lee, Suk-Ei (Department of Materials Science and Engineering, Hongik University) ;
- Lee, Jae-Ho (Department of Materials Science and Engineering, Hongik University)
- Published : 2008.03.30
Abstract
The effects of electrolytes and additives on the electropolishing of 50 and
Through via 3D SiP의 평탄화 공정에 적용하기 위해 전기도금법을 이용하여 직경