Characteristics of Non-plasticizer PVAc Resin for Wood Products

  • Kim, Sumin (Lab. of Adhesion & Bio-Composites, Program in Environmental Materials Science, Department of Forest Sciences, Seoul National University) ;
  • Kim, Hyun-Joong (Lab. of Adhesion & Bio-Composites, Program in Environmental Materials Science, Department of Forest Sciences, Seoul National University) ;
  • Choi, Youn Mee (R&D Center, OKONG Corp.) ;
  • Jang, Sung-Wook (R&D Center, OKONG Corp.)
  • Received : 2006.11.30
  • Accepted : 2007.01.10
  • Published : 2007.03.25

Abstract

The applicable scope of adhesives in the current society is broad and currently, several types of PVAc resin are sold in the market for adhesives. PVAc resin is primarily used for wood works and paper adhesion. However, the PVAc resin itself has the disadvantages that its viscosity is highly temperature- dependent and the work condition and viscosity get worse at the low temperature in the winter seasons. Although phthalate-based plasticizer is used to complement these disadvantages, adhesion strength and heat-resistance are weakened by adding the phthalate-based plasticizer and in the winter period, the amount of quantity should be increased. Also in a high-density product, it worsens the work condition by causing a rise of viscosity and delays curing and in a low-density product, it worsens the storage stability by causing separate precipitation. In addition to these, the phthalate-based plasticizer as a material of causing environmental hormones is currently restricted in the advanced countries for its amount of use and also in the domestic market, it is necessary to prepare for the situation. This study has not only eliminated the disadvantages of PVAc resin emulsion without adding a phthalate-based plasticizer of causing these problems, but also synthesized the PVAc resin for timber adhesion that is excellent in woodwork, thermal-resistance, water-resistance, storage stability, and adhesion performance. As the result, it has proven an excellent performance in thermal resistance, water resistance, storage stability, and minimum film forming temperature.

Keywords

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