Phenol-Formaldehyde (PF) Resin Bonded Medium Density Fiberboard

  • Park, Byung-Dae (Department of Wood and Forest Sciences, Laval University) ;
  • Riedl, Bernard (Department of Wood and Forest Sciences, Laval University) ;
  • Park, Sang-Jin (Department of Wood Engineering, Kyung-Pook National University)
  • Received : 1998.03.13
  • Published : 1999.03.30

Abstract

This study was conducted to manufacture MDF panels bonded with PF resins which provide excellent durability and dimensional stability with panels, and to identify benefits and weaknesses of using PF resins for MDF panels that have been manufactured with urea-formaldehyde (UF) resins for interior applications due to its low dimensional stability under moisture conditions. The results showed that the performance of PF-bonded MDF panels satisfied the performance requirement. A six-cycle aging test also revealed that PF-bonded MDF panels had high durability. Thickness swelling after 24 hours submersion in cold water was less than 2 percent, showing good dimentioanl stability. The identified weaknesses of using PF resins were relatively high resin content and long hot-pressing time. An acceptable resin content appeared to be 8 percent which can increase the production cost of PF-bonded MDF panels. The hot-pressing time (7 minutes) used in this study is relatively long compared to that of UF-bonded MDF panels. This result also indicates that hot-pressing process has to be optimized to control various pressing variables.

본 연구는 통상적으로 충밀도 섬유판 제조에 사용되고있는 요소수지를 페놀수지로 대체함으로써 그 장단점을 찾아 보기 위해 실행되었다. 페놀수지을 이용해 제조한 중밀도 섬유판의 성능은 표준 요건을 충족시켰으며 높은 내구성을 보였다. 아울러 24 시간 냉수 침적후 두께팽창은 2 퍼센트 이하로 낮게 나타났다. 요소수지를 페놀수지로 대체했을 경우 단점들은 비교적 높은 수지함량 (8% 섬유전건종량기준)과 긴 열압시간 (7 분)으로 판명되었다. 이러한 결과들은 페놀수지을 사용한 중밀도 섬유판제조시 열압공정의 최적화가 되어야함을 시사하였다.

Keywords