한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2009년도 추계학술대회 논문집
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- Pages.64-64
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- 2009
Real-time Monitoring of Cu Plating Process for Semiconductor Interconnect
- Wang, Li (Department of Electronic Engineering, Myongji University) ;
- Jee, Young-Joo (Department of Electronic Engineering, Myongji University) ;
- Soh, Dae-Wha (Department of Electronic Engineering, Myongji University) ;
- Hong, Sang-Jeen
- 발행 : 2009.11.12
초록
As the advanced packaging technology developing, Copper electro-plating processing has be wildly utilized in the semiconductor interconnect technique. Chemical solution monitoring methods, including PH and gravity measurement exist in industry, but economical and practical real-time monitoring has not been achieved yet. Red-green-blue (RGB) color sensor can successfully monitor the condition of