Lifetime Estimation for FPCB of Slide mobile phone

슬라이드형 휴대폰 FPCB(Flexible Printed Circuit Board)의 수명예측

  • 최진영 (한양대학교, 전자통신컴퓨터공학부) ;
  • 장석원 (한양대학교 신뢰성분석연구센터(RARC)) ;
  • 곽계달 (한양대학교 전자통신컴퓨터공학부)
  • Published : 2008.11.05

Abstract

The FPCB is used as the important component of the sliding mechanism of mobile phones. FPCB have been used as jumper cables(fixed wiring) in various types of circuits because of their flexibility and bending property. The dominant failure mode of the FPCB is open that was caused by fatigue. The fatigue is repeated whenever the sliding is open, so it is a mainly cause of FPCB fatigue. We examined the bending-fatigue lifetime of FPCB. we focused on observing the contact resistance degradation of FPCB of mobile phones according to different test condition of bending strain. As a result, it has proved that lifetime decreased by increasing bending strain.

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