• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.4
• /
• pp.69-76
• /
• 2014

In this study, we developed an ultra-thin flexible printed circuit board(FPCB) using the sputtered flexible copper clad laminate. In order to enhance the adhesion between copper and polyimide substrate, a NiMoNb addition layer was applied. The mechanical durability and flexibility of the ultra-thin FPCB were characterized by stretching, twisting, bending fatigue test, and peel test. The stretching test reveals that the ultra-thin FPCB can be stretched up to 7% without failure. The twisting test shows that the ultra-thin FPCB can withstand an angle of up to $120^{\circ}$. In addition, the bending fatigue test shows that the FPCB can withstand 10,000 bending cycles. Numerical analysis of the stress and strain during stretching indicates the strain and the maximum von Mises stress of the ultra-thin FPCB are comparable to those of the conventional FPCB. Even though the ultra-thin FPCB shows slightly lower durability than the conventional FPCB, the ultra-thin FPCB has enough durability and robustness to apply in industry.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1283-1288
• /
• 2008

The FPCB is used as the important component of the sliding mechanism of mobile phones. FPCB have been used as jumper cables(fixed wiring) in various types of circuits because of their flexibility and bending property. The dominant failure mode of the FPCB is open that was caused by fatigue. The fatigue is repeated whenever the sliding is open, so it is a mainly cause of FPCB fatigue. We examined the bending-fatigue lifetime of FPCB. we focused on observing the contact resistance degradation of FPCB of mobile phones according to different test condition of bending strain. As a result, it has proved that lifetime decreased by increasing bending strain.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.111-118
• /
• 2018

In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at $60^{\circ}C$ and then the PDMS was fully cured for 12 hours at $60^{\circ}C$, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.39-46
• /
• 2019

A stiffness-gradient soft PDMS/hard PDMS/FPCB stretchable package of the island-bridge structure was processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate, and its effective elastic modulus and stretchable deformation characteristics were analyzed. With the elastic moduli of the soft PDMS, hard PDMS, and FPCB to be 0.28 MPa, 1.74 MPa, and 1.85 GPa, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was analyzed as 0.58 MPa. When the soft PDMS of the soft PDMS/hard PDMS/FPCB package was stretched to a tensile strain of 0.3, the strains occurring at hard PDMS and FPCB were found to be 0.1 and 0.003, respectively.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.20 no.11
• /
• pp.1194-1200
• /
• 2009

An internal antenna which has 1 cc volume was implemented on the FPCB(Flexible Printed Circuit Board) for the mobile phone. We increased antenna gain and efficiency by the applying of current direction concept on the antenna pattern for this small antenna. Short antenna length for the GSM band was compensated by the spiral inductor on the FPCB. For broadening bandwidth on GSM band, it's applied 2 spiral inductors. A conductor pattern for the DCS band was positioned perpendicular with the FPCB. Antenna was implemented on FPCB that is dielectric constant 4.4 and thickness 0.05 mm, and FPCB was attached on a carrier dimensioned $L{\times}W{\times}H=30{\times}7{\times}5\;mm$. Measurements showed that max. VSWR 2:1, efficiency 42.49~60.95 % and 47.95~73.21 %, average gain -3.72~-2.15 dBi and -3.19~-1.35 dBi on the GSM and DCS band, respectively. These results are good performances among the small antenna. And the radiation patterns are omnidirectional on the H-plane to both band.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.293-294
• /
• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.195-196
• /
• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2008.06a
• /
• pp.379-380
• /
• 2008

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.55-62
• /
• 2019

Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/FPCB structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff flexible printed circuit board (FPCB) as the island substrate. The elastic characteristics of the stretchable packages were estimated and their long-term reliabilities on stretching cycles and bending cycles were characterized. With 0.28 MPa, 1.74 MPa, and 1.85 GPa as the elastic moduli of the soft PDMS, hard PDMS, and FPCB, respectively, the effective elastic modulus of the soft PDMS/hard PDMS/FPCB package was estimated as 0.6 MPa. The resistance of the stretchable packages varied for 2.8~4.3% with stretching cycles ranging at 0~0.3 strain up to 15,000 cycles and for 0.9~1.5% with 15,000 bending cycles at a bending radius of 25 mm.

• Journal of the Korean Society for Precision Engineering
• /
• v.27 no.3
• /
• pp.9-17
• /
• 2010

The FPCB is used for electronic products such as LCD display. The process of manufacturing FPCB includes a cutting process, in which each single FPCB is cut and separated from the panel where a series of FPCBs are arrayed. The most-widely used cutting method is the mechanical punching, which has the problem of creating burrs and cracks. In this paper, the cutting characteristics of the FPCB have been experimented using Nd:YAG DPSS UV laser as a way of solving this problem. To maximize the industrial application of this laser cutting process, test samples of the multilayered FPCB have been chosen as it is actually needed in industry. The cutting area of the FPCB has four different types of layer structure. First, to cut the test sample, the threshold laser cut-off fluence has been found. Various combinations of laser and process parameters have been made to supply the acquired laser cut-off fluence. The cutting characteristics in terms of the variation of the parameters are analyzed. The laser and process parameters are optimized, in order to maximize the cutting speed and to reach the best quality of the cutting area. The laser system for the process automation has been also developed.