• 제목/요약/키워드: wet transfer

검색결과 175건 처리시간 0.03초

소형 흡착식 제습기의 모델 개발 (Modelling of a Small Domestic Solid Desiccant Dehumidifier)

  • 김동선
    • 융복합기술연구소 논문집
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    • 제2권2호
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    • pp.40-48
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    • 2012
  • A small domestic desiccant dehumidifier is modelled using effectiveness models for a desiccant wheel and a wet-air condenser. The desiccant wheel and condenser models are used to compose a system model in the form of a set of simultaneous linear algebraic equations, which is solved by Gauss method. The system model is used to simulate the behaviour of a dehumidifier with a 1kW electric air heater. It is found that the maximu COP is about 0.5 and dehumidification capacity is 18kg/day when the ratio of dehumidification area is 0.7. The optimum wheel thickness and face velocity are found 100mm and 1.5m/s, respectively.

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Mold 법에 의해 제작된 FED용 전계에미터어레이의 특성 분석 (Fabrication & Properties of Field Emitter Arrays using the Mold Method for FED Application)

  • 류정탁;조경제;이상윤;김연보
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 하계학술대회 논문집
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    • pp.347-350
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    • 2001
  • A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

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비등열전달 향상을 위한 초소형 핀 제작공정에 관한 연구 (A Study on the microcooling Fin Fabrication Process for Enhancing Boiling Heat Transfer)

  • 유삼상;임태우;정석권;박종운
    • 수산해양교육연구
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    • 제19권3호
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    • pp.366-372
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    • 2007
  • This paper presents the fabrication techniques of microcooling fins for microelectronics applications. The various types of cooling fins have been fabricated on the surface of a silicon wafer (4inch-N type) by using wet etching technique. The designed micro fins and micro channels are considered as an effective method for cooling microelectronics devices generating high heat flux. Further we extensively investigate the design processes fabricating micro fins and channels which can cool the heat generated from high density electronics devices.

수반응 우레탄과 바닥용 경질 폴리우레탄을 이용한 바닥마감재의 성능향상에 관한 실험적 연구 (A study on the improvement for performance of floor finishing materials using poly urethane with water reacting urethane)

  • 강효진;박진상;박종욱;오상근
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2006년도 춘계 학술발표회 논문집(II)
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    • pp.653-656
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    • 2006
  • It is necessary for the new material and construction concept to make up for weak point which related to high durability and finish ability to solve exposure limit of exist construction method. This paper is deal with performance test(tier load, anti abrasion, anti impact, permeability, bond test) compositive using for water reacting soft urethane and rigid urethane to improve the exist problem which are crack movement, adhesive on the wet surface, impact and abrasion by tier load. It is getting decreasing demage compare with other exist materials after test by transfer load, movement and impact.

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Low temperature curable organic gate insulator for organic field-effect transistors

  • Kim, Joo-Young;Jung, Myung-Sup;Lee, Sang-Yoon;Kim, Jong-Min;Kim, Jang-Joo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.664-666
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    • 2008
  • Low-temperature curable organic insulator was prepared through blending of polyimide type base resin and cross-linking agent. The newly developed resin can be formed into films using a wet process and cured at $130^{\circ}C$. Using the low temperature cured film as the gate dielectric layer, the field effect mobility of $0.15\;cm^2/V{\cdot}s$ was obtained from a pentacene field effect transistor in the saturation regime and no hysteresis behavior was observed in transfer curves.

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제조공조용 핀-관형 증발기의 열성능 모델링 (Thermodynamic Modeling of Finned Tube Evaporator for Dehumidification and Air Conditioning)

  • 박병규;이태환
    • 설비공학논문집
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    • 제12권11호
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    • pp.1020-1030
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    • 2000
  • A crossflow finned tube evaporator has been investigated using tube-by-tube method. The refrigerant flows inside tubes while the air passes outside the finned tue. R134a for a refrigerant and wet air were used in this analysis. Three refrigerant circuitries, complex or simple, were compared. The effects of refrigerant circuitry and airside condensation on thermal performance such as heat transfer rate, enthalpy of refrigerant, temperature of refrigerant and air, pressure of refrigerant and average condensate layer thickness were investigated. It was found that this method could be applied to the analysis of finned tube evaporator for dehumidification and air conditioning.

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Atomic Study of Oxidation of Si(001) surface by MD Simulation

  • Pamungkas, Mauludi Ariesto;Kim, Byung-Hyun;Joe, Min-Woong;Lee, Kwang-Ryeol
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.360-360
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    • 2010
  • Very initial stage of oxidation process of Si (001) surface was investigated using large scale molecular dynamics simulation. Reactive force field potential was used for the simulation owing to its ability to handle charge variation associated with the oxidation reaction. To know the detail mechanism of both adsorption and desorption of water molecule (for simulating wet oxidation), oxygen molecule (for dry oxidation) and their atom constituents, interaction of one molecule with Si surface was carefully observed. The simulation is then continued with many water and oxygen molecules to understand the kinetics of oxide growth. The results show that possibilities of desorption and adsorption depend strongly on initial atomic configuration as well as temperature. We observed a tendency that H atoms come relatively into deeper surface or otherwise quickly desorbed away from the silicon surface. On the other hand, most oxygen atoms are bonded with first layer of silicon surface. We also noticed that charge transfer is only occur in nearest neighbor regime which has been pointed out by DFT calculation. Atomic structure of the interface between the oxide and Si substrate was characterized in atomic scale.

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강제통풍식 냉각탑 특성에 관한 연구 (A Study on the Characteristics of Forced Draft Cooling Tower)

  • 서정일;김광수;이영수
    • 대한설비공학회지:설비저널
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    • 제13권2호
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    • pp.1-9
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    • 1984
  • This paper presents design conditions due to the NTU of counter and cross flow type cooling tower. In the calculation of optimum design conditions for above two types which are widely used in our country, standard water-air ratio, ambient wet bulb temperature and bulk water temperature were adopted by domestic wheather conditions. The important result of this study is obtained as follows : Under the constant value of Ka and L, the number of transfer unit of cross flow type cooling tower Is about 1.1 times as large as that of counter, so the volume of cross flow type is about $10\%$ greater than that of counter.

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비선형 물수지모형과 팔머가뭄심도지수를 이용한 가뭄지속기간 분석 (An Analysis of the Drought Period Using Non-Linear Water Balance Model and Palmer Drought Severity1 Index)

  • 이재수
    • 한국수자원학회논문집
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    • 제34권5호
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    • pp.533-542
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    • 2001
  • 가뭄에 대한 대책을 수립하기 위해서는 각 가뭄상태별로 가뭄의 지속기간을 산정하는 것이 선행되어야 한다. 이러한 가뭄의 지속기간 분석에 사용할 수 있는 방법에는 비선형 물수지모형과 Palmer 가뭄심도지수방법이 있다. 비선형 물수지모형은 지표면과 대기의 수분이동을 고려한 물수지방법을 추계학적 변동에 의해 야기되는 건기와 습윤기 사이의 변환기간을 모의할 수가 있다. Palmer 가뭄심도지수는 강우량과 잠재증발산량을 바탕으로 기상학적으로 필요한 강우량과 실제강우량을 비교하여 가뭄의 정도를 나타내는 물수지방법이다. 본 연구에서는 한강유역에 대해 비선형 물수지모형과 Palmer 가뭄심도지수를 이용하여 가뭄의 지속기간을 산정하였다. 비선형 물수지모형을 사용하여 산정된 토양함수비에 따른 가뭄의 지속기관과 Palmer 가뭄심도지수를 이용하여 산정된 지수별 가뭄의 지속기간이 유사하게 나타났다. 연구 결과 한강유역에서의 극심한 가뭄상태에서 습윤기로 변환되는 지속기간이 약 3년으로 산정되었다.

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습식 교반 및 방전 플라즈마 소결 공정에 의한 CNT 분산 Cu 복합재료 제조 (Fabrication of CNT dispersed Cu matrix composites by wet mixing and spark plasma sintering process)

  • 조승찬;조일국;이상복;이상관;최문희;박재홍;권한상;김양도
    • 한국분말재료학회지
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    • 제25권2호
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    • pp.158-164
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    • 2018
  • Multi-walled carbon nanotube (MWCNT)-copper (Cu) composites are successfully fabricated by a combination of a binder-free wet mixing and spark plasma sintering (SPS) process. The SPS is performed under various conditions to investigate optimized processing conditions for minimizing the structural defects of CNTs and densifying the MWCNT-Cu composites. The electrical conductivities of MWCNT-Cu composites are slightly increased for compositions containing up to 1 vol.% CNT and remain above the value for sintered Cu up to 2 vol.% CNT. Uniformly dispersed CNTs in the Cu matrix with clean interfaces between the treated MWCNT and Cu leading to effective electrical transfer from the treated MWCNT to the Cu is believed to be the origin of the improved electrical conductivity of the treated MWCNT-Cu composites. The results indicate the possibility of exploiting CNTs as a contributing reinforcement phase for improving the electrical conductivity and mechanical properties in the Cu matrix composites.