• Journal of Welding and Joining
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• v.20 no.4
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• pp.437-442
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• 2002

• Journal of Welding and Joining
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• v.21 no.6
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• pp.16-19
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• 2003

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.82-84
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• 1994

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.150-153
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• 1994

• Journal of Welding and Joining
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• v.19 no.1
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• pp.8-14
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• 2001

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.120-121
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• 2001

• Journal of Welding and Joining
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• v.20 no.3
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• pp.9-15
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• 2002

• Journal of Welding and Joining
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• v.21 no.6
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• pp.55-63
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• 2003

Welded joint generally has heterogeneity of strength, material, and fracture toughness and it is important to understand the characteristics of material strength and fracture of welded joint considering heterogeneous effect. Characteristics of strength and fracture of an undermatched joint under dynamic loading was studied by round-bar tension tests and thermal elastic-plastic analyses in this paper. The strength and fracture of the undermatched joints should be evaluated based on the effects of the strain rate and the temperature including temperature rise during the dynamic loading. The differences of fracture characteristics like such as ductile-to-brittle transition behavior are well precisely explained from the stress-strain distribution obtained by numerical analysis.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.109-116
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• 1998

The three-dimensional profile of a solder fillet is predicted by minimizing the surface tension and gravity energies of the solder joint using finite element modeling. Geometric complexity stemming from the inclined plane of the gullwing lead is resolved by employing three element types. These element types are used to describe the joint profile formed on the vertical, inclined and interfacial planes. The predicted solder joint profiles show good agreements with the experimental data provided that the solder volume is adjusted considering the wicking effects. Effects of the pad length, inclined lead angle and solder volume on joint profiles are also investigated.

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.