References
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- Journal of Electronic Packaging, ASME v.115 Finite element method for predicting equilibrium shapes of solder joints N.J. Nigro;S.M. Heinrich;A.F. Elkouh
- ISIJ International v.33 no.2 Determination of equilibrium shapes and optimal volume of solder droplets in the assembly of surface mounted integrated circuits L.M. Racz;J. Szekely
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- 대한용접학회지 v.14 no.2 3차원 납 접합부형상을 이용한 표면실장기술의 적정 납량 결정 최동필;김성관;유중돈
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