• 제목/요약/키워드: void force

검색결과 71건 처리시간 0.038초

배뇨력 측정을 통한 하부요로계의 보상성기능항진 평가 (Estimation of compensatory hypertrophy in lower urinary system using void force measurement)

  • 정도운;전계록
    • 센서학회지
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    • 제15권6호
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    • pp.449-456
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    • 2006
  • The purpose of urodynamic investigation is to obtain the information on the function of the urinary system. The aim of this study is to acquire the useful information of lower urinary tract symptom (LUTS) diagnosis through void force signal as noninvasive method. The system which could evaluate the function of compensatory hypertrophy with noninvasive and comfortable method was implemented to measure uroflow and void force during urination. The implemented system composes of the sensor parts, signal conditioning parts and PC monitoring program. For the evaluation of the implemented system, the simulation of control part of the system was performed and the model system for the lower urinary system was designed. The superiority of a measuring characteristic of the implemented system was verified using the model system. From the evaluation of the model system, we have found out that the void force was dependent on the occlusion degree and compensatory hypertrophy significantly.

A numerical analysis of the equivalent skeleton void ratio for silty sand

  • Dai, Bei-Bing;Yang, Jun;Gu, Xiao-Qiang;Zhang, Wei
    • Geomechanics and Engineering
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    • 제17권1호
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    • pp.19-30
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    • 2019
  • Recent research on the behavior of silty sand tends to advocate the use of equivalent skeleton void ratio to characterize the density state of this type of soil. This paper presents an investigation to explore the physical meaning of the equivalent skeleton void ratio by means of DEM simulations for assemblies of coarse and fine particles under biaxial shear. The simulations reveal that the distribution pattern of fine particles in the soil skeleton plays a crucial role in the overall macroscopic response: The contractive response observed at the macro scale is mainly caused by the movement of fine particles out of the force chains whereas the dilative response is mainly associated with the migration of fine particles into the force chains. In an assembly of coarse and fine particles, neither all of the fine particles nor all of the coarse ones participate in the force chains to carry the external loads, and therefore a more reasonable definition for equivalent skeleton void ratio is put forward in which a new parameter d is introduced to take into account the fraction of coarse particles absent from the force chains.

압저재료에서 원공결함이 균열에 미치는 영향 (Influence of Circular Void on a Crack in a Piezoelectric Material)

  • 이종권;조종두
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 추계학술대회 논문집
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    • pp.539-542
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    • 2000
  • In this paper, the influence of circular void on a crack in piezoelectric materials under mechanical and electric loads is investigated by using finite element method code, ANSYS. Both ceramics and piezoelectric materials are compared with stress intensity factor and crack extension force at crack tip on arbitrary located circular void under Mode I loads. It was found that piezoelectric materials's crack extension force is larger than ceramics.

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Effect of anisotropic diffusion coefficient on the evolution of the interface void in copper metallization for integrated circuit

  • Choy, J.H.
    • 한국결정성장학회지
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    • 제14권2호
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    • pp.58-62
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    • 2004
  • The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

솔더 접합부에 생성된 Void의 JEDEC 규격과 기계적 특성에 미치는 영향 (Analysis of Void Effects on Mechanical Property of BGA Solder Joint)

  • 이종근;김광석;윤정원;정승부
    • 마이크로전자및패키징학회지
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    • 제18권4호
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    • pp.1-9
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    • 2011
  • Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

지반 소실 혼합재의 용해과정 모니터링 (Dissolution Monitoring of Geo-Soluble Mixtures)

  • 쭝꽝훙;변용훈;엄용훈;심영종;이종섭
    • 한국지반공학회논문집
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    • 제25권10호
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    • pp.111-122
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    • 2009
  • 지반에 포함된 입자의 용해작용은 흙의 강도를 저하시키고, 지하구조물의 침하를 발생시킨다. 본 논문에서는 입자용해시 혼합재의 물리적 특성 변화를 조사하고자 하였다. 침하량 측정과 전단파 측정과 같은 거시적 반응을 평가하기 위해, 소금과 모래로 구성된 혼합재를 사용하였다. 또한, 광탄성(photoelastic) 디스크와 얼음 디스크 혼합재를 이용하여 힘 연결고리(force chain), 간극, 접촉점수(coordination number), 그리고 수평력 변화와 같은 미시적 거동을 분석하였다. 소금-모래 혼합재에서 전단파는 압밀셀에 설치된 다단의 벤더 엘리먼트로 측정되었고, 광탄성 디스크-얼음 디스크 혼합재의 역학적 거동은 로드셀과 디지털 이미지를 이용하여 분석되었다. 실험결과, 소금의 용해시 전단파 속도는 초기에는 감소한 후에 증가한 후 일정한 값으로 수렴하였다. 용해가능 입자의 크기가 커질수록 그리고 입자패킹이 불규칙해질수록 입자용해시 수평력의 변화가 더 커지는 것을 알 수 있었다. 용해 후, 간극비는 증가했고, 접촉점수는 감소하였다. 본 연구에서는 힘 연결고리, 간극비, 접촉점수와 같은 입자의 거동변화가 전단파 속도와 전체시스템의 수평력 변화 같은 전체적인 거동에 영향을 주는 것으로 나타났다.

CD 스터드 용접공정의 해석 및 결함 분석 (Analysis of CD stud welding process and defects)

  • 오현석;유중돈
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 추계학술발표대회 개요집
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    • pp.55-57
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    • 2005
  • In this study, modeling of the CD stud welding system was conducted considering mechanical and electrical components. The electrical components such as arc resistance, cable resistance, capacitance, internal resistance and cable inductance were found to affect the output waveform significantly. The calculated results showed food agreements with the experiment results within 20% error. The main defect of CD stud welding with 1010 steel stud and SS400 steel plate was the void trapped between stud and base metal. The effect of the spring force and stud tip size on void formation was investigated.

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레이저 용접 테일러드 블랭크의 기본 성형특성 I : 인장변형 특성 (Forming Characteristics of Laser Welded Tailored Blanks I : Tensile Deformation Characteristics.)

  • 박기철;한수식;김광선;권오준
    • 소성∙가공
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    • 제7권1호
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    • pp.23-35
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    • 1998
  • In order to analyze the tensile deformation characteristics of laser welded tailored blanks. laser welded blanks of different thikness and strength combinations were prepared and tensile tests were done. The tensile elongation along the direction perpendicular to weld line of laser welded blanks was reduced as increasing the deformation restraining force (strength X thicknes) ratio between two welded sheets and fracture occurred at weaker side of base sheets if void ration of welded sheets and fracture occurred at weaker side of base sheets if void ratio of weld section was less than 45% The tensile elongation along weld line reached above 90% of the elongation of base material if welding was done perfectly. Total elongation along the direction perpendicular to weld line was able to be predicted by force equilibrium and power law behavior of base sheets and it was related with the deformation of stronger sheet and formability of weaker side.

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자동차용 head lamp의 수밀원인 분석 (Failure analysis on the phenomenon of water condensing of automotive head lamp assembly)

  • 조영진;전종수
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1349-1354
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    • 2008
  • In this study, we try to find the root cause of water condensing failures in a headlamp using chemical and mechanical analysis. Through the surface inspection by OM, SEM and CT, it was found that water infiltrate into the headlamp through hotmelt adhesive debonding part caused by adhesion force degradation and poor quality. IR spectra shows that adhesion force degradation are characterized by increase of some functional group(1742, 1710, 1649, 1016). Through the ESPI measurement, it is turned out that bonding structural change by thermal expansion and degradation of adhesive can be the cause of void generation. So it is recommended that cooling passage and the bonding part should be redesigned to give a guarantee of less thermal stress and high adhesion quality.

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수직관에서의 이상유동 특성 (Characteristics of Two-Phase Flow in Vertical Pipe)

  • 배병모;심우건
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2004년도 추계학술대회논문집
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    • pp.879-882
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    • 2004
  • Two-phase flow exists in many industrial components. Characteristics of two-phase flow have been studied by many researchers; however, a further study of the two-phase is required for flow-induced vibration. Characteristics of two-phase flow were measured by force sensor at the end of a vertical pipe. The predominant frequency of fluctuation was obtained for various speeds of flow pattern. A correlation to slug frequency for horizontal flow was obtained by Heywood & Richardson (1979), while Legius et al (1997) for vertical flow. A coefficient based on the correlation is estimated and then compared to the existing ones. The existing empirical formulations for average void fraction were proposed by Wallis (1969), Zuber et al (1967) and Ishii (1970). In the present result, flow parameters, such as flow quality and real velocity, are evaluated with void fraction.

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