• ETRI Journal
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• v.36 no.4
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• pp.617-624
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• 2014

Through-silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as three-dimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo- and heterogeneous device integration. In TSV, a destructive cross-sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer-to-wafer variation in volume manufacturing.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.3
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• pp.244-250
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• 2008

An inductively coupled plasma etching process to replace an existing slower rate reactive ion etching process for $60{\mu}m$ diameter via-holes using Cl2/BCl3 gases has been investigated. Process pressure and platen power were varied at a constant ICP coil power to reproduce the RIE etched $200{\mu}m$ deep via profile, at high etch rate. Desired etch profile was obtained at 40 m Torr pressure, 950 W coil power, 90W platen power with an etch rate ${\sim}4{\mu}m$/min and via etch yield >90% over a 3-inch wafer, using $24{\mu}m$ thick photoresist mask. The etch uniformity and reproducibility obtained for the process were better than 4%. The metallized via-hole dc resistance measured was ${\sim}0.5{\Omega}$ and via inductance value measured was $\sim$83 pH.

• Proceedings of the IEEK Conference
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• 2009.05a
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• pp.228-230
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• 2009

Lane extraction is basically required for a driving car to understand its external road environments via a camera. In this paper, a lane extraction method using "Sobel Intensity Profile" is described. The Sobel intensity profile is obtained using only vertical edge components of Sobel edge outputs, and used to yield fitted lines for lanes. The RANAC algorithm is applied to fit lines using only inliers. Experimental results have shown the reliability of the proposed lane extraction method.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.6 no.2
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• pp.43-52
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• 2002

By the use of Taylor's expansion formula with the integral remainder, an accurate approximation for the fiber refractive index profile is given.

• Korea-Australia Rheology Journal
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• v.21 no.3
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• pp.149-153
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• 2009

Profile development of the melt spinning process of poly(ethylene terephthalate) (PET) was simulated by a numerical method under the consideration of two constitutive equations of Newtonian and upper convected Maxwell (UCM) models. The viscoelastic characteristics of the polymer were considered via UCM constitutive equation that considered relaxation time as a function of temperature and molecular weight. The UCM model predicted the diameter profile better than the Newtonian, while velocity development was slower than the Newtonian model. Viscoelasticity played an important role in accurately predicting diameter profile. However, even though neck-like deformation was observed in the UCM model, the exact position of the deformation under high speed spinning was not obtained.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1028-1034
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• 2010

In the development of 3D package, through silicon via (TSV) formation technology by using deep reactive ion etching (DRIE) is one of the key processes. We performed the Bosch process, which consists of sequentially alternating the etch and passivation steps using $SF_6$ with $O_2$ and $C_4F_8$ plasma, respectively. We investigated the effect of changing variables on vias: the gas flow time, the ratio of $O_2$ gas, source and bias power, and process time. Each parameter plays a critical role in obtaining a specified via profile. Analysis of via profiles shows that the gas flow time is the most critical process parameter. A high source power accelerated more etchant species fluorine ions toward the silicon wafer and improved their directionality. With $O_2$ gas addition, there is an optimized condition to form the desired vertical interconnection. Overall, the etching rate decreased when the process time was longer.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.191-192
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• 2006

The deformation under radial pressure of rectangular dies for metal powder compaction has been investigated by FEM. The explored variables have been: aspect ratio of die profile, ratio between diagonal of the profile and die height, insert and ring thickness, radius at die corners, interference, different insert materials, i. e. conventional HSS, HSS from powders, cemented carbide (10% Co). The analyses have ascertained the unwanted appearance of tensile normal stress on brittle materials, also "at rest", and even some dramatic changes of stress patterns as the die height increases with respect to the rectangular profile dimensions. Different materials behave differently, mainly due to difference of thermal expansion coefficients. Profile changes occur when the dies are heated up to the temperature required for warm compaction. The deformation patterns depend on compaction temperature and thermal expansion coefficients.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.8
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• pp.855-861
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• 2011

We predict the rolled-strip profile for a 6-high mill using thin rolling theory and a numerical model. In the numerical model, we calculate the distributions of the contact pressures between the rolls and the rolling pressure between the strip and the work roll in the transverse direction using the geometric structure of the 6-high mill and the boundary conditions. We determine the distribution of the rolling pressure in the rolling direction via a thin-foil rolling model using Fleck's theory. We calculate the three-dimensional elastic deformation of the work roll using the pressures of the width and rolling directions. We then obtain the three-dimensional strip profile via the elastic deformation of the work roll during the rolling process. The profile is verified by a thin cold-rolling test and FE simulation.

• Computers and Concrete
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• v.15 no.6
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• pp.951-972
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• 2015

The focus of the present study is to investigate both local and global behaviour of a precast concrete sandwich panel. The selected prototype consists of two reinforced concrete layers coupled by a system of cold-drawn steel profiles and one intermediate layer of insulating material. High-definition nonlinear finite element (FE) models, based on 3D brick and 2D interface elements, are used to assess the capacity of this technology under shear, tension and compression. Geometrical nonlinearities are accounted via large displacement-large strain formulation, whilst material nonlinearities are included, in the series of simulations, by means of Von Mises yielding criterion for steel elements and a classical total strain crack model for concrete; a bond-slip constitutive law is additionally adopted to reproduce steel profile-concrete layer interaction. First, constitutive models are calibrated on the basis of preliminary pull and pull-out tests for steel and concrete, respectively. Geometrically and materially nonlinear FE simulations are performed, in compliance with experimental tests, to validate the proposed modeling approach and characterize shear, compressive and tensile response of this system, in terms of global capacity curves and local stress/strain distributions. Based on these experimental and numerical data, the structural performance is then quantified under various loading conditions, aimed to reproduce the behaviour of this solution during production, transport, construction and service conditions.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.632-634
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• 2012

In order for the connection to the wireless network from the list of priorities of the wireless AP to AP profile automatic connection by selecting the preferred method to register a profile, which is determined at the time of the change, the user does not respond to the demands of the part. In this study, the frequency of the user's access in accordance with the wireless AP, and by creating a profile, the user needs to meet with regard to network access adaptive research.