• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.7
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• pp.575-580
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• 2007

A 16 Mb 1T1C FeRAM device was integrated with BLT capacitors. But a lot of cells were failed randomly during the measuring the bit-line signal distribution of each cell. The reason was revealed that the grain size and orientation of the BLT thin film were severely non-uniform. And the grain size and orientation were severely affected by the process conditions of post heat treatment, especially nucleation step. The optimized annealing temperature at the nucleation step was $560^{\circ}C$. The microstructure of the BLT thin film was also varied by the annealing time at the step. The longer process time showed the finer grain size. Therefore, the uniformity of the grain size and orientation could be improved by changing the process conditions of the nucleation step. The FeRAM device without random bit-fail cell was successfully fabricated with the optimized BLT capacitor and the sensing margin in bit-line signal distribution of it was about 340 mV.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.12
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• pp.800-805
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• 2017

Randomly patterned and wet chemical etching processes were used to treat anti-glare of display cover glasses. The surface and optical properties of grain size and surface morphology controlled by randomly patterned etching and wet chemical solution etching were investigated. The surface morphology and roughness of the etched samples were examined using a spectrophotometer and a portable surface roughness (Ra) measuring instrument, respectively. The gloss caused by reflection from the glass surface was measured at $60^{\circ}$ using a gloss meter. The surface of the sample etched by the doctor-blade process was more uniform than that obtained from a screen pattern etching process at gel state etching process of the first step. The surface roughness obtained from the randomly patterned etching process depended greatly on the mesh size, which in turn affected the grain size and pattern formation. The surface morphology and gloss obtained by the etching process in the second step depended primarily on the mesh size of the gel state etching process of the first step. In our experimental range, the gloss increased on decreasing the grain size at a lower mesh size for the first step process and for longer reaction times for the second step process.

• Journal of Powder Materials
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• v.8 no.2
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• pp.131-135
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• 2001

The ferroelectric properties of barium titanate strongly depend on its microstructure, in particular, grain size and distribution. During sintering, $BaTiO_3$ usually exhibits abnormal grain growth, which deteriorates considerably the ferroelectric properties. A typical technique to suppress the abnormal grain growth is the addition of dopants. Dopant addition, however, affects the ferroelectric properties and thus limits the application of $BaTiO_3$. Here, we report a simple but novel technique to prevent the abnormal grain growth of $BaTiO_3$ and to overcome the limitation of dopant use. The technique consists of stepwise sintering in a reducing atmosphere and in an oxidizing atmosphere. The materials prepared by the present technique exhibit uniform grain size and high dielectric properties. The technique should provide opportunities of having $BaTiO_3$-based materials with superior ferroelectric properties.

• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.93-96
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• 2017

The structural, electrical and optical properties of Ti thin films fabricated by dual magnetron sputtering were investigated under various film thicknesses. The fabricated Ti thin films exhibited uniform surfaces, crystallinity, various grain sizes, and with various film thicknesses. Also, the crystallinity and grain size of the Ti thin films increased with the increase of film thickness. The electrical properties of Ti thin films improved with the increase of film thickness. The results showed that the performance of TCO-less DSSC critically depended on the film thickness of the Ti working electrodes, due to the conductivity of Ti thin film. However, the maximum conversion efficiency of TCO-less DSSC was exhibited at the condition of 100 nm thickness due to the surface scattering of photons caused by the variation of grain size.

• Journal of the Korean Society for Heat Treatment
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• v.31 no.2
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• pp.56-62
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• 2018

Many researchers have studied on the precipitation control after solution treatment to improve the damping capacity without decreasing the strength. However, studies on the damping capacity and microstructure changes after deformation in the solid solution strengthening alloys were inadequate, such as the Al-Zn series magnesium alloys. Therefore, in order to investigate the effect of annealing condition on microstructure change and damping a capacity of AZ61 magnesium alloy. In this study, it was confirmed that the microstructure changes affect the damping capacity and hardness when annealed AZ61 alloy. AZ61 magnesium alloy was rolled at $400^{\circ}C$ with rolling reduction of 30%. These specimens were annealed at $350^{\circ}C$ to $450^{\circ}C$ for 30-180 minutes. After annealing, microstructure was observed by using optical microscopy, and damping capacity was measured by using internal friction measurement machine. Hardness was measured by Vickers hardness tester under a condition of 0.3 N. In this study, static recrystallization was observed regardless of the annealing conditions. In addition, uniform equiaxed grain structure was developed by annealing treatment. Hardness is decreased with increasing grain size. This is associated with Hall-Petch equation and static recrystallization. In case of damping capacity, bigger grain size show the larger damping capacity.

• Transactions of Materials Processing
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• v.9 no.4
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• pp.389-394
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• 2000

The studies on gram size refinement for rheocast processing of hypereutectic Al-18%Si alloys have been investigated in the present study. To increase the efficiency of mechanical stirring, sieve type stirrer are newly designed and implemented for rheocasting of hypereutectic Al-18%Si alloy. Mechanical stirring of semi-solid slurry by using sieve type mechanical stirrer results in morphological changes of the primary Si particles, from angular rod shape to near spherical shape and uniform distribution of proeutectic Si. The remarkable spheroidization of Primary Si Particles and distributional uniformity of proeutectic Si show well the efficiency of sieve type mechanical stirring method which can accelerate the coalescence-fracture-wear of the individual particles by strong turbulent flow between lattices during rotation of sieve type stirrer.

• Korean Journal of Materials Research
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• v.28 no.12
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• pp.702-708
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• 2018

This study deals with the effect of microstructure factors on the strain aging properties of API X70 pipeline steels with different microstructure fractions and grain sizes. The grain size and microstructure fraction of the API pipeline steels are analyzed by optical and scanning electron microscopy and electron backscatter diffraction analysis. Tensile tests before and after 1 % pre-strain and thermal aging treatment are conducted to simulate pipe forming and coating processes. All the steels are composed mostly of polygonal ferrite, acicular ferrite, granular bainite, and bainitic ferrite. After 1 % pre-strain and thermal aging treatment, the tensile test results reveal that yield strength, tensile strength and yield ratio increase, while uniform elongation decreases with an increasing thermal aging temperature. The increment of yield and tensile strengths are affected by the fraction of bainitic ferrite with high dislocation density because the mobility of dislocations is inhibited by interaction between interstitial atoms and dislocations in bainitic ferrite. On the other hand, the variation of yield ratio and uniform elongation is the smallest in the steel with the largest grain size because of the decrease in the grain boundary area for dislocation pile-ups and the presence of many dislocations inside large grains after 1 % pre-strain.

• Journal of the Korean Ceramic Society
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• v.43 no.11 s.294
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• pp.728-733
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• 2006

The equilibrium or growth shape of ceramic materials is classified largely into two categories according to the thermodynamic conditions imposed. One is a polyhedral shape where the surface free energy is anisotropic, and the other a spherical shape where the surface free energy is isotropic. In the case of grains with a polyhedral shape of anisotropic surface free energy, socalled abnormal grain growth usually takes place due to a significant energy barrier for a growth unit to be attached to the crystal surface. In the case of grains with a spherical shape of isotropic surface free energy, however, normal grain growth with a uniform size distribution takes place. In this contribution, the state-of-the-art of our current understanding of the relationship between the crystal shape and the microstructure evolution during the sintering of ceramic materials in the presence of a liquid phase was discussed.

• Journal of the Korean Ceramic Society
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• v.32 no.1
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• pp.1-10
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• 1995

Effects of calcination temperature on microstructure and electric-magnetic properties of Mg-ferrite were investigated. As the calcination temperature increase, the green density and the sintered density increase due to the enhancement of densification of calcined powder. The grain size in the sintered ferrite increases with increasing the calcination temperatures from 800 to 100$0^{\circ}C$, but decreases from 1000 to 120$0^{\circ}C$. The resistivity decreases with increasing the calcination temperatures from 800 to 110$0^{\circ}C$, but increases from 1100 to 120$0^{\circ}C$ due to the microstructure which consists of small, uniform grian size and pores at grain boundaries. Magnetization increases slightly due to the increasement of the sintered density while Curie temperature is almost constant regardless of calcination temperatures.

• Journal of Sensor Science and Technology
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• v.5 no.1
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• pp.71-77
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• 1996

Considering that polycrystalline silicon, a structural material of the micromachining, is affected by a sacrificial oxide layer, the poly-oxide obtained by the thermal oxidation of polycrystalline silicon is newly proposed and estimated as the sacrificial oxide layer. The grain size of the polycrystalline silicon grown on the poly-oxide is larger than that of poly crystalline silicon grown on the conventional sacrificial oxide layer. As a result of XRD, increase of (111) textures and formation of additional (220) textures are observed on the polycrystaIline silicon deposited on the poly-oxide. Also, the polycrystalline silicon grown on the poly-oxide represents small and uniform stress.