2D and 3D Topology Optimization with Target Frequency and Modes of Ultrasonic Horn for Flip-chip Bonding (플립칩 접합용 초음파 혼의 목표 주파수와 모드를 고려한 2차원 및 3차원 위상최적화 설계)
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- Transactions of the Korean Society for Noise and Vibration Engineering
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- v.23 no.1
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- pp.84-91
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- 2013