• Journal of Welding and Joining
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• v.19 no.3
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

• Journal of the Korean Wood Science and Technology
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• v.26 no.1
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• pp.14-18
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• 1998

A low density polyethylene(LDPE) was examined as an additive in phenol-formaldehyde(PF) resin adhesive for bonding radiata pine plywood. The LDPE was supplied by the commercial manufacturer. The LDPE was compared to a commercial filler commonly used in structural plywood adhesives in the United States. The adhesive mixes were made by following the recommended procedure of Georgia-Pacific Resins Inc.. using plywood-type PF resin. A total of 48 three-ply plywoods. 6.3 mm nominal thickness and 30 by 30 em in size, were made at two press times (4 and 5 min). two press temperatures (150 and $160^{\circ}C$) and 30 minute assembly times for four adhesive mixing types. Evaluations of the LDPE addition were carried out by performance tension shear tests after two cycle boil aging tests on plywood per the U.S. Product Standard PS I-83. After accelerated-aging tests. plywoods were exhibited no delamination. The test results included tension shear strength and estimated wood failure values. The plywood test results support the use of polyethylene as an additive in plywood adhesives.

• Journal of the Korean Society for Heat Treatment
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• v.6 no.1
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• pp.9-16
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• 1993

To investigate the properties of diffusion bonding of 7050 Al alloy, the diffusion bonding joints have been produced in self-made diffusion bonding hot-press which admits a defined application of the bonding pressure during the heating phase and also rapid cooling after the bonding process with various bonding condition. The strength of the bond increases with increasing the bonding time and temperature. Shear test at toom temperature showed that high strength up to 70% that of parent metal (320 MPa), 220 MPa for the specimen bonded 14 hr at $560^{\circ}C$, with 3 MPa. In this case, however, there is large deformation more than 20% reduction in thickness. The results were correlated with joint characteristics found by optical microstructure and by fractography by SEM. When the strengths of the bonds are more than 50% that of parent metal, a great deal of dimples stretched along the direction of shear stress are observed over the fractured surface of the bond. On the microstructure of the bond line, initial mophology of the bond line disapeared for the grain boundary migration with increasing the bonding time.

• Journal of the Korean Wood Science and Technology
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• v.26 no.3
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• pp.48-52
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• 1998

Residues such as walnut, pinenut and peanut shells were used as a filler in adhesive for bonding radiata pine plywood. The nutshell residues were prepared by simply drying to 8% moisture content and grinding the dry material using a laboratory Wiley mill with a $75{\mu}m$ (200 mesh) screen. The nutshells residues were compared to a commercial filler commonly used in adhesives by the structural plywood and laminated veneer lumber industry in the United States. The adhesive mixes were made by following the recommended procedure of Georgia-Pacific Resins, Inc., using phenol-formaldehyde resin. For each filler type, three-ply plywoods, 6 mm nominal thickness and 30 by 30 cm in size, were fabricated at two press times (4 and 5 min) and around 30 minute assembly time. Evaluations of the nutshell residues were carried out by tension shear tests after cyclic boil tests on plywood. The results of the performance test included tension shear strength and wood failure. All plywoods made with the nutshell fillers were comparable to those made with the control filler. These results indicate that nutshell residues would be suitable as filler for plywood adhesives.

• Journal of Surface Science and Engineering
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• v.36 no.5
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• pp.386-392
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• 2003

The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

• Journal of Korean Association for Spatial Structures
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• v.12 no.4
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• pp.47-56
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• 2012

This paper describes the structural design and optimization of sinusoidally corrugated web girder by using EUROCODE (EN 1993-1-5). The optimum design methodology and characteristics of the optimal cross-section are discussed. We investigate a shear buckling and the concerned standards for corrugated web and explain the equations to obtain a critical stress according to buckling type. In order to perform optimization, we consider an objective function as minimum weight of the girder and use the constraint functions as slenderness ratio and stresses of flanges as well as corrugated web and deflection. Genetic Algorithm is adopted to search a global optimum solution for this mathematical model. For numerical example, the clamped girder under the concentrated load is considered, while the optimum cross-sectional area and design variables are analyzed. From the results of the adopted example, the optimum design program of the sinusoidally corrugated web girder is able to find the suitable solution which satisfied a condition subject to constraint functions. The optimum design shows the tendency to decrease the cross-sectional area with the yielding strength increase and increase the areas with load increase. Moreover, the corrugated web thickness shows a stable increase concerning the load.

• Structural Engineering and Mechanics
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• v.66 no.2
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• pp.249-262
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• 2018

In this paper, reaction of functionally graded (FG) thick nanoplates resting on a viscoelastic foundation to a moving nanoparticle/load is investigated. Nanoplate is assumed to be thick by using second order shear deformation theory and small-scale effects are taken into account in the framework of Eringen's nonlocal theory. Material properties are varied through the thickness using FG models by having power-law, sigmoid and exponential functions for material changes. FG nanoplate is assumed to be on a viscoelastic medium which is modeled using Kelvin-Voight viscoelastic model. Galerkin, state space and fourth-order Runge-Kutta methods are employed to solve the governing equations. A comprehensive parametric study is presetned to show the influence of different parameters on mechanical behavior of the system. It is shown that material variation in conjunction with nonlocal term have a significant effect on the dynamic deformation of nanoplate which could be used in comprehending and designing more efficient nanostructures. Moreover, it is shown that having a viscoelastic medium could play an important role in decreasing these dynamic deformations. With respect to the fresh studies on moving atoms, molecules, cells, nanocars, nanotrims and point loads on different nanosctructures using scanning tunneling microscopes (STM) and atomic force microscopes (AFM), this study could be a step forward in understanding, predicting and controlling such kind of behaviors by showing the influence of the moving path, velocity etc. on dynamic reaction of the plate.

• International Journal of Advanced Culture Technology
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• v.3 no.1
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• pp.145-152
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• 2015

The article aims to apply a friction stir spot welding for producing the lap joint between AA5052 aluminum alloy and C11000 copper alloy. The dimension of the materials was 100 mm in length, 30 mm in width and 1.0 mm in thickness. The copper plate was set overlap the aluminum plate by 30 mm. The welding parameter was the rotating speed of 2500-4000 rpm, the pin inserting rate of 2-8 mm/min and the holding time of 6 sec. The mechanical properties test and the microstructure investigation were performed to evaluate the lap joint quality. The summarized results are as follows. The friction stir spot welding could produce effectively the lap joint between AA5052 and C11000 copper. Increase of the rotating speed and holding time directly affected to decrease the tensile shear strength of the lap joint. The optimized welding parameters in this study that indicated the tensile shear strength of 864 N was the rotating speed of 3500 rpm, the pin inserting rate of 6 mm/min and the holding time of 4sec. The experimental results also showed that the hardness of the weld metal was lower than that of the base materials.

• Journal of Ship and Ocean Technology
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• v.4 no.2
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• pp.38-57
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• 2000

This paper deals with reliability analysis of specially orthotropic plates subjected to transverse lateral pressure loads by using Monte Carlo simulation method. The plates are simply supported around their all edges and have a low short span to plate depth ratio with rectangular plate shapes. Various levels of reliability analyses of the plates are performed within the context of First-Ply-Failure(FPF) analysis such as ply-/laminate-level reliability analyse, failure tree analysis and sensitivity analysis of basic design variables to estimated plate reliabilities. In performing all these levels of reliability analyses, the followings are considered within the Monte Carlo simulation method: (1) input parameters to the strengths of the plates such as applied transverse lateral pressure loads, elastic moduli, geometric including plate thickness and ultimate strength values of the plates are treated as basic design variables following a normal probability distribution; (2) the mechanical responses of the plates are calculated by using simplified higher-order shear deformation theory which can predict the mechanical responses of thick laminated plates accurately; and (3) the limit state equations are derived from polynomial failure criteria for composite materials such as maximum stress, maximum strain, Tsai-Hill, Tsai-Wu and Hoffman.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.