• Title/Summary/Keyword: thermal-cycling

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Prediction of Thermal Fatigue Life on $\mu$BGA Solder Joint Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 $\mu$BGA Solder접합부의 열피로 수명예측)

  • 김연성;김형일;김종민;신영의
    • Journal of Welding and Joining
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    • v.21 no.3
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    • pp.92-98
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    • 2003
  • This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

Improvement of Reliability of COG Bonding Using In, Sn Bumps and NCA (NCA 물성에 따른 극미세 피치 COG (Chip on Glass) In, Sn 접합부의 신뢰성 특성평가)

  • Chung Seung-Min;Kim Young-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.2 s.39
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    • pp.21-26
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    • 2006
  • We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

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Cracking Near a Hole on a Heat- Resistant Alloy Subjected to Thermo-Mechanical Cycling (열 및 기계적 반복하중 하의 내열금속 표면 홀 주변 산화막의 변형 및 응력해석)

  • Li, Feng-Xun;Kang, Ki-Ju
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.9
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    • pp.1227-1233
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    • 2010
  • In the hot section of a gas turbine, the turbine blades were protected from high temperature by providing a thermal barrier coating (TBC) as well as by cooling air flowing through internal passages within the blades. The cooling air then passed through discrete holes on the blade surface, creating a film of cooling air that further protects the surface from the hot mainstream flow. The holes are subjected to stresses resulting from the lateral growth of thermally grown oxide, the thermal expansion misfit between the constituent layers, and the centrifugal force due to high-speed revolution; these stresses often result in cracking. In this study, the deformation and cracks occurring near a hole on a heat-resistant alloy subjected to thermo-mechanical cycling were investigated. The experiment showed that cracks formed around the hole depending on the applied stress level and the number of cycles. These results could be explained by our analytic solution.

Enhancement of Electrochemical Activity of Ni-rich LiNi0.8Mn0.1Co0.1O2 by Precisely Controlled Al2O3 Nanocoatings via Atomic Layer Deposition

  • Ramasamy, Hari Vignesh;Sinha, Soumyadeep;Park, Jooyeon;Gong, Minkyung;Aravindan, Vanchiappan;Heo, Jaeyeong;Lee, Yun-Sung
    • Journal of Electrochemical Science and Technology
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    • v.10 no.2
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    • pp.196-205
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    • 2019
  • Ni-rich layered oxides $Li(Ni_xCo_yMn_z)O_2$ (x + y + z = 1) have been extensively studied in recent times owing to their high capacity and low cost and can possibly replace $LiCoO_2$ in the near future. However, these layered oxides suffer from problems related to the capacity fading, thermal stability, and safety at high voltages. In this study, we use surface coating as a strategy to improve the thermal stability at higher voltages. The uniform and conformal $Al_2O_3$ coating on prefabricated electrodes using atomic layer deposition significantly prevented surface degradation over prolonged cycling. Initial capacity of 190, 199, 188 and $166mAh\;g^{-1}$ is obtained for pristine, 2, 5 and 10 cycles of ALD coated samples at 0.2C and maintains 145, 158, 151 and $130mAh\;g^{-1}$ for high current rate of 2C in room temperature. The two-cycle $Al_2O_3$ modified cathode retained 75% of its capacity after 500 cycles at 5C with 0.05% capacity decay per cycle, compared with 46.5% retention for a pristine electrode, at an elevated temperature. Despite the insulating nature of the $Al_2O_3$ coating, a thin layer is sufficient to improve the capacity retention at a high temperature. The $Al_2O_3$ coating can prevent the detrimental surface reactions at a high temperature. Thus, the morphology of the active material is well-maintained even after extensive cycling, whereas the bare electrode undergoes severe degradation.

Comparison of fracture strength, surface hardness, and color stain of conventionally fabricated, 3D printed, and CAD-CAM milled interim prosthodontic materials after thermocycling

  • Mesut Yildirim;Filiz Aykent;Mahmut Sertac Ozdogan
    • The Journal of Advanced Prosthodontics
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    • v.16 no.2
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    • pp.115-125
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    • 2024
  • PURPOSE. The purpose of this in vitro study was to investigate the fracture resistance, surface hardness, and color stain of 3D printed, CAD-CAM milled, and conventional interim materials. MATERIALS AND METHODS. A total of 80 specimens were fabricated from auto polymerizing polymethyl methacrylate (PMMA), bis-acryl composite resin, CAD-CAM polymethyl methacrylate resin (milled), and 3D printed composite resin (printed) (n = 20). Forty of them were crown-shaped, on which fracture strength test was performed (n = 10). The others were disc-shaped specimens (10 mm × 2 mm) and divided into two groups for surface hardness and color stainability tests before and after thermal cycling in coffee solution (n = 10). Color parameters were measured with a spectrophotometer before and after each storage period, and color differences (CIEDE2000 [DE00]) were calculated. The distribution of variables was measured with the Kolmogorov Smirnov test, and one-way analysis of variance (ANOVA), Tukey HSD, Kruskal-Wallis, Mann-Whitney U tests were used in the analysis of quantitative independent data. Paired sample t-test was used in the analysis of dependent quantitative data (P < .05). RESULTS. The highest crown fracture resistance values were determined for the 3D printed composite resin (P < .05), and the lowest were observed in the bis-acryl composite resin (P < .05). Before and after thermal cycling, increase in mean hardness values were observed only in 3D printed composite resin (P < .05) and the highest ΔE00 value were observed in PMMA resin for all materials (P < .05). CONCLUSION. 3D printing and CAD-CAM milled interim materials showed better fracture strength. After the coffee thermal cycle, the highest surface hardness value was again found in 3D printing and CAD-CAM milled interim samples and the color change of the bis-acryl resin-based samples and the additive production technique was higher than the PMMA resin and CAD-CAM milled resin samples.

Poly(Imide) Separator Functionalized by Melamine Phosphonic Acid for Regulating Structural and Thermal Stabilities of Lithiumion Batteries

  • Ye Jin Jeon;Juhwi Park;Taeeun Yim
    • Journal of Electrochemical Science and Technology
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    • v.15 no.3
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    • pp.365-372
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    • 2024
  • As the energy density of lithium-ion batteries (LIBs) continues to increase, various separators are being developed to with the aim of improving the safety performance. Although poly(imide) (PI)-based separators are widely used, it is difficult to control their pore size and distribution, and this may further increase the risk associated. Herein, a melamine phosphonic acid (MP)-coated PI separator that can effectively control the pore structure of the substrate is suggested as a remedy. After the MP material is embedded into the PI separator with a simple one-step casting process, it effectively clogs the large pores of the PI separator, preventing the occurrence of internal short circuits during charging. It is anticipated that the MP material can also suppress rapid thermal runaway upon cycling due to its ability to reduce the internal temperature of the LIB cell caused by the desirable endothermic behavior around 300℃. According to experiments, the MP-coated PI separator not only decreases the thermal shrinkage rate better than commercial poly(ethylene) (PE) separators but also exhibits a desirable Gurley number (109.6 s/100 cc) and electrolyte uptake rate (240%), which is unique. The proposed separator is electrochemically stable in the range 0.0-5.0 V (vs. Li/Li+), which is the typical working potential of conventional electrode materials. In practice, the MP-coated PI separator exhibits stable cycling performance in a graphite-LiNi0.83Co0.10Mn0.07O2 full cell without an internal short circuit (retention: 90.3%).

Simnlation of a Thermal Behavior in Solar Heating and Cooling System with respect to Demand Room Temperature (실내 설정온도에 따른 태양열 냉난방 시스템의 동적 거동 해석)

  • Jang, H.Y.;Lee, S.B.;Chung, K.T.;Suh, J.S.
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.3446-3451
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    • 2007
  • The thermal behavior of a building in response to heat input from an active solar space heating system is analysed to determine the effect of the variable storage tank temperature on the cycling rate, on and off temperature of a heating cycle and on the comfort characteristics of room air temperature. A computer simulation of the system behavior has been performed and verified by comparisons with various parameters. Especially, this study is focused on the effect of the system's performance when subjected to dynamic cooling loads. The heat input to the absorption system is provided by an array of solar collectors that coupled to a thermal storage tank.

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Thermo-Mechanical Fatigue Analysis of Ribbon Wire/Ag Electrode Interfaces for PV Module

  • Park, No-Chang;Hong, Won-Sik;Han, Chang-Un;Kim, Dong-Hwan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.48.1-48.1
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    • 2011
  • In this presentation, We monitored weather data, such as global irradiance, ambient temperature, temperature of PV module, relative humidity and windspeed for 2 years, for determining accelerated test condition. then, we determined the temperature limit of accelerated test through weather data and FEM analysis. Detailed procedures will be summarized in this work. After analysing outdoor stress such as thermal stress, we decided main failure modes and mechanisms of PV module, especially solder joint of ribbon wire. we carried out the measurement of material properties such as thermal expansion coefficient for planning of accelerated test. we designed accelerated test based on FEM analysis results. we carried out thermal cycling test with 1 cell mini module for 3 months. We monitored the change of electrical performance every 1 week such as Voc, Isc, Pmax, etc. and then, we analized the ribbon wire/electrode intefaces. Detailed results will be summarized in this work.

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A Study on Optimal Design of Underfill for Flip Chip Package Assemblies (플립칩 어셈블리의 언더필 최적설계에 관한 연구)

  • Lee, Seon-Byeong;Kim, Jong-Min;Lee, Seong-Hyeok;Sin, Yeong-Ui
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.150-152
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    • 2007
  • It has been known that the underfilling technique is effective in reducing thermal and environmental stress concentration at solder joint in FC asscemblies. In this paper, the effect of thermomechanical properties of underfill such as coefficient of thermal expansion(CTE) and Young's modulus on reliability of FC assembly under thermal cycling was investigated. For parametric study for optimal design of underfill, finite element analyses(FEA) were performed for seven different CTEs and five different Young's modulus. The results show that the concentrated maximum stress decreases as Young's modulus of underfill increases and the CTE of underfill decreases.

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Determination of Optimum Condition in Plasma Spraying Process (플라즈마용사공정에서의 최적 조건 결정에 관한 연구)

  • 최경수;박동화
    • Journal of the Korean Ceramic Society
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    • v.33 no.2
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    • pp.155-162
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    • 1996
  • A Taguchi methodology study of the plasma spraying thermal barrier coating (TBC) layer is presented. The experiment parameters were designed by a L8-style orthogonal arrays approach. A Taguchi analysis was conduc-ted through the results of the coating properties which were affected by plasma spraying parameters. Zirconia (partially stbilized with ytrria: PSZ) was sprayed on TiAl intermetallic compound substrates, The coating layer was characterized by thickness microstructure and porosity using SEM and Image analyzer. The coating quali-ties are discussed with respect to thermal barrier effect thermal cycling test6 and adhesion strength test. An optimum condition of plasma spraying process which are derived from the Taguchi analysis could be found for high quality TBC.

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