• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.1-7
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• 2007

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing of thin polymer films into nanocavities during the thermal NIL has been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality. The simulations have been performed within the viscoelastic plateau region and the stress relaxation effect has been taken into account.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.273-276
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• 2008

Thermoplastic resin takes place stress relaxation and creep according to temperature and time. In room temperature, time dependent deformation (TDD) of polymer was carried out at previous study. In this study, it evaluates time dependent deformation to relate temperature. Nanoscale indents can be used as cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. Therefore, it is important to control pattern depth for change of indent depth by creep when using Nanoindenter. For evaluating TDD at high temperature, it is occurred thermal-nanoindentation test by changing hold time at maximum load. Temperature is putted at $90^{\circ}C$, hold time at maximum loads are putted at 1, 10, 50, 100, 200, 300 and 500s.

• Journal of Electrical Engineering and Technology
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• v.12 no.1
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• pp.302-309
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• 2017

The ageing of XLPE cable insulation will lead to the accelerating accumulation of space charge, which will greatly affect the safe operation of the HVDC cable. In order to investigate the influence of different ageing modes on the space charge distribution of the HVDC cable, thermal stressed, electrical stressed and electro-thermal stressed endurance tests were carried out on the XLPE peelings. The tested XLPE peelings were obtained from 160kV HVDC cable insulation. The endurance tests were carried at thermal stress of 363K, electrical stress of 20kV/mm DC and a combination of both. The Pulsed Electro-Acoustic (PEA) method was used to measure the space charge distribution of the samples. The influences of ageing on the trap energy distribution were analyzed based on the isothermal relaxation theory and the decay characteristics of the space charge. The results showed that thermal ageing would help to improve the crystalline morphologies of the XLPE at the early stage. The total amount of space charge decreased compared to the ones before thermal ageing. The long term of electrical stress would result in the cleavage of polymer molecule chains which would intensify the accumulation of space charge and increase the density and depth of electron traps. With a combination of electrical and thermal stress, the injection and migration of space charge were more significant. Besides, the depth and density of electron traps increased rapidly with the increase of endurance time.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.2
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• pp.240-244
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• 1999

Monolithic SiC and SiC/C functionally gradient material (FGM) layers were deposited on graphite substrates by CVD method. Temperature a profiles and thermal stress distributions in the deposited layers under the thermal shock were calculated by a commercially available software package. The designed FGM specimens were found to show an efficient relaxation of thermal stresses at the interfaces, and the specimens were intact even under a thermal shock of $\Delta$T=1600 K.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.334-339
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• 2003

The welding residual stress has on important effect on welding deformation, fatigue fracture, buckling strength, brittle fracture, etc. For the purpose of relaxation of welding residual stress, post welding heat treatment is widely used. In this paper, residual stresses were calculated by two dimensional thermal elasto-plastic analysis using finite element method. Heat transfer analysis are performed by transient analysis. Also structure analysis are carried out by of thermal-mechanical coupled analysis. Numerical analysis are used by ANSYS 5.7.

• Corrosion Science and Technology
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• v.14 no.4
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• pp.161-165
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• 2015

This paper presents an analysis of thermal stress induced along the interface between a polymeric coating layer and a steel substrate as a result of uniform temperature change. The epoxy layer is assumed to be a linear viscoelastic material and to be theromorheologically simple. The viscoelastic boundary element method is employed to investigate the behavior of interface stresses. The numerical results exhibit relaxation of interface stresses and large stress gradients, which are observed in the vicinity of the free surface. Since the exceedingly large stresses cannot be borne by the polymeric coating layer, local cracking or delamination can occur at the interface corner.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.9
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• pp.1441-1451
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• 1997

This paper addresses method which can be used for analyzing thermal stresses of a functionally graded material(FGM) using semi-analytical approach. FGM is a nonhomogeneous material whose composition changes continuously from a metal surface to a ceramic surface. An infinite one dimensional FGM plate is considered. The temperature distribution in the FGM is obtained by approximate Green's function solution. To expedite the convergence of the solutions, alternative Green's function solution is derived and shows good agreement with results from finite difference method. Thermal stresses are calculated using temperature distribution of the plate.

• Korean Journal of Food Science and Technology
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• v.26 no.2
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• pp.103-109
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• 1994

Changes in the rheological properties and the linear viscoelasticity of fish protein gel upon the thermal processing were studied by using mathematical models with stress-relaxation data. The linear viscoelasticity of surimi gel was observed in the range of the true strain $0.105{\sim}0.693$ and cross-head speed $50{\sim}250\;mm/min$ applied in this study. The results of the generalized Maxwell analysis showed that the magnitudes of elastic elements $(E,\;E_e)$ were increased, but the viscous element $({\eta}) $was decreased, as the cross-head speeds and strain levels were increased. Compared to the protein gel heated directly at $90^{\circ}C$ without preheating, the protein gel pretreated at $4^{\circ}C$ and $40^{\circ}C$ showed the higher elastic modulus, but showed different trends in the viscous component, depending on the rheological model applied. Thus, the approaching methods and curve fitting of two mathematical models of stress-relaxation to describe the viscoelastic properties of fish protein gel were discussed.

• Journal of Welding and Joining
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• v.11 no.4
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• pp.103-111
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• 1993

Recently, several high-tensile steels(e.g. 80kg and above, $2^{1/4}Cr$-1Mo)having good quality to high temperature and pressure-resistance are widely used to construct petroleum-plant and pressure vessel of heat or nuclear-power plant. However, in the steels, reheating crack at grain boundaries of the heat affected zone(HAZ) occures during post welding heat treatment(PWHT)to remove welding residual stress. In order to study theoretically the characteristics of reheating crack created by PWHT, the computer program of three-dimensional thermal-elasto-plasto-creep analysis based on finite element method are developed, and then the mechanical behavior(history of creep strain accumulation and stress relaxation, etc)of welded join in thick plate during PWTH is clarified by the numerical results.