• 한국자동차공학회논문집
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• 제22권4호
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• pp.145-151
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• 2014

Modern vehicle has a lot of ECU(Electronic Control Unit) products to control many parts such as engine, transmission, brake, body and so on. ECU quality is one of important factors related to vehicle quality and driver's safety. Based on Bath-tub curve which presents failure rate during product lifetime, we designed and applied Accelerated Run-in Test into manufacturing line by simulating stress amount to ECU and developing the required software and efficient test equipment for mass production. This test makes ECU products stressed through electrical and thermal stresses under excessive driving condition, which induce potential initial failure of components in the ECU during production. The outcome until these days proved that Acceleration Run-in Test have reduced initial failure rates and increased quality of ECU products in the field outstandingly.

• 한국의류학회지
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• 제11권2호
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• pp.91-100
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• 1987

To develop the comfortable pesticid-proof clothes, wearing trials for 7 types of existing pesticide-proof clothes were done measuring skin temperature, pulse rate, humidity and temperature of inside clothing and subjective feeling such as thermal, humid and comfort sensations at $28{\pm}1^{\circ}C$, $75{\pm}5\%$ RH, 2.3 m/sec wind speed. (Experiment 1). On the base of above results, wearing trials of 6 types of new pesticide-proof clothes and 3 types of pesticide-proof clothes as control group were done with the same method as experiment 1. (Experiment 2). The results obtained were as follows 1. Heat stress was lower in newly designed pesticide-proof clothes with mesh running shirts. 2. For the body temperature regulation, it was confirmed that 6 types of new pesticide-proof clothes made of microporous fabric were better than the others.

• Journal of Welding and Joining
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• 제32권1호
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• pp.40-46
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• 2014

Bonding technology and bonding mechanism of metal to ceramic including brazing, diffusion bonding, friction welding and etc were reviewed in this study. Various factors should be considered from a bonding design step to acquire a good bonding joint because of a large difference between metal and ceramic in crystal lattice, coefficient of thermal expansion and various properties. In addition, metal and ceramic bonding technologies are constantly being developed according to precise components, multi-function and application to harsh environment. However, improvement of bonding properties and bonding reliability also should be accompanied. Bonding of ceramics, such as $ZrO_2$, $Ti_3AlC_2$ and SiC, to metals like Ti-alloy, TiAl and steel were described in this paper.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2013년도 추계 학술논문 발표대회
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• pp.230-231
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• 2013

A fire outbreak in a reinforcement concrete structure looses the organism by different contraction and expansion of hardened cement pastes and aggregate, and causes cracks by thermal stress, leading to the deterioration of the durability. So, concrete reinforcement structure is damaged partial or whole structure system. Therefore accurate diagnosis of deterioration is needed based on mechanism of fire deterioration in general concrete structures. Fundamental information and data on the properties of concrete exposed to high temperature are necessary for accurate diagnosis of deterioration. In this study, consider case of investigation methods and repair work in fire damaged structure concrete.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2013년도 춘계 학술논문 발표대회
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• pp.16-18
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• 2013

A fire outbreak in a reinforcement concrete structure looses the organism by different contraction and expansion of hardened cement pastes and aggregate, and causes cracks by thermal stress, leading to the deterioration of the durability. So, concrete reinforcement structure is damaged partial or whole structure system. Therefore accurate diagnosis of deterioration is needed based on mechanism of fire deterioration in general concrete structures. Fundamental information and data on the properties of concrete exposed to high temperature are necessary for accurate diagnosis of deterioration. In this study, consider case of investigation methods and repair work in fire damaged structure concrete.

• 한국세라믹학회지
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• 제31권4호
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Journal of Power Electronics
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• 제15권2호
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• pp.567-575
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• 2015

An improvement in the current fed parallel resonant half bridge (CFPRHB) circuits used in fluorescent lamp electronic ballasts is provided in this paper. The CFPRHB belongs to the self-oscillating family which includes the current fed push-pull and series resonant inverters, most of which are used in instant-start applications. However, many failure modes are related to the bypass capacitor according to an analysis of failed samples. In this paper, the operating functions of the existing topology in the steady state are analyzed and the main root cause of failure modes has been found. Comparisons between the two topologies are conducted in terms of the voltage stress of the bypass capacitor as well as the thermal and performance of the ballasts to verify the advantages of the proposed topology. It is found that the improved topology is capable of enhancing the reliability and reducing the cost of products without having a negative influence on the system performance.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package)는 가전제품, 자동차, 모바일, 데스크톱 PC등을 위한 저렴한 비용의 패키지로, 리드 프레임을 사용하는 IC패키지이다. TSOP는 BGA와 flip-chip CSP에 비해 우수한 성능은 아니지만, 저렴한 가격 때문에 많은 분야에 널리 사용되고 있습니다. 그러나, TSOP 패키지에서 몰딩공정 할 때 리드프레임의 열적 처짐 현상이 빈번하게 일어나고, 반도체 다이와 패드 사이의 Au 와이어 떨어짐 현상이 이슈가 되고 있다. 이러한 문제점을 해결하기 위해서는 리드프레임의 구조를 개선하고 낮은 CTE를 갖는 재료로 대체해야 한다. 본 연구에서는 열적 안정성을 갖도록 리드프레임 구조 개선을 위해 수치해석적 방법으로 진행하였다. TSOP 패키지에서 리드프레임의 열적 처짐은 반도체와 다이 사이의 거리(198 um~366 um)에서 안티-디플렉션의 위치에 따라 시뮬레이션을 진행하였다. 안티-디플렉션으로 TSOP 패키지의 열적 처짐은 확실히 개선되는 것을 확인 했다. 안티-디플렉션의 위치가 inside(198 um)일 때 30.738 um 처짐을 보였다. 이러한 결과는 리드프레임의 열적 팽창을 제한하는데 안티-디플렉션이 기여하고 있기 때문이다. 그러므로 리드프레임 패키지에 안티-디플렉션을 적용하게 되면 낮은 CTE를 갖는 재료로 대체하지 않아도 열적 처짐을 향상시킬 수 있음을 기대할 수 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.112-112
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• 2009

In this study, the effect of a long post-deposition thermal annealing(600 and 1000 $^{\circ}C$) on the surface acoustic wave (SAW) properties of polycrystalline (poly) aluminum-nitride (AlN) thin films grown on a 3C-SiC buffer layer was investigates. The poly-AlN thin films with a (0002) preferred orientation were deposited on the substrates by using a pulsed reactive magnetron sputtering system. Experimental results show that the texture degree of AlN thin film was reduced along the increase in annealing temperature, which caused the decrease in the electromechanical coupling coefficient ($k^2$). The SAW velocity also was decreased slightly by the increase in root mean square (RMS) roughness over annealing temperature. However, the residual stress in films almost was not affect by thermal annealing process due to small lattice mismatch different and similar coefficient temperature expansion (CTE) between AlN and 3C-SiC. After the AlN film annealed at 1000 $^{\circ}C$, the insertion loss of an $IDT/AlN/3C-SiC/SiO_2/Si$ structure (-16.44 dB) was reduced by 8.79 dB in comparison with that of the as-deposited film (-25.23 dB). The improvement in the insertion loss of the film was fined according to the decrease in the grain size. The characteristics of AlN thin films were also evaluated using Fourier transform-infrared spectroscopy (FT-IR) spectra and X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM) images.

• 마이크로전자및패키징학회지
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• 제13권2호
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• pp.21-26
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• 2006

NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$와 $100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.