• Proceedings of the Computational Structural Engineering Institute Conference
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• 1998.10a
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• pp.125-132
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• 1998

In this study the fire, due to overturning of oil tanker on the bridge induced heat transfer analysis and thermal stress analysis are carried out. The results of analysis for fire history of 1 hour present very large thermal gradient near the surface. However, the temperature increase of tendon & rebar that is the main resistant member of bridge is not sufficient to change material properties. The Von-Mises yield criteria is used to calculate the depth of delamination, The depth of delamination is about 4cm at center of fire and this value is close to measured value.

• Journal of the Korean Society of Safety
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• v.21 no.6 s.78
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• pp.7-13
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• 2006

A transient heat transfer and thermal stress analysis for a brake drum of commercial vehicles have been performed by ANSYS code in the cases of single braking and the repeated braking condition. The temperature and thermal stress distributions in the brake drum under various braking conditions were obtained using a two-dimensional axisymmetric model. In case of deceleration of 0.3G with an initial vehicle speed of 60km/h, the maximum temperature in the drum was $87.6^{\circ}C$ after braking application. The maximum stress of 78.7MPa in the drum occurred at the intersection between the flange and hat under a condition in which repeated 15 cycles braking with an initial vehicle speed of 60km/h and a deceleration of 0.3G is applied to according to KS R1129. The maximum stress value is much lower than the yield strength of drum material(FC250).

• Structural Engineering and Mechanics
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• v.58 no.4
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• pp.627-639
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• 2016

The analysis of thermally induced stresses in engineering structures is a very important and necessary task with respect to design and modeling of pressurized containers, heat exchangers, aircrafts segments, etc. to prevent them from failure and improve working conditions. So, the purpose of this study is to investigate elasto-plastic thermal stresses and deformations in a thin annular plate embedded into rigid container. To this end, analytical research devoted to mathematically and physically rigorous stress/strain analysis is performed. In order to evaluate the effect of logarithmic thermal gradients, commonly applied to structures which incorporate thin plate geometries, different thermal parameters such as temperature mismatch and varying constraint temperature were introduced into the model of elastic perfectly-plastic annular plate obeying the von Mises yield criterion with its associated flow rule. The results obtained may be used in sensitive to temperature differences aircraft structures where the thermal effects on equipment must be kept in mind.

• Transactions of Materials Processing
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• v.33 no.3
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• pp.200-207
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• 2024

In this study, we developed a semi-analytical approach for the numerical analysis of residual stress in oxide scales formed on hot-rolled steels. The oxide scale, formed during the hot rolling process, experiences complex interactions due to thermal and mechanical influences, significantly affecting the material's integrity and performance. Our research focuses on integrating various stress components such as thermal stress, growth stress, and creep behavior to predict the residual stress within the oxide layer. The semi-analytical method combines analytical expressions for each stress component with numerical integration to account for their cumulative effects. Validation through instrumented indentation tests confirms the reliability of our model, which considers thermal expansion coefficient (CTE) differences, scale growth, and creep-induced stress relaxation. Our findings indicate that thermal stress resulting from CTE differences significantly impacts the overall residual stress, with growth stress contributing a compressive component during cooling, and creep behavior playing a minor role in stress relaxation. This comprehensive approach enhances the accuracy of residual stress prediction, facilitating the optimization of material design and processing conditions for hot-rolled steel products.

• Journal of the Korean Society of Industry Convergence
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• v.21 no.5
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• pp.191-195
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• 2018

By using an ANSYS product suite (CFX, Ansys Multiphysics), which is a powerful tool for multiphysics analysis of complicated physical phenomena, we performed a structural stress analysis based on fluid flow and heat transfer phenomena within a quick connect/disconnect (QC/DC) bellows system. Considering the extremely low temperatures in the QC/DC environment, an approach to the problem based on complex multi-physics phenomena, where different phenomena interact with each other, is crucial. Therefore, we use a numerical analysis technique where fluid-thermal-structural interactions are combined. In conclusion, when low temperature fluids flow inside bellows, the expected service life is conspicuously reduced due to the thermal stress caused by heat transfer. Therefore, in future research, a structure with considerably reduced thermal stress by robust design optimization will be derived.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.7
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• pp.1255-1265
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• 1992

Under uniform heat flow, the thermal stress intensity factors for the interfacial crack on a rigid cusp-type inclusion are determined by Hilbert problem expressed with complex variable. The thermal stress intensity factors are expressed in terms of the periodic function of heat flow angle. When the tip of the interfacial crack meets that of the cusp crack, the thermal stress intensity factors have singularities. The thermal stress intensity factors at the interfacial crack tip located in the distance from the cusp crack tip vary with the location of the interfacial crack tip. From the results of the analysis, the complex potential functions and the thermal stress intensity factors for the cusp-type inclusion without the interfacial crack are derived under the cusp surface boundary conditions insulated or fixed to zero relative temperature.

• 연구논문집
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• s.24
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• pp.151-159
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• 1994

The heat transfer and thermal stress analysis was performed on the ceramic core of the matrix-type recuperator. The efficiency was calculated as 34% to 65%. Triple-pass arrangement provided higher preheated air temperatures, lower thermal stresses and the increase of pressure drops. Higher temperature gradients and maximum peak stresses appeared on the corners of the ceramic core. The effect of boundary conditions was significant and the use of spring-load sealing mechanism could release thermal stresses.

• Tribology and Lubricants
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• v.10 no.2
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• pp.39-42
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• 1994

This paper deals with the distributions of the contact stress in oil seals. The distributions of the contact stress due to the temperature effects are analyzed for various values of the interference for a nitrile rubber seal. The calculated FEM results show that the relative maximum stresses occur at the contacting area against the shaft, the flex zone, and the contacting area of the garter spring grooves. Using the coupled temperature-stress FEM a nalysis, the contact force of a radial lip seal with and without the garter spring are studied as a function of shaft diameter. The calculated results of mechanical analysis show good correspondence with those of the coupled thermal-mechanical analysis method except small values of the interference. And the calculated results indicated that the thermal stresses only have a very minor influence on the deformed shape of the lip seal as the interference increases. But the coupled temperature-stress analysis will be very useful tool to predict the contact behaviors of rubber lip seals for small values of the interference.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.3
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• pp.393-404
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• 1997

SPATE(Stress Pattern Analysis by Thermal Emission) can be effectively used to analyze the stress distributions of isotropic structure under the repeated load by non-contact. In this research, the measuring method and the measuring concept of stress intensity factor of isotropic material by SPATE are suggested. The validity of the method and the concept was certified through SPATE experiment.