• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.2
• /
• pp.13-21
• /
• 2014

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

• Journal of international Conference on Electrical Machines and Systems
• /
• v.2 no.4
• /
• pp.441-446
• /
• 2013

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.21 no.3
• /
• pp.97-106
• /
• 2015

Thermal deformation of packaging materials was observed in some ready-to-eat food products for microwave use. Therefore, the deformation patterns depending on packaging types and shapes of 9 domestic and 11 foreign products after microwave heating were investigated. Among the domestic and foreign products, thermal deformations of packaging material were observed in 5 and 8 samples, respectively. Besides, thermal deformation occurred on the lid and cup body of tray filled with a spicy chicken sauce after having microwaved where previously no deformation had been observed with other food types. No consistent results of thermal deformation were obtained by the analysis of salinity, brix, pH and viscosity of RTE products for microwave heating. However, thermal deformations of packages were less found in the packages used for the RTE foods contained very high or low viscosity than those with medium viscosity. Furthermore, the degree of thermal deformations was dependent on the food composition and shape as well as package type. In order to prevent the thermal deformation of packaging materials, therefore, technological advances and further studies are required to develop the heat-resistant packaging system and to improve the non-uniformity during microwave heating of RTE foods.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.27 no.2
• /
• pp.85-90
• /
• 2021

The gamma irradiation was on to Poly(butylene sebacate-co-terephthalate) (PBSeT), Poly(butylene adipate-co-terephthalate) (PBAT), Poly(lactic acid) (PLA) and casting polypropylene (CPP) at dose levels from 0 to 50 kGy. The properties of gamma irradiated samples were analyzed using DSC, TGA, UTM and FT-IR spectra. The mechanical and thermal properties of PBSeT and PBAT after gamma irradiation were less affected than CPP. The tensile strength and elongation of PBSeT was not affected by gamma irradiation, while these of PBAT, PLA and CPP were significantly decreased at 50 kGy gamma-ray dose. The thermal stability of PBSeT, PBAT, PLA and CPP showed a similar tendency to tensile strength. The glass transition temperature(T_g) and melting temperature(T_m) of PBSeT and PBAT were not altered by increasing gamma-ray dose, while these of PLA and CPP decreased. The chemical composition of all samples was not modified by gamma irradiation, and it was confirmed by FT-IR spectra. Based on mechanical and thermal stability studies of gamma irradiation on bioplastics, tested biodegradable packaging materials showed a potential to be used in sterilization process up to 35 kGy.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.4
• /
• pp.91-95
• /
• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.21 no.3
• /
• pp.107-113
• /
• 2015

This work focused on the study of thermal properties and kinetic behavior of LDPE-nanoclay composite films. The effect of nanoclay content (0.5, 1, 3, and 5 wt%) on thermal stability and crystallization characteristics of the nanocomposites were investigated by Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). The results from endothermic curve showed that the nanoclay played an important role in the crystallization of nanocomposites by acting as nucleating agent. From exothermic curve, there was a crystallization temperature shift which was attributed to crystallization process induced by nanoclay. The TGA results showed that the addition of nanoclay significantly increased the thermal stability of LDPE matrix, which was likely due to the characteristic of layered silicates/clays dispersed in LDPE matrix as well as the formation of multilayered carbonaceous-silicate char. A well-known Coats-Redfern method was used to evaluate the decomposition activation energy of nanocomposite. It was demonstrated that introducing of nanoclay to LDPE matrix escalated the activation energy of nanocomposite decomposition resulting in thermal stability improvement.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.2
• /
• pp.23-29
• /
• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• The monthly packaging world
• /
• s.290
• /
• pp.78-79
• /
• 2017

• Journal of Korea Technical Association of The Pulp and Paper Industry
• /
• v.39 no.2 s.120
• /
• pp.45-53
• /
• 2007

When micro flute corrugated paperboards are used for food packaging, they necessarily need to meet the requirements for the distribution, transportation, and storage of food. The requirements could vary ac-cording to the contents in the packaging boxes. Microflute corrugated packaging paperboard for hot foods such as just-made coffee and hamburger requires to have a decent resistance property against high temperature. Along with a recent trend for small-quantity-multi-item upgraded packaging, semiconductor products and consumer-electronic appliances become to be packed using the environmental friendly micro flute corrugated paperboard. In this case, the electric resistance property of the microflute corrugated paperboard becomes important. This study was carried out to investigate on the thermal conductivity and electric resistance properties of micro flute corrugated paperboard.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.11a
• /
• pp.153-157
• /
• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.