• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.268-269
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• 2005

YBCO 박막형 초전도체(coated conductor) 제조를 위해서는 여러 층의 완충층이 필요하다. 현재 일반적인 완충층의 구조는 seed layer로써 $Y_2O_3$, diffusion barrier로 YSZ, capping layer로 $CeO_2$가 사용되고 있다. 특히, capping layer로 $CeO_2$는 YBCO와 lattice mismatch가 매우 우수한 산화물로 이용되고 있다 본 연구에서는 $CeO_2$ capping layer가 증착 방법에 따라 그 위에 증착되어지는 초전도층의 특성에 어떤 영향을 미치는지 연구하였다. $CeO_2$를 thermal evaporation과 PLD (pulsed laser deposition) 증착 방법으로 증착 한 후 그 위에 PLD 방법으로 YBCO를 증착하여 coated conductor의 성능을 평가하였다.

• Journal of Radiation Industry
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• 제5권1호
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• pp.95-99
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• 2011

The electrical and mechanical properties of electrode for radiation detection are very important. In general, Au electrode and CZT crystal are combined to form ohmic contacts, and the best energy resolution is shown at the Au electrode. The metal contacts are fabricated by electroless deposition method, sputtering deposition method and thermal evaporation method. The electrode fabrication is easy with use of the thermal evaporation method, while an adhesive strength is weak. Thus interface materials such as Ag, Al and Ni were investigated to overcome defects generated by the this method. The thickness of the interface material between the Au electrode and the CZT crystal was 100 Angstroms, the Au electrode with thickness of 400 Angstroms was deposited. The Al+Au electrode is shown that the results of current-voltage and radiation response are similar to results of Au electrode.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1676-1681
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• 2006

We report on Organic Vapor Phase Deposition $(OVPD^{(R)})$ an innovative deposition technology for organic light emitting device (OLED) and organic semiconductor manufacturing. The combination of $OVPD^{(R)}$ with Close Coupled Showerhead (CCS) technology results in manufacturing equipment with vast potential for cost effective manufacturing of OLED displays commercially competitive to LCD. The actual $OVPD^{(R)}$ equipment concept and design is discussed: Computational Fluid Dynamic (CFD) modeling is compared with experimental results proving the excellent controllability of the deposition process. Further other production relevant deposition properties are being reviewed e.g. high deposition rates and high organic material utilization efficiency of the $OVPD^{(R)}$ - Technology. Data from devices made by $OVPD^{(R)}$ show comparable/ superior performance to those fabricated with conventional vacuum thermal evaporation (VTE) techniques. An outlook on further potentials of $OVPD^{(R)}$ with respect to enabling advanced organic device structures is given.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제34권2호
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• pp.105-109
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• 2021

CNT fiber has been in the spotlight as a conductor, but the conductivity of CNT fibers do not match that of CNT. This study reveals that the conductivity of CNT fiber can be improved by depositing Al/Cu through vacuum evaporation. Cu is commonly used for deposition on CNT fibers. But low bonding strength of the interface between CNT and Cu could be a disadvantage. To overcome this, Al was deposited on the CNT fiber for forming aluminum carbide islands to increase the interfacial bonding strength. The conductivity characteristics were improved as the deposition time increased. The resistance was measured as a function of temperature, demonstrating that the temperature coefficient of resistance (TCR) is improved to be 241 ppm/℃ in comparison with that of as-received CNT fibers at -1,251 ppm/℃, when the CNT fibers are deposited with Al and Cu, respectively, for 90s and for 540s.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.185-190
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• 2003

In this paper, it was demonstrated that the organic thin film transistors were fabricated by the organic gate insulators with vapor deposition polymerization (VDP) processing. In order to form polyimide as a gate insulator, vapor deposition polymerization process was also introduced instead of spin-coating process, where polyimide film was co-deposited by high-vacuum thermal evaporation from 4,4'-oxydiphthalic anhydride (ODPA) and 4,4'-oxydianiline (ODA) and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and ODA, and cured at $150^{\circ}C$ for 1hr. Electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure obtained to the saturated slop in the saturation region and the subthreshold non-linearity in the triode region. Field effect mobility, threshold voltage, and on-off current ratio in $0.45\;{\mu}m$ thick gate dielectric layer were about $0.17\;cm^2/Vs$, -7 V, and $10^6\;A/A$, respectively. Details on the explanation of compared to organic thin-film transistors (OTFTS) electrical characteristics of ODPA-ODA and 6FDA-ODA as gate insulators by fabricated thermal co-deposition method.

• Proceedings of the Materials Research Society of Korea Conference
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.115-115
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• 2003

Silica nanostructures have been attached considerable attention because of theirs potential application in mesoscopic research and the potential use of large surface area structure of catalysts. SiO2 nannowire and nanorods was synthesized various methods including thermal evaporation, chemical vapor deposition (CVD), and laser ablation methods. In this experiments, SiO2 nanowire were grown using thermal evaporation method followed by VS (Vapor-Solid) growth mechanisms. Grown SiO2 nanowires were amorphous phases because of its low growth temperatures. Grown nanowires diameters were about 20-40nm at all growth conditions, but its microstructres were different by that used substrate because of it's oxygen contents.

• Korean Journal of Metals and Materials
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• 제47권8호
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• pp.466-473
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• 2009

Our group previously observed the intrinsic stress evolution of Cu thin films during deposition by changing the deposition rate. Intrinsic stress of Cu thin films, which show Volmer-Weber growth, is reported to display three unique stress stages, initial compressive, broad tensile, and incremental compressive stress. The mechanisms of the initial compressive stress and incremental compressive stages remain subjects of debate, despite intensive research inquiries. The tensile stress stage may be related to volume contraction through grain growth and coalescence to reduce over-accumulate Cu adatoms on the film surface. The in-situ intrinsic stresses behavior in Cu thin films was investigated in the present study using a multi-beam curvature measurement system attached to a thermal evaporation device. The effect of substrate surface roughness was monitored by observed the in-situ intrinsic stress behavior in Cu thin films during deposition, using $100{\mu}m$ thick Si(111) wafer substrates with three different levels of surface roughness.

• Journal of the Microelectronics and Packaging Society
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• 제6권1호
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• pp.31-37
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• 1999

In this study, the thermal property and adhesion of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu /TaN /Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature for the multilayered Cu /TaN /Si specimen which was annealed at atmospheres of $H_2$and Ar gases, respectively. The adhesion strength of Cu films was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than that of sputtered Cu film and evaporated Cu film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.317-318
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• 2008

Cu-Pc유기물 반도체를 얼 진공증착기술로 유리기판위에 40 nm 두께로 적층하였다. 상온에서 적층한 박막과 상온에서 적층한 후 $250^{\circ}C$ 이상의 온도로 후열 처리한 박막과 박막 적층 시 기판의 온도를 $250^{\circ}C$로 고정하여 적층한 박막들을 상호 비교 분석하였다. 적층된 Cu-Pc의 박막의 온도조건에 따라 X-ray diffraction(XRD)의 결정 특성이 $\alpha$-phase와 $\beta$-phase로 뚜렷이 구분되었으며， 자외선-가시광선 영역의 광 흡수도(UV-visible absorption spectra)와 field emission scanning electron microscopy(FE SEM)를 이용하여 결정성장 방향 및 표면 특성 변화를 비교조사하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.229-229
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• 2012

Adhesion of Copper film on the aluminum oxide layer formed by anodizing an aluminum plate was enhanced by applying ion beam mixing method. Forming an conductive metal layer on the insulating oxide surface without using adhesive epoxy bonds provide metal-PCB(Printed Circuit Board) better thermal conductivities, which are crucial for high power electric device working condition. IBM (Ion beam mixing) process consists of 3 steps; a preliminary deposition of an film, ion beam bombardment, and additional deposition of film with a proper thickness for the application. For the deposition of the films, e-beam evaporation method was used and 70 KeV N-ions were applied for the ion beam bombardment in this work. Adhesions of the interfaces measured by the adhesive tape test and the pull-off test showed an enhancement with the aid of IBM and the adhesion of the ion-beam-mixed films were commercially acceptable. The mixing feature of the atoms near the interface was studied by scanning electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy.