• Journal of Welding and Joining
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• v.24 no.6
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• pp.21-27
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• 2006

This study was focused on the evaluation of the thermo-mechanical board-level reliability of Pb-bearing and Pb-free surface mount assemblies. The composition of Pb-bearing solder was a typical Sn-37Pb and that of Pb-free solder used in this study was a representative Sn-3.0Ag-0.5Cu in mass %. Thermal shock test was chosen for the reliability evaluation of the solder joints. Typical $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed between both solders and Cu lead frame at the as-reflowed state, while a layer of $Cu_3Sn$ was additionally formed between the $Cu_6Sn_5$ and Cu lead frame during the thermal shock testing. Thickness of the IMC layers increased with increasing thermal shock cycles, and this is very similar result with that of isothermal aging study of solder joints. Shear test of the multi layer ceramic capacitor(MLCC) joints was also performed to investigate the degradation of mechanical bonding strength of solder joints during the thermal shock testing. Failure mode of the joints after shear testing revealed that the degradation was mainly due to the excessive growth of the IMC layers during the thermal shock testing.

• Journal of the Korean Society for Heat Treatment
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• v.12 no.4
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• pp.303-312
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• 1999

An investigation of the CrMoV rotor steel weldment which experienced by cyclic thermal aging heat treatment and as-received condition was performed. This evaluation was carried out to confirm whether this type of weldment is appropriate for the service environment in terms of microstructural examinations, microhardness measurements and tensile tests. The cyclic thermal aging heat treatment, containing continuous heating and cooling thermal cycle was programmed to simulate the real rotor service condition. The heat treatment was performed for 40 cycles(5920hrs). The results indicated that the weldment was composed of 4 different regions such as heat affected zone of the base metal, butter weld(initial weld), full thickness weld(final weld) and the base metal. The double welding process was applied to eliminate the susceptibility of reheat cracking at heat affected zone of base metal. The grain refinement at the HAZ due to the welding process could reduce the possibility of cracking susceptibility, but its tensile properties was appeared to be low due to the weld metal in as-received condition. The benefit effect, grain refinement was extended with carbides coarsening during the cyclic thermal aging heat treatment. However the poor mechanical properties of the weldment was more degraded as undergoing the heat treatment.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.7-17
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• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• The Journal of Advanced Prosthodontics
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• v.7 no.2
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• pp.108-114
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• 2015

PURPOSE. The aim of this study was to evaluate effect of different surface treatment methods on the bond strength between aged composite-resin core and luting agent. MATERIALS AND METHODS. Seventy-five resin composites and also seventy-five zirconia ceramic discs were prepared. 60 composite samples were exposed to thermal aging (10,000 cycles, 5 to $55^{\circ}C$) and different surface treatment. All specimens were separated into 5 groups (n=15): 1) Intact specimens 2) Thermal aging-air polishing 3) Thermal aging- Er:YAG laser irradiation 4) Thermal aging- acid etching 5) Thermal-aging. All specimens were bonded to the zirconia discs with resin cement and fixed to universal testing machine and bond strength testing loaded to failure with a crosshead speed of 0.5 mm/min. The fractured surface was classified as adhesive failure, cohesive failure and adhesive-cohesive failure. The bond strength data was statistically compared by the Kruskal-Wallis method complemented by the Bonferroni correction Mann-Whitney U test. The probability level for statistical significance was set at ${\alpha}$=.05. RESULTS. Thermal aging and different surface treatment methods have significant effect on the bond strength between composite-resin cores and luting-agent (P<.05). The mean baseline bond strength values ranged between $7.07{\pm}2.11$ and $26.05{\pm}6.53$ N. The highest bond strength of $26.05{\pm}6.53$ N was obtained with Group 3. Group 5 showed the lowest value of bond strength. CONCLUSION. Appropriate surface treatment method should be applied to aged composite resin cores or aged-composites restorations should be replaced for the optimal bond strength and the clinical success.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.225-230
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• 2016

Fiber Bragg grating (FBG) sensors are currently the most prevalent sensors because of their unique advantages such as ease of multiplexing and capability of performing absolute measurements. They are applied to various structures for structural health monitoring (SHM). The signal characteristics of FBG sensors under thermal loading should be investigated to enhance the reliability of these sensors, because they are exposed to certain cyclic thermal loads due to temperature changes resulting from change of seasons, when they are applied to structures for SHM. In this study, tests on specimens are conducted in a thermal chamber with temperature changes from -$20^{\circ}C$ to $60^{\circ}C$ for 300 cycles. For the specimens, two types of base materials and adhesives that are normally used in the manufacture of packaged FBG sensors are selected. From the test results, it is confirmed that the FBG sensors undergo some degree of compressive strain under cyclic thermal load; this can lead to measurement errors. Hence, a pre-calibration is necessary before applying these sensors to structures for long-term SHM.

• The Journal of Advanced Prosthodontics
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• v.10 no.6
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• pp.408-414
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• 2018

PURPOSE. This study aimed to assess the effect of non-thermal plasma on the shear bond strength of resin cements to polyetherketoneketone (PEKK) in comparison to other surface treatment methods. MATERIALS AND METHODS. Eighty PEKK discs were subjected to different surface treatments: (1) Untreated (UT); (2) Non-thermal plasma (NTP); (3) Sandblasting with $50{\mu}m$ $Al_2O_3$ particles (SB); and (4) Sandblasting + Non-thermal plasma (SB+NTP). After each surface treatment, the contact angle was measured. Surface conditioning with Visio.Link was applied in all groups after pre-treatment. RelyX Unicem resin cement was bonded onto the PEKK specimens. After fabrication of the specimens, half of each group (n=10) was initially tested, while the other half was subjected to thermocycling ($5^{\circ}C$ to $55^{\circ}C$ at 10,000 cycles). Shear bond strength (SBS) testing was performed using a universal testing machine, and failure modes were assessed using stereomicroscopy. The SBS results were analyzed statistically using one-way ANOVA followed by Tukey's post hoc test. Independent t-test was used to examine the effect of thermocycling (P<.05). RESULTS. The highest SBS values with or without thermocycling were observed with PEKK specimens that were treated with SB+NTP followed by the SB group. The lowest SBS results were observed in the UT groups. CONCLUSION. The shear bond strength between PEKK and resin cements was improved using non-thermal plasma treatment in combination with sandblasting.

• Restorative Dentistry and Endodontics
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• v.46 no.4
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• pp.54.1-54.10
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• 2021

Objectives: The purpose of this study was to quantify phase transformation after hydrofluoric acid (HF) etching at various concentrations on the surface of yttria-stabilized tetragonal zirconia polycrystal (Y-TZP), and to evaluate changes in bonding strength before and after thermal cycling. Materials and Methods: A group whose Y-TZP surface was treated with tribochemical silica abrasion (TS) was used as the control. Y-TZP specimens from each experimental group were etched with 5%, 10%, 20%, and 40% HF solutions at room temperature for 10 minutes. First, to quantify the phase transformation, Y-TZP specimens (n = 5) treated with TS, 5%, 10%, 20% and 40% HF solutions were subjected to X-ray diffraction. Second, to evaluate the change in bond strength before and after thermal cycling, zirconia primer and MDP-containing resin cement were sequentially applied to the Y-TZP specimen. After 5,000 thermal cycles for half of the Y-TZP specimens, shear bond strength was measured for all experimental groups (n = 10). Results: The monoclinic phase content in the 40% HF-treated group was higher than that of the 5%, 10%, and 20% HF-treated groups, but lower than that of TS-treated group (p < 0.05). The 40% HF-treated group showed significantly higher bonding strength than the TS, 5%, and 10% HF-treated groups, even after thermal cycling (p < 0.05). Conclusions: Through this experiment, the group treated with SiO₂ containing air-borne abrasion on the Y-TZP surface showed higher phase transformation and higher reduction in bonding strength after thermal cycling compared to the group treated with high concentration HF.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.113-119
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• 2012

The two-step water splitting thermochemical cycle is composed of the T-R (Thermal Reduction) and W-D (Water Decomposition) steps. The mechanism of this cycle is oxidation-reduction, which produces hydrogen. The reaction temperature necessary for this thermochemical cycle can be achieved by a dish-type solar thermal collector (Inha University, Korea). The purpose of this study is to validate a water splitting device in the field. The device is studied and fabricated by Kodama et al (2010, 2011). The validation results show that the foam device, when loaded with $CeO_2$ powder, was successfully achieved hydrogen production under field conditions. Through this experiment, we can analyze the characteristics of the catalyst and able to determine which is more advantageous thing to produce hydrogen compared with previous experiment that used ferrite-device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1857-1862
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• 2008

Resonant frequency tuning of micro devices is essential to achieve performance uniformity and high sensitivity. Previously reported frequency tuning methods using electrostatic force or mass deposition are not directly applicable to non-conducting polymer devices and have limitations such as dielectric breakdown or low tunable bandwidth. In this paper, thermally frequency-tunable microactuators with poly-dimethylsiloxane membranes are proposed. Permanent and/or nonpermanent frequency tunings are possible using a simple temperature control of the device. Resonant frequency and Q-factor variations of devices according to temperature change were studied using a micro heater and laser Doppler vibrometer. The initial resonant frequencies determined by polymer curing and hardening temperatures are reversibly tuned by thermal cycles. The measured resonant frequency of 9.7 kHz was tuned up by ${\sim}25%$ and Q-factor was increased from 14.5 to 27 as the micro heater voltage increased from 0 to 70 V.