• 제목/요약/키워드: thermal breakdown

검색결과 319건 처리시간 0.025초

SiC CMOS 게이트 산화막에 관한 연구 (Study of The SiC CMOS Gate Oxide)

  • 최재승;이원선;신동현;김영석;이형규;박근형
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
    • /
    • pp.29-32
    • /
    • 2001
  • In this paper, the thermal oxidation behaviors and the electrical characteristics of the thermal oxide grown on SiC are discussed. For these studies the oxide layers with various thickness were on SiC in wet $O_2$ or dry $O_2$ at l15$0^{\circ}C$ and the MOS capacitors using the 350$\AA$ gate oxide grown in wet $O_2$ were fabricated and electrically characterized. It was found from the experimental results that the oxidation rate of SiC with the Si-face and with the carbon-face were about 10% and 50% of oxidation rate of Si. The C-V measurement results of the SiC oxide showed abnormal hysterisis properties which had ever been not observed for the Si oxide. And the hysterisis behavior was seen more significant when initial bias voltage was more negative or more positive. The hysterisis property of the SiC oxide was believed to be due the substantial amount of the deep level traps to exist at the interface between the oxide and the SiC substrate. The leakage of the SiC oxide was found to be one order larger than the Si oxide, but the breakdown strength was almost equal to that of the Si oxide.

  • PDF

전력 트랜지스터의 특성에 미치는 다이아몬드상 카본 passivation 막의 효과 (Effect of diamond-like carbon film as passivation layer on characteristics of power transistor)

  • 박정호;임대순;정석구;장훈;신종한
    • 전자공학회논문지A
    • /
    • 제33A권11호
    • /
    • pp.97-104
    • /
    • 1996
  • Because of the novel characteristics such as chemical stability, hardness, electrical resistivity and thermal conductance, diamond-like carbon (DLC) film is a suitable materials for the passivation layers. For this purpose, DLC films are synthesized under various conditions and are characterized. Adhesive stregth is excellent and increased with the increase of the hydrogen gas flow rate. The resistivity of approximately 5.3X10$^{8}{\Omega}{\cdot}cm$ is measured by automatic spreading resistance probe analysis method. The thermal conductivity of DLC films is superior to that of PSG oxide and improved by increasing the hydrogen gas flow rate. The patterning techniques of the DLC films is developed using the lift-off and RIE methods to form 5${\mu}$m line. Finally, power transistor with the DLC film as passivation layer is fabricated and analyzed. The test result shows the improsved long-term stability and higher breakdown voltage.

  • PDF

급속열처리에 의한 TiN/$TiSi_2$ 이중구조막을 이용한 submicron contact에서의 전기적 특성 (The Electrical Roperties of TiN/$TiSi_2$ Bilayer Formed by Rapid Thermal Anneal at Submicron Contact)

  • 이철진;성만영;성영권
    • 전자공학회논문지A
    • /
    • 제31A권9호
    • /
    • pp.78-88
    • /
    • 1994
  • The electrical properties of TiM/TiSi$_{2}$ bilayer formed by rapid thermal anneal in NH$_{3}$ ambient after the Ti film is deposited on silicon cubstrate are investigated. N$^{+}$ contact resistance slightly increases with increasing annealing temperature with P$^{+}$ contact resistance decreases. The contact resistance of N$^{+}$ contance was less than 24[.OMEGA.] but P$^{+}$ thatn that of N$^{+}$ contact but the leakage current indicates degradation of the contact at high annealing temperature for both N$^{+}$ and contacts. The leakage current of N$^{+}$ Junction was less than 0.06[fA/${\mu}m^{2}$] but P$^{+}$ contact was 0.11-0.15[fA/${\mu}m^{2}$]. The junction breakdown voltage for N$^{+}$ junction remains contant with increasing annealing temperature while P$^{+}$ junction slightly decreases. The Electrical properties of a two step annealing are better than that of one step annealing. The Tin/TiSi$_{2}$ bilayer formed by RTA in NH$_{3}$ ambient reveals good electrical properties to be applicable at ULSI contact.

  • PDF

Spin coating 공정을 이용한 Polymethyl methacrylate (PMMA) 박막의 polymer gate dielectric layer로써의 특성평가 (Properties of Polymethyl methacrylate (PMMA) for Polymer Gate Dielectric Thin Films Prepared by Spin Coating)

  • 나문경;강동필;안명상;명인혜;강영택
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2005년도 춘계학술대회 논문집
    • /
    • pp.29-32
    • /
    • 2005
  • Poly (methyl methacrylate) (PMMA) is one of the promising representive of polymer gate dielectric for its high resistivity and sutible dielectric constant. PMMA (Mw=96700) films were prepared on p-Si by spin coating method. PMMA were coated compactively and flatly as observeed by AFM. MIS(Al/PMMA/p-Si) structure was made and capacitance-voltage (C-V) and current-voltage (I-V) measurements were done with PMMA films for different thermal treatment temperature. PMMA films were showed proper dielectric constant and breakdown voltage. Above the glass transition temperature PMMA films degraded. C-V measured at various frequencies, dielectric constant increased a little. The absence of hysteresis in the C-V characteristics, which eliminate the possibility of mobile charges in the PMMA films. The observed thermal stability, smooth surfaces, dielectric constant, I-V behavior implies PMMA formed by spin coating can be used as an efficient gate dielectric layer in OTFTs.

  • PDF

Effect of nanofillers on the dielectric properties of epoxy nanocomposites

  • Wang, Q.;Chen, G.
    • Advances in materials Research
    • /
    • 제1권1호
    • /
    • pp.93-107
    • /
    • 2012
  • Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of $SiO_2$ and $Al_2O_3$. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency range of 1 Hz - 1 MHz. The space charge behaviors were also observed by using the pulse electroacoustic (PEA) technique. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the test results were compared with those obtained from epoxy resin/nanocomposites.

ZnO Power FET 모델링에 관한 연구 (Study on Modeling of ZnO Power FET)

  • 강이구;정헌석
    • 전기전자학회논문지
    • /
    • 제14권4호
    • /
    • pp.277-282
    • /
    • 2010
  • 본 논문에서는 차세대 전력반도체인 화합물 반도체 소자중 ZnO 전력소자에 대하여 모델링을 수행하였다. 화합물 전력 반도체 소자는 와이드 밴드 갭 소자로서 열 특성이 우수해 자동차 및 계통연계형 인버터의 차세대 핵심소자로 인정받고 있다. 모델링 결과 에피 두께가 3um, 도핑농도는 $1e17cm^{-3}$일때 내압 340V 정도 얻을 수 있었으며, 관련 I-V특성 등을 평가하였다. 실제 소자로 제작된다면 300V이내의 산업 응용에 충분히 활용할 수 있을 것으로 판단된다

Biodegradable PLA-based Biocomposites with Spent Coffee Grounds as Degradation Accelerator: Hydrolytic Degradation and Characterization Research

  • Kim, Youngsan;Lim, Daekyu;Kwon, Sangwoo;Jang, Hyunho;Park, Su-il
    • 한국포장학회지
    • /
    • 제28권2호
    • /
    • pp.89-95
    • /
    • 2022
  • The goal of this study was to evaluate the effect of spent coffee grounds (SCG) biofiller on the morphological, thermal, mechanical and hydrolytic degradation characteristics of poly(lactic acid) (PLA) based biocomposites. The PLA-based biocomposite films were fabricated by using a high-viscosity kneading and hot-pressing machine. The PLA/SCG biocomposites were analyzed with SEM, DSC, TGA, UTM and hydrolytic degradation test. Aggregation in the PLA matrix is a result of increasing SCG concentrations. In the thermal properties, it was described that the cold crystallization temperature (Tcc) decreased as SCG was added to PLA. When SCG was incorporated to PLA, the degradation onset temperature (Tonset) revealed a diminish. The elastic modulus increased while tensile strength of PLA diminished as SCG was applied. Through hydrolysis analysis, the decomposition of PLA was accelerated with the addition of SCG. This research confirmed the possibility of devloping an eco-friendly packaging material with high degradability as SCG hasten the breakdown of PLA.

Direct-drive를 활용한 소형 연속 도약 로봇 및 DC모터의 열 모델을 통한 한계 분석 (Hopping Robot Using Direct-drive Method and Thermal Modeling to Analyze Motor Limitation)

  • 장명진;양선교;정광필
    • 로봇학회논문지
    • /
    • 제19권1호
    • /
    • pp.53-57
    • /
    • 2024
  • A hopping robot can move through a confined environment while overcoming obstacles. To create a small hopping robot, it must be able to generate a large amount of energy and release it at the same time. However, due to the small size of the robot, there is a limit to the size of the actuator that can be used, so it is mainly used to collect energy in an elastic element and release it at once. In this paper, we propose a small hopping robot with a simplified design by removing ancillary parts and enabling continuous hopping using only a small actuator based on a direct-drive method. In addition, repeated actuation over the rated voltage can cause thermal breakdown of the actuator. To check the safety of the actuator at high voltage, we perform modeling to predict the temperature of the actuator and verify the accuracy of the modeling through experiments.

열 저항특성을 고려한 지중송전관로 친환경 되메움재 개발 (Development of Environmentally Friendly Backfill Materials for Underground Power Cables Considering Thermal Resistivity)

  • 김대홍;오기대
    • 한국지반환경공학회 논문집
    • /
    • 제12권1호
    • /
    • pp.13-26
    • /
    • 2011
  • 지중송전케이블의 송전용량은 케이블 또는 주변지반의 최대허용온도에 좌우되기 때문에 케이블 주위 되메움재는 운영기간동안 낮은 열 저항성을 유지하여야 한다. 케이블 주위에 발생된 열은 되메움재를 통해 즉시 주위에 발산시켜 제거하여야 하며, 그렇지 않으면 통상온도($50{\sim}60^{\circ}C$)에서도 열폭주에 의한 절연파괴에 이를 수 있다. 본 논문에서는 되메움재의 열 저항을 낮추기 위한 여러 가지 방법에 대해 논하였으며, 다양한 첨가제를 사용하여 시험을 수행함으로써 열 저항 효과를 측정하였다. 연구결과, 영광 동림천 모래의 경우 상대적으로 균등한 입도분포를 나타내는 모래로써 함수비가 증가함에 따라 열저항은 감소하는 경향을 나타내고 있으며, 특히 건조상태에서의 열저항치는 매우 높은 값($260^{\circ}C-cm/watt$)을 보여주었다. 또한 진산 화강암 석분 및 모래-쇄석(A-2), 석분-쇄석 혼합재(E-1), SGFC(모래-자갈-플라이애시-시멘트 혼합재)의 경우 양호한 입도와 낮은 열저항($100^{\circ}C-cm/watt$ 건조시)을 보여주었으며, 이들 연구결과를 토대로 열저항이 낮고 환경친화적인 4가지 형태의 개선된 되메움재를 제시하였다.

지중송전관로 되메움재의 열저항 특성 (Thermal Resistivity of Backfill Materials for Underground Power Cables)

  • 김대홍;이대수
    • 한국지반공학회논문집
    • /
    • 제18권5호
    • /
    • pp.209-220
    • /
    • 2002
  • 지중송전케이블의 송전용량은 케이블 또는 주변지반의 최대허용온도에 좌우되기 때문에 케이블 주위 되메움재는 운영기간동안 낮은 열저항성을 유지하여야 한다. 케이블 주위에 발생된 열은 되메움재를 통해 즉시 주위에 발산시켜 제거하여야 하며, 그렇지 않으면 통상온도 (50~6$0^{\circ}C$)에서도 열폭주에 의한 절연파괴에 이를 수 있다. 본 논문에서는 되메움재의 열저항을 낮추기 위한 여러 가지 방법에 대해 논하였으며, 다양한 첨가제를 사용하여 시험을 수행함으로써 열저항 효과를 측정하였다. 연구결과, 영광 동림천 모래의 경우 상대적으로 균등한 입도분포를 나타내는 모래로써대단히 높은 열저항치(5$0^{\circ}C$'-cm/watt at 10% 함수비, 260-cm/watt 건조 시)를 나타냈다. 또한 진산 화강암 석분 및모래싸갈(A-2), 석분쇄석 혼합재(E-1)의 경우 양호한 입도와 낮은 열저항(35$^{\circ}C$-cm/wau 10% 함수비, 10$0^{\circ}C$-cm/watt 건조시)을 보여주었으며, 이들 연구결과를 토대로 열저항이 낮은 3가지 형태의 되메움재를 제시하였다.