Prediction of the Impact Lifetime for Board-Leveled Flip Chips by Changing the Design Parameters of the Solder Balls (플립칩의 설계변수 변화에 따른 보드레벨 플립칩에서의 낙하충격 수명예측)
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- Journal of the Korean Society of Manufacturing Technology Engineers
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- v.24 no.1
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- pp.117-123
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- 2015