• Title/Summary/Keyword: technology convergence

Search Result 15,561, Processing Time 0.04 seconds

A Study on Communication Signal Processing using UWB for On-body WBAN Systems (On-body WBAN 시스템을 위한 통신 신호 처리 기법에 관한 연구)

  • Kim, Jaehwan;Oh, Mi Kyung;Lee, HyungSoo;Kim, Jae-Young;Choi, Eunjeong
    • Proceedings of the Korea Information Processing Society Conference
    • /
    • 2009.11a
    • /
    • pp.561-562
    • /
    • 2009
  • On-body WBAN 시스템은 저속 생체 정보 전달과 고속 멀티미디어 통신을 모두 지원할 수 있는 시스템 구조를 가져야 한다. 게다가 WBAN 시스템의 특성상 최대한 저전력 구현이 가능한 시스템 설계가 수반되어야 한다. 본 논문에서는 UWB를 이용하여 다중 속도 지원이 가능한 On-body WBAN 시스템 구조를 제안한다. 제안된 시스템은 Block-Coded Group PPM 변조 기법을 사용하여 데이터 신뢰도를 높일 수 있다.

Interconnection Technology Based on InSn Solder for Flexible Display Applications

  • Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung;Lee, Jin Ho
    • ETRI Journal
    • /
    • v.37 no.2
    • /
    • pp.387-394
    • /
    • 2015
  • A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

A Study on the Risk Assessment and Mitigation Plan about Fire Explosion of n-Pentane in EPS Process (EPS공정에서 발생하는 n-Pentane의 화재폭발에 대한 위험성평가 및 위험성 완화 대책에 관한 연구)

  • Seo, Min Su;Kim, Ki Sug;Kim, Bo Min;Kang, Dong Cheon;Kang, Kil Jae;Chon, Young Woo
    • Korean Journal of Hazardous Materials
    • /
    • v.6 no.2
    • /
    • pp.39-46
    • /
    • 2018
  • 최근 전자제품 생산업체에서 EPS를 직접생산하게 되면서 EPS 공정이 증가하고 있다. EPS에는 펜탄이 포함되어 있으며, 펜탄은 하이브리드 혼합물로 구분할 수 있어 높은 화재폭발의 위험성을 가지고 있다. 각 공정별 펜탄의 누출률은 발포기, 사일로실, 저장실 순이나 발포기의 경우 일반적으로 밀폐되어 있으므로 사일로 실이 가장 화재폭발 위험성이 높다고 판단하였다. 사일로실의 누출률 중 70%는 사일로 상단을 통해 누출되며, 사일로 상단을 통해 누출되는 펜탄의 거동을 분석하여 사일로실 위험성 완화대책을 수립하였다. 1. 폭발위험구역 2종으로 관리, 2. 사일로상단 50cm이내 환기설비 설치 또는 Push-Pull 구조의 환기설비설치, 3. 사일로 하단 1.4m이내에 가스감지기 설치, 4. 60%이상의 습도유지

Analysis on Deduction of Energy-IT Convergence Technologies by the Analytic Hierarchy Process (AHP를 이용한 에너지-IT 융합기술 도출에 관한 연구)

  • Oh, Nam-Gul;Kim, Hoon
    • The Journal of Korean Institute of Communications and Information Sciences
    • /
    • v.35 no.7B
    • /
    • pp.1091-1097
    • /
    • 2010
  • Energy and environment problem has been arisen and become one of the major concerns all over the world, due to scarce energy resources and inefficient energy consumption. Recently, energy-IT(EIT) convergence technology has been getting more attention, being expected to be one of key technologies to resolve the problem, and R&D projects on various areas of EIT convergence technologies have been launched in many countries on a large scale. Korea government and companies have also been interested in the development of EIT technologies, however, the scopes of technology areas are limited to just a small part such as smart grid technology. This paper investigates effectiveness of each EIT convergence technology and deduces EIT convergence technologies using AHP(Analytic Hierarchy Process). It is expected that our research could be meaningful information supporting policies on R&D projects of EIT convergence technologies promoted to save energy and strengthen the national competitiveness. Our research results show that the EIT convergence technology area of green building would be the most effective EIT convergence technology except smart grid, and network-based energy management system would be the most effective amongst the sub-areas of green building.

Design and Analysis of Refractometer Based on Bend Waveguide Structure with Air Trench for Optical Sensor Applications

  • Ryu, Jin Hwa;Lee, Woo-Jin;Lee, Bong Kuk;Do, Lee-Mi;Lee, Kang Bok;Um, Namkyoung;Baek, Kyu-Ha
    • ETRI Journal
    • /
    • v.36 no.5
    • /
    • pp.841-846
    • /
    • 2014
  • This study proposes a novel optical sensor structure based on a refractometer combining a bend waveguide with an air trench. The optical sensor is a $1{\times}2$ splitter structure with a reference channel and a sensing channel. The reference channel has a straight waveguide. The sensing channel consists of a U-bend waveguide connecting four C-bends, and a trench structure to partially expose the core layer. The U-bend waveguide consists of one C-bend with the maximum optical loss and three C-bends with minimum losses. A trench provides a quantitative measurement environment and is aligned with the sidewall of the C-bend having the maximum loss. The intensity of the output power depends on the change in the refractive index of the measured material. The insertion loss of the proposed optical sensor changes from 3.7 dB to 59.1 dB when the refractive index changes from 1.3852 to 1.4452.

Dielectric Properties of ink-Jet printed $Al_2O_3$-resin Hybrid Films

  • Hwang, Myung-Sung;Jang, Hun-Woo;Kim, Ji-Hoon;Kim, Hyo-Tae;Yoon, Young-Joon;Kim, Jong-Hee;Moon, Joo-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.11a
    • /
    • pp.81-81
    • /
    • 2009
  • Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

  • PDF

Toward High Utilization of Heterogeneous Computing Resources in SNP Detection

  • Lim, Myungeun;Kim, Minho;Jung, Ho-Youl;Kim, Dae-Hee;Choi, Jae-Hun;Choi, Wan;Lee, Kyu-Chul
    • ETRI Journal
    • /
    • v.37 no.2
    • /
    • pp.212-221
    • /
    • 2015
  • As the amount of re-sequencing genome data grows, minimizing the execution time of an analysis is required. For this purpose, recent computing systems have been adopting both high-performance coprocessors and host processors. However, there are few applications that efficiently utilize these heterogeneous computing resources. This problem equally refers to the work of single nucleotide polymorphism (SNP) detection, which is one of the bottlenecks in genome data processing. In this paper, we propose a method for speeding up an SNP detection by enhancing the utilization of heterogeneous computing resources often used in recent high-performance computing systems. Through the measurement of workload in the detection procedure, we divide the SNP detection into several task groups suitable for each computing resource. These task groups are scheduled using a window overlapping method. As a result, we improved upon the speedup achieved by previous open source applications by a magnitude of 10.

Staged Repair of Truncus Arteriosus Associated with Complete Atrioventricular Septal Defect

  • Lim, Mi Hee;Sung, Si Chan;Kim, Hyung Tae;Choi, Kwang Ho;Lee, Hyoung Doo;Kim, Geena
    • Journal of Chest Surgery
    • /
    • v.51 no.5
    • /
    • pp.356-359
    • /
    • 2018
  • We report a case of successful repair of truncus arteriosus (TA) associated with complete atrioventricular septal defect (c-AVSD) using a staged approach. TA associated with c-AVSD is a very rare congenital cardiac anomaly. No report of successful staged repair in South Korea has yet been published. We performed bilateral pulmonary artery banding when the patient was 33 days old, and total correction using an extracardiac conduit was performed at the age of 18 months. The patient recovered uneventfully and is doing well.

Analysis of Current Situation and Relationship among National R&D Projects for Technology Convergence (국가 융합연구사업의 현황 및 연계성 분석)

  • Cho, Yangrae;Yang, Iesuk;Suh, Yongyoon;Jeon, Jeonghwan
    • Journal of Korean Institute of Industrial Engineers
    • /
    • v.41 no.3
    • /
    • pp.305-323
    • /
    • 2015
  • Since various R&D projects about technology convergence was conducted by the government of Korea, the lack of liaisons among the projects has been accepted as serious issues related on the duplicated funding. In this article, we propose a research framework to analyze the relationship among national R&D projects about technology convergence. In detail, the projects have been sorted and categorized with the data collected from National Science and Technology Information Service (NTIS) in order to analyze the current state of national R&D projects. The linkages among projects are then established using the results of analysis on national R&D projects. Finally, the relationship maps have been developed. It is expected that the result could be applied to identify the relations among projects and handle problems on the duplicated funding.