Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Dielectric Properties of ink-Jet printed $Al_2O_3$-resin Hybrid Films

  • Hwang, Myung-Sung (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Jang, Hun-Woo (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Ji-Hoon (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Hyo-Tae (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Yoon, Young-Joon (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Jong-Hee (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Moon, Joo-Ho (Department of Advanced Material Engineering, Yonsei University)
  • Published : 2009.11.12
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Abstract

Non-sintered Alumina films were fabricated via inkjet printing processes without a high temperature sintering process. The packing density of these inkjet-printed alumina films measured around 60%. Polymer resin was infiltrated thru these non-sintered films in order to fill out the 40% of voids constituting the rest of the inkjet-printed films. The concept of inkjet-printed Alumina-Resin hybrid materials was designed in order to be applicable to the ceramic package substrates for 3D-system module integration which may possibly substitute LTCC-based 3D module integration. So, the dielectric properties of these inkjet-printed $Al_2O_3$ hybridmaterialsareofourgreatinterest. We have measured dielectric constant and dissipation factor of the inkjet-printed $Al_2O_3$-resinhybridfilmsbyvaryingtheamountofresininfiltratedthruthe$Al_2O_3$films.

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