• 소성∙가공
• /
• 제22권1호
• /
• pp.36-41
• /
• 2013

The present study examines the micro-pattern replication on a plastic film using ultrasonic imprinting. Ultrasonic imprinting uses ultrasonic waves to generate repetitive microscale deformation in the polymer film. The resulting deformation heat on the surface of the film causes the surface region to soften sufficiently so that a replication of the micro-pattern can be obtained. To successfully replicate the micro-pattern on a large area of polymer film, a high replication ratio is needed as well as good uniformity over the entire region. In this study, a horn design is investigated by finite element analysis and is optimized through a response surface analysis. In the ultrasonic imprinting experiments, the response surface method was also used to determine the optimal processing conditions for better replication characteristics.

• 한국식물병리학회지
• /
• 제10권4호
• /
• pp.254-260
• /
• 1994

Magnaporthe grisea, a causal agent of blast, forms a specialized infection structure, an appressorium, to infect host. Hydrophobicity of contact surface and cAMP have been suggested as a primary environmental signal and a second messenger to trigger and mediate appressorium formation in this fungus, respectively. To generalize these factors in field isolates of M. girsea, twenty isolates originated from rice and other gramineous hosts were tested. Seventeen including rice and non-rice isolates formed appressoria on hydrophobic surface, but none of isolates formed appressoria on hydrophilic surface. Eighteen isolates formed appressoria on hydrophilic surface in the presence of IBMX, an inhibitor of phosphodiesterase, except two rice isolates. These results strongly support the hypothesis that appressorium formation by M. grisea is induced by hydrophobic hard surface and regulated by the endogenous level of cAMP in the cells. Understanding fungal development is not only of biological interest but provides new targets for novel disease control strategies.

• 한국전기전자재료학회논문지
• /
• 제23권1호
• /
• pp.10-13
• /
• 2010

The plasma processing technologies of thin film deposition and surface treatment technique have been applied to many industrial fields. This study is purposed Large-area uniformity and surface treatment on the stainless substrate. We treat surface of stainless by $CF_4$ plasma. $CF_4$ plasma is generated by using SPM(Scanning plasma method)which is kind a of CVD. Generally, SPM has been used for uniform surface treatment using a crossed electromagnetic field. The optimum discharge condition has been studied for the gas pressure, the magnetic flux density and the distance between substrate and electrodes. In result, contact angle is increased by surface treatment using $CF_4$ Plasma. Therefore we expect that SPM to control contact angle is applied to many industries.

• Korean Chemical Engineering Research
• /
• 제49권2호
• /
• pp.200-205
• /
• 2011

직경 1.0 m인 파일럿 규모 슬러리 기포탑에서 기포체류량의 축방향, 반경방향분포를 고찰하였다. 기체의 유속, 연속 액상의 표면장력 그리고 슬러리상에 포함된 고체입자의 분율이 기포탑 내부 기포의 축방향 및 반경방향 분포에 미치는 영향을 검토하였다. 본 연구의 실험조건 모두에서 체류량은 기포탑의 중심으로부터 반경방향 무차원 거리가 증가함에 따라 감소하였으며, 기포탑의 분산판으로부터 축방향의 무차원의 거리가 증가함에 따라 증가하였다. 기포체류량의 반경방향 불균일도는 기체의 유속이 증가함에 따라 연속 액상의 표면장력이 감소함에 따라 증가하였으나 슬러리상에 포함된 고체입자 분율에는 크게 영향을 받지 않았다. 본 연구의 범위에서 축방향과 반경방향 기포체류량의 분포는 각각의 실험변수의 상관식으로 나타낼 수 있었다.

• Tribology and Lubricants
• /
• 제32권4호
• /
• pp.125-131
• /
• 2016

In recent years, thick ta-C coating has attracted considerable interest owing to its existing and potential commercial importance in applications such as automobile accessories, drills, and gears. The thickness of the ta-C coating is an important parameter in these applications. However, the biggest problems are achieving efficient coating and uniformity over a large area with high-speed deposition. Feasibility is confirmed for the ta-C coating thickness of up to 9.0 µm (coating speed: 3.0 µm/h, fixed substrate) using a single FCVA cathode. The thickness was determined using multiple coating cycles that were controlled using substrate temperature and residual stresses. In the present research, we have designed a coating system using FCVA plasma and produced enhanced thick ta-C coating. The system uses a specialized magnetic field configuration with stabilized DC arc plasma discharge during deposition. To achieve quality that is acceptable for use in automobile accessories, the magnetic field, T-type filters, and 10 pieces of a multi-cathode are used to demonstrate the deposition of the thick ta-C coating. The results of coating performance indicate that uniformity is ±7.6 , deposited area is 400 mm, and the thickness of the ta-C coating is up to 5.0 µm (coating speed: 0.3 µm/h, revolution and rotation). The hardness of the coating ranges from 30 to 59 GPa, and the adhesion strength level (HF1) ranges from 20 to 60 N, depending on the ta-C coating.

• 한국정밀공학회지
• /
• 제19권8호
• /
• pp.180-186
• /
• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.

• 한국항공우주학회지
• /
• 제35권9호
• /
• pp.792-798
• /
• 2007

촉매 연소는 통상의 연소 방식과는 달리 촉매 표면에서 연료와 산화제의 화학 반응에 의한 연소 방식이다. 따라서 연소 영역 이전에 연료와 공기가 잘 혼합되어야 하며, 균일한 공급이 이루어져야 한다. 만약 불균일한 유동 분포가 발생하게 되면, 국부적인 고온 지역이 발생하게 되고 이는 촉매와 지지체에 손상을 초래하게 된다. 본 연구에서는 촉매 연소기의 혼합 및 유동 균일도를 향상시키기 위해 다공판을 사용하였으며, 다양한 파라메터의 변화에 따른 유동 특성의 변화를 조사하기 위해 수치적인 방법을 사용하였다. 각각의 조건하에서 촉매부의 입구에서 유동의 균일도를 조사하고 평가하였으며, 그 결과 적절히 설계된 다공판을 사용하였을 경우 대부분의 해석 조건에 대해 효과적인 균일도 향상을 나타냄을 확인할 수 있었다.

• 청정기술
• /
• 제17권2호
• /
• pp.103-109
• /
• 2011

전기도금의 seed layer를 형성하는 무전해 동도금 공정의 throwing power (TP)와 두께 편차를 개선하기 위한 공정 최적화 방법을 제시하였다. 실험계획법 (DOE)을 이용하여 가능한 모든 공정 인자들 가운데 TP와 두께 편차에 가장 큰 영향을 미치는 주요 인자를 파악해 보았다. 균일성을 가진 via filling을 위해서는 도금액 내의 Cu 이온의 농도를 높여주고 도금 온도를 낮추어 주는 것이 바람직한 것으로 판단되었으며 이는 표면 반응성의 측면에서 설명되었다. Kinetic Monte Carlo (MC) 모사가 이를 시각화하기 위해 도입되었으며 실험에서 관찰된 현상을 정성적으로 무리 없이 설명할 수 있었다. 실험계획법을 이용한 체계적인 실험과 이를 뒷받침하는 이론적인 모사가 결합된 본 연구의 접근법은 관련 공정에서 유용하게 활용될 수 있을 것이다.

• 한국항공우주학회지
• /
• 제44권5호
• /
• pp.455-462
• /
• 2016

적외선 검출기와 같은 우주용 영상센서는 작동 유무 및 시간경과에 따라 센서의 응답특성이 변하기 때문에 영상품질이 저하된다. 이러한 영상센서의 비균일 응답특성을 보정하기 위하여 궤도상에서 보정용 흑체시스템을 이용하여 주기적인 보정을 실시 할 수 있도록 해야 한다. 본 논문에서는 저온에서 고온에 이르는 다양한 기준온도에서의 높은 온도균일도 확보 및 흑체의 대표표면온도 추정이 용이하고, 초경량, 저전력, 고정밀도의 흑체 시스템을 구현하기 위해 MEMS(Micro Electro Mechanical Systems)기반의 흑체시스템을 제안하였으며, 열해석을 통해 성능을 입증하였다.

• 한국컴퓨터정보학회논문지
• /
• 제22권1호
• /
• pp.63-69
• /
• 2017

In this paper, we propose a method to optimize the geometry and installation position of the mixer in the selective catalytic reduction (SCR) system by computational fluid dynamic(CFD). Using the commercial CFD software of CFD-ACE+, the flow dynamics of the flue gas was numerically analyzed for improving the injection uniformity of the reduction agent. Numerical analysis of the mixed gas heat flow into the upstream side of the primary SCR catalyst layer was performed when the denitrification facility was operated. The characteristics such as the flow rate, temperature, pressure loss and ammonia concentration of the mixed gas consisting of the flue gas and the ammonia reducing gas were examined at the upstream of the catalyst layer of SCR. The temperature difference on the surface of the catalyst layer is very small compared to the flow rate of the exhaust gas, and the temperature difference caused by the reducing gas hardly occurs because the flow rate of the reducing gas is very small. When the mixed gas is introduced into the SCR reactor, there is a slight tendency toward one wall. When the gas passes through the catalyst layer having a large pressure loss, the flow angle of the exhaust gas changes because the direction of the exhaust gas changes toward a smaller flow. Based on the uniformity of the flow rate of the mixed gas calculated at the SCR, it is judged that the position of the test port reflected in the design is proper.