Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Control of Contact Angle by Surface Treatment using Sanning Plasma Method

주사 플라즈마 법(SPM)을 이용한 소수성 표면처리

  • 김영기 (전북대학교 전기공학과) ;
  • 최병정 (전북대학교 전기공학과) ;
  • 양성채 (전북대학교 전기공학과)
  • Published : 2010.01.01
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Abstract

The plasma processing technologies of thin film deposition and surface treatment technique have been applied to many industrial fields. This study is purposed Large-area uniformity and surface treatment on the stainless substrate. We treat surface of stainless by $CF_4$ plasma. $CF_4$ plasma is generated by using SPM(Scanning plasma method)which is kind a of CVD. Generally, SPM has been used for uniform surface treatment using a crossed electromagnetic field. The optimum discharge condition has been studied for the gas pressure, the magnetic flux density and the distance between substrate and electrodes. In result, contact angle is increased by surface treatment using $CF_4$ Plasma. Therefore we expect that SPM to control contact angle is applied to many industries.

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References

  1. 양성채, 김곤호, “플라즈마 일렉트로닉스”, (주)교학사, 2006.
  2. H. So, D. J. Yim, and Y. C. Kim, “The enhancement of hydrophobicity on metal surface with $C_3F_6$ plasma polymerization", Hwahak Konghak, Vol. 41, No. 1, p. 80, 2003.
  3. S.-H. Choi, S.-J. Oh, N.-J. Cho, and J.-K. Koo, “Enhancement in the amine resistance of membranes for membrane contactors by plasma treatment", Hwahak Konghak, Vol. 40, No. 6, p. 719, 2002.
  4. H. Fujiyama, Y. Tokitu, Y. Uchikawa, K. Kuwahara, K. Miyake, and A. Doi, “Ceramics inner coating of narrow tubes by a coaxial magnetron pulsed plasma”, Surface and Coatings Technology, Vol. 98, Issues 1-3, p. 1467, 1998. https://doi.org/10.1016/S0257-8972(97)00155-2
  5. G. Kalita, H. Ram Aryal, and S. Adhikari, "Fluorine incorphrated amorphous carbon thin films prepared by surface wave microwave plasma CVD", Diamond ＆ Related Materials, Vol. 17, Issues 7-10, p. 1697, 2008. https://doi.org/10.1016/j.diamond.2008.02.002
  6. K. Youngsang and K. Youngsue, “Wettability and aging effect of polystyrene film treated by PSII according to the molecular waight", Science & Technology, Vol. 15, No. 3, p. 229, 2002.
  7. J. Gielen, M. Sanden, and D. Schram, "Depositon of amorphous carbon layers from $C_2H_2$ and $CF_4$ with an expanding thermal arc plasma beam set-up", Thin Solid Films, Vol. 271, p. 56, 1995. https://doi.org/10.1016/0040-6090(95)06902-X
  8. Y. Maemura, S.-C. Yang, and H. Fujiyama, “Transport of negatively charged particles by E ${\times}$ B drift in silane plasmas”, Surface and Coatings Technology, Vol. 98, Issues 1-3, p. 1351, 1998. https://doi.org/10.1016/S0257-8972(97)00381-2
  9. 조욱, 양성채, “저온프로세스를 이용한 고분자 필름의 플라즈마 표면처리”, 전기전자재료학회논문지, 21권, 5호, p. 486, 2008. https://doi.org/10.4313/JKEM.2008.21.5.486
  10. 임규태, 김경태, 김동표, 김창일, “$Ar/CF_4$ 유도결합 플라즈마를 이용한 BET 박막의 식각 메카니즘”, 전기전자재료학회논문지, 16권, 4호, p. 298, 2003. https://doi.org/10.4313/JKEM.2003.16.4.298