• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2020년도 가을 학술논문 발표대회
• /
• pp.153-154
• /
• 2020

This study aims to find out the reason that tile adhesive(type III) for ceramic tile does not harden under some conditions especially high humidity even though long curing time. Bonding strength of adhesive between substrate and ceramic tile is evaluated depending on bonding conditions such as substrate kind(concrete, board), bonding material (tile adhesive, tile cement) and curing condition(humidity 50, 70%). Based on the results, this study aimed to establish the quality of tile adhesion strength under the relevant conditions.

• 한국주조공학회지
• /
• 제13권5호
• /
• pp.476-483
• /
• 1993

The influence of substrate materials on the degree of basal porosity during spray casting process has been investigated. Different conditions of droplet spreading on the substrate were induced by varying the substrate material. Flat sections of cast iron and aluminum have been spray deposited via spray casting process onto an aluminum substrate, a low carbon steel substrate, and an alumina based refractory substrate. Results for cast iron and aluminum sprayed onto the aluminum substrate showed significant improvements in the surface condition and degree of basal porosity with evidence of substrate deformation that round pits ranging from $5{\mu}m$ to $20{\mu}m$ in diameter are distributed on the surface of aluminum substrate. The lowest level of porosity was developed in alumina based refractory material. Several mechanisms for porosity formation were discussed with droplet impact pressure and droplet spreading. Adopting a spray cutting mechanism for removing the periphery of spray cone, porosity level was remarkably decreased.

• 제어로봇시스템학회논문지
• /
• 제14권4호
• /
• pp.336-341
• /
• 2008

Recently, research on a flat panel display(FPD) has focused on organic light-emitting display(OLED) which has wide angle of view, high contrast ratio and low power consumption. ITO(Indium-Tin-Oxide) films are the most widely used material as a transparent electrode of OLED and also in many other display devices like LCD or PDP. The performance and efficiency of OLED is related to the surface condition of ITO coated glass substrate. The typical surface defect of glass substrate is measured for electric characteristics and physical condition for transmittance and roughness. Since ITO coated glass substrate can be destroyed for inspection about surface roughness, sheet resistance, film thickness and transmittance, precise fabrication condition should be made based on the estimated relationship. In this paper, ITO films were prepared on the commercial glass substrate by the Ion-Plating method changing the partial pressure of gas(Ar, 02) and the chamber temperature between $200^{\circ}C$ and $300^{\circ}C$. The characteristics of films were examined by the 4-point probe, supersonic thickness measurement, transmittance measurement and AFM. We estimated the relationship between processing parameters(Ar gas, O2 gas, Temperature) and properties of ITO films (Sheet Resistance, Film Thickness, Transmittance, Surface Roughness).

• 한국전기전자재료학회논문지
• /
• 제22권5호
• /
• pp.411-414
• /
• 2009

It has been investigated for the film uniformity and deposition rate of a-C:H films on glass substrate and polymeric materials in the presence of the modulated crossed magnetic field. We used Plasma CVD, i.e, using a crossed electromagnetic field, for uniform depositing thin film. The optimum discharge condition has been discussed for the gas pressure, the magnetic flux density and the distance between substrate and electrodes, As a result, it is found that the optimum discharge conditions are $CH_4$ concentration $CH_4$=10 %, modulated magnetic flux density B=48 Gauss, pressure P=100 mTorr, discharge power supply voltage V=l kV under these experimental conditions. By using these experimental condition, it is possible to prepare the most uniform film extends over about 160 mm of the film width. In this study, we deposited a-C:H thin film on glass substrate, and have a plan that using this condition, study depositing a-C:H thin film on polymeric substrate in next studies.

• Tribology and Lubricants
• /
• 제37권5호
• /
• pp.195-202
• /
• 2021

This paper presents a numerical analysis of the lubrication characteristics of condensed water molecules on a solid surface by conducting molecular dynamics simulations. We examine two models consisting of a simple hexahedral substrate with and without water molecules to reveal the lubrication mechanism of mono-layered water molecules. We perform a sliding simulation by contacting and translating a single asperity on the substrate under various normal loads. During the simulation, we measure the friction coefficient and atomic stress. When water molecules were interleaved between solid surfaces, atomic stress exerted on individual atom and friction coefficient were smaller than those of model without water molecule. Particularly, at a low load, the efficacy of water molecules in the reduction of atomic stress and friction is remarkable. Conversely, at high loads, water molecules rarely lubricate solid surfaces and fail to effectively distribute the contact stress. We found a critical condition in which the lubrication regime changes and beyond the condition, significant plastic deformation was created. Consequently, we deduce that water molecules can distribute and reduce contact stress within a certain condition. The reduced contact stress prevents plastic deformation of the substrate and thus diminishes the mechanical interlocking between the asperity and the substrate.

• 연구논문집
• /
• 통권27호
• /
• pp.183-200
• /
• 1997

We have calculated the energy of three distinct grain configurations, namely completely connected, partially connected and unconnected configurations, evolving during a spheroidization of polycrystalline thin film by extending a geometrical model due to Miller et al. to the case of spheroidization at both the surface and film-substrate interface. "Stabilitl" diagram defining a stable region of each grain configuration has been established in terms of the ratio of grain size to film thickness vs. equilibrium wetting or dihedral angles at various interface energy conditions. The occurrence of spheroidization at the film-substrate interface significantly enlarges the stable region of unconnected grain configuration thereby greatly facilitating the occurrence of agglomeration. Complete separation of grain boundary is increasingly difficult with a reduction of equilibrium wetting angle. The condition for the occurrence of agglomeration differs depending on the equilibrium wetting or dihedral angles. The agglomeration occurs, at low equilibrium angles, via partially connected configuration containing stable holes centered at grain boundary vertices, whereas it occurs directly via completely connected configuration at large equilibrium angles except for the case having small surface and/or film-substrate interface energy. The initiation condition of agglomeration is defined by the equilibrium boundary condition between the partially connected and unconnected configurations for the former case, whereas it can, for the latter case, largely deviate from the equilibrium boundary condition between the completely connected and unconnected configurations because of the presence of a finite energy barrier to overcome to reach the unconnected grain configuration.

• 한국콘크리트학회:학술대회논문집
• /
• 한국콘크리트학회 2001년도 봄 학술발표회 논문집
• /
• pp.979-984
• /
• 2001

Poor water-proofing integrity is related to many factors : site procedure, workmanship, weather. substrate conditions, installation(including asphalt application) conditions. The evaluation of adhesive properties tested by concrete surface moisture and asphalt application was based on laboratory test and observations. This report describes the pull-off test results of waterproofing systems currently used for installing and reparing for concrete bridge decks. The test results showed that the moisture condition fully affected the adhesive properties of sheet membranes and sealer but partially for liquid membranes.

• 한국결정성장학회지
• /
• 제4권1호
• /
• pp.92-99
• /
• 1994

마이크로웨이브 화학 기상 중착법을 이용하여 n 형 Si(100) 기팡위에 다이아몬드 박막을 증착하였다. 다이아몬드의 핵생성 밀도를 향상시키기 위하여 Si 기판을 다이아몬드 분말로 전처리 하거나 negative bias를 인가하여 다이아몬드 박막을 증착하였다. 전처리한 기판에서는 다이아몬드의 순수도가 전체압력이 증가함에 따라 (20~150 Torr)향상되었으며 bias 인가시에는$CH_4$ 농도와 전체압력에 따라 다이아몬드의 생성유무가 결정되었다.플라즈마의 이온에 의해 가판위에 생성되는 전류를 $CH_4$ 농도, bias 전압, 그리고 전체압력에 따라 측정하였으며 그 결과를 다이아몬드 박막의 생성 조건과 관련시켜 검토 하였다.

• 콘크리트학회논문집
• /
• 제13권5호
• /
• pp.507-515
• /
• 2001

신.구 콘크리트 부착계면의 부착강도는 신 콘크리트에 라텍스를 이용하여 개선할 수 있다. 그러나, 현재까지 신.구 콘크리트 사이의 부착강도를 측정하기 위해 표준으로 채택되어진 실험은 아직 없다. 일축인장시험에서, 신.구 콘크리트 계면의 부착강도는 시험체의 파단 시 인장에 의해 실제적으로 구해진다. 본 연구에서 새로이 제시한 직접인장 부착강도 실험으로 라텍스 개질 콘크리트의 부착특성을 평가하고자 하였다. 새로이 제시되는 직접인발 부착강도 실험을 위하여 현장과 같은 조건의 슬래브를 제작하여 pull-out 실험을 실시하였으며, 기존의 시편을 이용한 직접인장 실험 시편을 제작하여 본 연구에서 사용하였다. 실험결과는 다음과 같다: 라텍스 혼입율 증가에 따라 부착강도는 증가하는 것으로 나타났다. 이를 통해 라텍스에 의한 부착력증진을 확인할 수 있었다. 또한, 기존 콘크리트의 표면처리에 따른 라텍스 개질 콘크리트의 부착특성을 평가한 결과, 표면처리에 따라 라텍스 개질 콘크리트의 부착강도가 개선되는 것으로 나타났다. 기존 콘크리트의 표면함수상태에 따른 라텍스 개질 콘크리트의 부착특성을 평가하기 위해서 다양한 표면함수상태에서 부착강도를 평가한 결과, 표면건조포화상태가 가장 이상적인 조건임을 알 수 있었다.

• 한국표면공학회지
• /
• 제28권5호
• /
• pp.309-319
• /
• 1995

The substrate patterned with the dry film has the cavity which has the $90^{\circ}$ wall angle. Electroplating Cu on this patterned substrate has the differrent shape history with the electrochemical parameters. By potential theory model, the reason of the variation of the shape change with the these parameters was investigated. The shape history could be explained by the current flow and the correlated area effects. By embedding the Ni layer between the Cu layers, shape history with the time was obtained experimentally and the results was compared with the numerical analysis by BEM. The adhesive Cr-Cu film in TAB application was etched with the various condition. The best condition for the etchant of the Cr-Cu film was found.