An Experimental study on the Effect of Bonding Conditions on Bonding Strength of Ceramic Tiles: Substrate, Setting Material and Curing Condition

도기질 타일 부착조건(바탕면, 붙임재료 및 양생조건)이 부착강도에 미치는 영향에 관한 실험적 평가

This study aims to find out the reason that tile adhesive(type III) for ceramic tile does not harden under some conditions especially high humidity even though long curing time. Bonding strength of adhesive between substrate and ceramic tile is evaluated depending on bonding conditions such as substrate kind(concrete, board), bonding material (tile adhesive, tile cement) and curing condition(humidity 50, 70%). Based on the results, this study aimed to establish the quality of tile adhesion strength under the relevant conditions.