• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.241-241
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• 2010

Recently high and persistent spontaneous buildup of a surface potential (SP) upon vacuum deposition of tris (8-hydroxyquinolinato) aluminum (III) ($Alq_3$), which is widely used for organic light emitting devices. The removal of the giant surface potential by visible light irradiation has also been reported. In this study, we coated $Alq_3$ on the FTO substrate and raise the capacity for absorbing sun light. The $Alq_3$ which is green light emitting diode emits light at wavelengths between 500 and 550nm. If we apply one's FTO/$Alq_3$ substrate in one's DSSC, we could get higher energy conversion efficiency because the N719 dye that we used for fabricating the DSSC emits light just at near 540nm. The energy conversion efficiency of approximately 4.8 % at the condition of irradiation of AM 1.5 (100 mW/$cm^2$) simulated sunlight, and the $J_{sc}$ is 12.0 mA/$cm^2$, $V_{oc}$ is 0.71 V, FF is 0.56, respectively.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.8
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.3
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• pp.199-205
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• 2006

Patterned sapphire substrates (PSS) were fabricated by a simple wet etching process with $SiO_2$ stripe masks and a mixed solution of $H_2SO_4$ and $H_3PO_4$. GaN layers were epitaxially grown on the PSS under the optimized 2-step growth condition of metalorganic vapor deposition. During the 1st growth step, GaN layers with triangular cross sections were grown on the selected area of the surface of the PSS, and in the 2nd growth step, the GaN layers were laterally grown and coalesced with neighboring GaN layers. The density of threading dislocations on the surface of the coalesced GaN layer was $2{\sim}4\;{\times}\;10^7\;cm^{-2}$ over the entire region. The epitaxial structure of near-UV light emitting diode (LED) was grown over the GaN layers on the PSS. The internal quantum efficiency and the extraction efficiency of the LED structure grown on the PSS were remarkably increased when compared to the conventional LED structure grown on the flat sapphire substrate. The reduction in TD density and the decrease in the number of times of total internal reflections of the light flux are mainly attributed due to high level of scattering on the PSS.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.250-250
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• 2011

Zinc oxide (ZnO) structures have great potential in many applications. Currently, the most commonly used method to grow ZnO nanostructres are the vapor transport method (VPT). The morphology of the ZnO structures largely related to the growth conditions, including growth temperature, distance between the substrate and source, and gas ambient. Previously ZnO nanosturecutres with high crystallinity were obtained at the growth temperature of 800$^{\circ}C$, in the argon and oxygen gas ambient. In this study, we report the properties of the ZnO nanostructures, which were synthesized on Au-catalyzed Si substrate by VPT, using a mixture of ZnO and graphite powders as source material under the different condition, including gas ratio of argon/oxygen and distance between substrate and source at the growth temperature of 800$^{\circ}C$. The structural and optical properties of the ZnO nanostructures were investigated by field-emission scanning electron microscopy (FE-SEM), X-ray diffraction (XRD), and photoluminescence (PL).

• Journal of Sensor Science and Technology
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• v.27 no.1
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• pp.40-46
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• 2018

In this paper, we focus on optimization of a boron ($^{11}B$)-implanted n type Si epi substrate for obtaining near-zero temperature coefficient of resistance (TCR) at temperature range from 25 to $125^{\circ}C$. The $^{11}B$-implantation on the N type-Si epi substrate formed isolation from the rest of the N-type Si by the depletion region of a PN junction. The TCR increased as the temperature of rapid thermal anneal (RTA) was increased at the temperature range from $900^{\circ}C$ to $1000^{\circ}C$ for the $p^+$ contact with implantation at dose of $1E16/cm^2$, but sheet resistance of this film was decreased. After the optimization of anneal process condition, the TCR of $1126.7{\pm}30.3$ (ppm/K) was obtained for the $p^-$ resistor-COB package chips contained $p^+$ contact with the implantation of $5E14/cm^2$. This shows the potential of the $^{11}B$-implanted n type Si epi substrate as a resistor for pressure sensor in thermal stable environment applications..

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.46-49
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• 2002

The aim of this paper is to investigate the influence of various deformation ratio on texture of Ag tapes that can be used as a RE-$Ba_2Cu_3O_{7-{\delta}}$ coated conductor tapes without any buffer layer. We fabricated as-rolled Ag substrate with various deformation ratio per step. Thickness and total deformation ratio of Ag tapes were $100{\mu}m$ and >98%, respectively. And as-rolled Ag substrate was annealed at $750^{\circ}C$ for 30min. The as-rolled and recrystallization textures were measured using x-ray pole figures and orientation distribution function (ODF) analysis. With the increase of rolling ratio from 5 to 20%, deformation texture are changed from {1l0}<311> to {1l0}<112>, {032}<100>, {051}<211>. After recrystallization by annealing, main texture was observed to {013}<100> under present condition.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1379-1382
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• 1997

Diamond-like carbon(DLC) thin films are produced by using a filtered cathodic vacuum arc(FCVA) deposition system. Different magnetic components, namely steering, focusing, and filtering plasma-optic systems, are used to achieve a stable arc plasma and to prevent the macroparticles from incorporating into the deposited films. Effects of magnetic fields on plasma behavior and film deposition are examined. The carbon ion energy is found to be varied by applying a negative (accelerating) substrate bias voltage. The deposition rate of DLC films is dependent upon magnetic field as well as substrate bias voltage and at a nominal deposition condition is about $2{\AA}/s$. The structural properties of DLC films, such as internal stress, relative fraction of tetrahedral($sp^3$) bonds, and surface roughness have also been characterized as a function of substrate bias voltages and partial gas($N_2$) pressures.

• Proceedings of the KIEE Conference
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• 1994.07b
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• pp.1589-1592
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• 1994

We developed the ion plating system, consisted of the Facing Target Magnetron Sputtering System and the r.f, electrode of the coil type, which was available to control the reactive and the adhesion between thin film and substrate, and studied about the discharge characteristics and the optimum condition in order to form the high quality thin film. The characteristics of discharge and plasma was measured as Double Probe and Electrostatic Retarding Grid Analyzer. The incident ion energy on the substrate was increased as the increasing r.f power, bias voltage. By the r.f electrode, the ionization rate of the sputtered particles was about 75%, and the mean incident ion energy depend on the value which was difference between the plasma potential and biased substrate potential.

• Electrical & Electronic Materials
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• v.10 no.7
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• pp.706-712
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• 1997

AlN(Aluminium Nitride) thin films were prepared using by RF sputtering method on the Si(100) and Si(111) substrates as the parameters of the substrate temperature, RF power, sputtering duration and the $N_2$/Ar ratio and investigated by X-ray diffraction, IR spectrometry, n&k analyzer. For the Si(100) substrate, the AlN thin films of (101) orientation were obtained under the conditions of room temperature and the nitrogen of 60 vol.%. For the Si(111) substrate, the (002) AlN thin films were obtained under the nitrogen of 100 vol.%. In case of the thin film prepared in the condition of above 60 vol.% of the nitrogen, the average value of the surface roughness of the film was 151$\AA$. From the changes of the half widths of E$_1$[TO] phonon bands at the wavenumber of 680$cm^{-1}$ /, it were compared of the crystallinities of the films which were grown under the different conditions. The thicknesses of AlN films were decreased dramatically in the region of the nitrogen of 40~60 vol.%. Its due to the nitridation of the Al target surface and getting low of the sputtering yield by the $N_2$/Ar ratio being increased.

• Journal of Welding and Joining
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• v.23 no.6
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• pp.72-76
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• 2005

Friction surfacing of STS304 consumable rod on S45C substrate was investigated by microstructural observation and mechanical tests. STS304 layer formed a strongly-bonded thick layer under a wide range of surfacing conditions. The highest coating eefficiency was obtained in the condition of 1000rpm-2.5mm/sec-2.5mm/sec. The hardness distribution showed the peak value in the boundary layer and as the consumable rotation speed increased, the boundary layer also hardness increasing. As the consumable rotation speed and the traveling speed increased, the coating efficiency tended to decrease. On the other hand, as the feeding speed increased, the coating efficiency appeared to be increased. The new Fe-Cr-Ni alloy layer is showed in the interface layer on $5\~15{\mu}m$ width. After friction surfacing, corrosion resistance of STS 304 surfacing layers were equaled to that of STS304 consumable rod.