• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.51-63
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• 1999

The effects of high filler loading technique on the reliability of epoxy molding compound (EMC) as a microelectronic encapsulant was investigated. The method of high filler loading was established by the improvement of maximum packing fraction using the simplified packing model proposed by Ouchiyama, et al. With the maximum packing fraction of filler, the viscosity of EMC wart lowered and the flowability was improved. As the amount of filler in EMC increased, several properties such as internal stress and moisture absorption were improved. However, the adhesive strength with the alloy 42 leadframe decreased when the filler content was beyond the critical value. It was found that the appropriate content of filler was important to improve the reilability of EMC, and the optimum filler combination should be selected to obtain high reliable EMC filled with high volume fraction of filler.

• Journal of Korean Society for Quality Management
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• v.40 no.3
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• pp.286-294
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• 2012

Purpose: In this study, we propose the ESS process model which, in order to improve reliability of electronic equipment, can be referenced in both development and production phases. Methods: ESS guidelines such as MIL handbooks or private sector ESS guidelines are used for devising the proposed ESS model. Especially, proposed model is customized by using those references in order to be optimized in the domestic development and production phases. Results: ESS-related-requirements which is specified in the Technical Data Package(TDP) for the area of guided missile systems are analyzed. Current status of the requirement and screening strength are analyzed for those systems to show what kind of weak points should be improved. Conclusion: A ESS guideline which is applicable to the domestic weapon acquisition environment is proposed. As such, the necessity and detail guidelines of the proposed model are explained.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.50 no.7
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• pp.331-337
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• 2001

With the increasing reliability of analysis schemes and the dramatically increased calculating speed, the computer simulation has become and indispensable process to predict the interruption capacity of circuit breakers. Generally, circuit breakers have to possess both the small current and large current interruption abilities and the circuit breaker designers need to evaluate its capacities to save the time and the expense. The analysis of small current and the large current interruption performances have been considered separately because the phenomena occurring in a interrupter are quite different. To analyze the dielectric recovery after large current interruption many physical phenomena such as heat transfer, convection and arc radiation, the nozzle ablation, the ionization of high temperature SF(sub)6 gas, the electric and themagnetic forces and so forth mush be considered. However, in the analysis of small current interruption performance only the cold gas flow analysis needs to be carried out because the capacitive current is to small that the influence from the current can be neglected. In this paper, an empirical equation which is obtained from a series of tests to estimate the dielectric recovery strength has been applied to a real circuit breaker. The results of analysis have been compared with the test results and the reliability has been investigated.

• Elastomers and Composites
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• v.56 no.3
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• pp.124-135
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• 2021

Evaluating service lives of rubber materials at certain temperatures requires a destructive method (typically using elongation at break). In this study, a non-destructive method based on hardness change rate was proposed for evaluating the service life of chloroprene rubber (CR). Compared to the destructive method, this non-destructive method ensures homogeneity of CR specimens and requires a small number of samples. Thermal accelerated degradation test was conducted on the CR specimens at 55, 70, 85, 100, and 125℃, and the tensile strength, elongation at break, and hardness were measured. The results of the experiment were compared to those of the accelerated life evaluation method proposed in this study. Comparing the analyzed lives in the high temperature region (70, 85, 100, and 125℃), the difference between the service lives for the destructive method (using the elongation at break) and non-destructive method (using the hardness) was approximately 0.1 year. Therefore, it was confirmed that the proposed non-destructive evaluation method based on hardness changes can evaluate the actual life of CR under thermally accelerated degradation conditions.

• Composites Research
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• v.20 no.4
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• pp.25-30
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• 2007

The advanced fiber-reinforced laminated composites are widely used in a variety of engineering applications such as aerospace, marine, mechanical and civil engineering for weight savings because of their high specific strength and stiffness. The material properties of ply is known to have larger variations than that of conventional materials and very sensitive to the loading direction. Therefore, it is important to consider the variations on designing the laminated composite. This paper demonstrates the importance of considering uncertainties through examining the effect of material properties variations on various design requirements such as tip deflection, natural frequency and buckling stress using COMSOL-MATLAB interface.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Korean Society of Coastal and Ocean Engineers
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• v.16 no.3
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• pp.142-151
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• 2004

A method for the determination of concrete armor unit weights with hydraulic stability and structural stability may be formulated in this paper. The hydraulic stability is analyzed by using Hudson's formula, the structural stability is also studied by evaluation of maximum flexural tensile stresses in armor unit induced by the impact loads and by comparison of those with the tensile resistance strength directly. The applicable criteria for concrete armor units can be represented as a function of design wave heights with return period, armor weights, and tensile strengths for the practical uses. In addition, reliability analyses for two failure modes are carried out to take into account some uncertainties. Finally, a series system for two-failure mode analysis can be made up straightforwardly, by which the optimal weights of armor units can be estimated with the various relative breakages, given the specific target probability of failure under the concepts of reliability-based design method.

• Journal of Korean Society of Steel Construction
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• v.19 no.4
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• pp.395-402
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• 2007

Probabilistic risk assessment was conducted on a hybrid cable-stayed bridge consisting of a steel-composite plate girder and a concrete girder with a long span, designed using the working stress design and strength design methods. The component reliabilities of the bridge's cables, pylons, girders, and steel-concrete conjunction were evaluated using the AFOSM(Advanced First Order Second Moment) algorithm and the simulation technique at the critical sections, based on the maximum axial force, shear, and positive and negative moments of the selected sections. For the analysis of system reliability, the hybrid cable-stayed bridge consisting of cables, pylons, and plate girders was modeled into combined failure modes, and for system reliability, the probabilities of failure and reliability index of the structural system were evaluated. Based on the results of this study, the critical failure modes of the hybrid cable-stayed bridge based on the bridge's structural characteristics are suggested, and the efficiency of the partial ETA technique for use in the risk assessment method was confirmed.

• Journal of the Korea Concrete Institute
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• v.25 no.4
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• pp.439-446
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• 2013

The objective of this study is to evaluate the workability and various mechanical properties of heavyweight magnetite concrete and examine the reliability of the design equations specified in code provisions. The main parameters investigated were the water-to-cement ratio and substitution level of normal-weight coarse aggregate (granite) for magnetite. The oven-dried unit weight of concrete tested ranged between 2446 and $3426kg/m^3$. The measured mechanical properties included compressive strength development, stress-strain curve, splitting tensile strength, moduli of elasticity and rupture, and bond stress-slip relationship of concrete. Test results revealed that the initial slump of heavyweight magnetite concrete increased as the substitution level of normal-weight coarse aggregate increases. The substitution level of normal-weight coarse aggregate had little influence on the compressive strength and tensile resistance capacity of heavyweight concrete, while it significantly affected the modulus of elasticity and stress-strain curves of such concrete. The design equations of ACI 349-06 and CEB-FIP provisions mostly conservatively predicted the mechanical properties of heavyweight magnetite concrete, but the empirical equations for modulus of elasticity and splitting tensile strength need to be modified considering the unit weight of concrete.