• Title/Summary/Keyword: stress sensitivity

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A Parameter Study of Stuctural Respanse Model in Flexible Pavement Substucture Layers (아스팔트 포장하부구조 층모델 결정에 관한 연구)

  • Choi, Jun-Seong;Seo, Joo-Won
    • International Journal of Highway Engineering
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    • v.5 no.4 s.18
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    • pp.13-22
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    • 2003
  • Several design methods from overseas are employed without considering different conditions such as material properties, climate, and traffic condition in this country. Therefore, there are limitations in application. Therefore, new pavement analysis system which is able to design a pavement efficiently and economically should be set up. In this study, 243 probable sections are classified depending on values of layer thickness and elastic modulus, and the effect of load types for the probable sections are analyzed. The section showing larger load distribution is chosen for analysis. As a result of sensitivity, a layer thickness has more influence on pavement than an elastic modulus does. The stress distribution of FWD test load is larger than that of circular load. This study compares outputs between nonlinear elastic model and linear elastic model. Based on the result, this study finds nonlinear elastic model considering stress condition in the ground is recommended for subbase.

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Elucidation of Copper and Asparagine Transport Systems in Saccharomyces cerevisiae KNU5377 Through Genome-Wide Transcriptional Analysis

  • KIM IL-SUP;YUN HAE SUN;SHIMISU HISAYO;KITAGAWA EMIKO;IWAHASHI HITOSHI;JIN INGNYOL
    • Journal of Microbiology and Biotechnology
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    • v.15 no.6
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    • pp.1240-1249
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    • 2005
  • Saccharomyces cerevisiae KNU5377 has potential as an industrial strain that can ferment wasted paper for fuel ethanol at $40^{\circ}C$ [15, 16]. To understand the characteristics of the strain, genome-wide expression was performed using DNA microarray technology. We compared the homology of the DNA microarray between genomic DNAs of S. cerevisiae KNU5377 and a control strain, S. cerevisiae S288C. Approximately $97\%$ of the genes in S. cerevisiae KNU5377 were identified with those of the reference strain. YHR053c (CUP1), YLR155c (ASP3), and YDR038c (ENA5) showed lower homology than those of S. cerevisiae S288C. In particular, the differences in the regions of YHR053c and YLR155c were confirmed by Southern hybridization, but did not with that of the region of YDR038c. The expression level of mRNA in S. cerevisiae KNU5377 and S288C was also compared: the 550 ORFs of S. cerevisiae KNU5377 showed more than two-fold higher intensity than those of S. cerevisiae S288C. Among the 550 ORFs, 59 ORFs belonged to the groups of ribosomal proteins and mitochondrial ribosomal proteins, and 200 ORFs belonged to the group of cellular organization. DIP5 and GAP1 were the most highly expressed genes. These results suggest that upregulated DIP5 and GAP 1 might take the place of ASP3 and, additionally, the sensitivity against copper might be contributable to the lowest expression level of copper-binding metallothioneins encoded by CUP 1a (YHR053c) and CUP1b (YHR055c) in S. cerevisiae KNU5377.

Psychometric Properties of the Korean version of the PTSD Checklist-5 in Elderly Korean Veterans of the Vietnam War (월남전 참전 노인에서 한글판 외상후 스트레스 장애 체크리스트-5의 정신측정학적 특성)

  • Kim, Jong Won;Chung, Hae Gyung;Choi, Jin Hee;So, Hyung Seok;Kang, Suk-Hoon;Kim, Dong Soo;Moon, Jung Yoon;Kim, Tae Yong
    • Anxiety and mood
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    • v.13 no.2
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    • pp.123-131
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    • 2017
  • Objective : The PTSD Checklist (PCL) is a self-report screen for posttraumatic stress disorder (PTSD) that can be scored for both diagnostic assessment and symptom severity measurement. The most recent revision of the Diagnostic and Statistical Manual of Mental Disorders (DSM-5) contains a number of changes to the definition of PTSD, and the aim of this study was to assess the psychometric properties of the Korean version of the PCL for the DSM-5 (PCL-5-K). Methods : The participants were 204 Korean veterans of the Vietnam War who completed the PCL-5-K, the Mini Mental Status Examination (MMSE), PTSD module of Structured Clinical Interview for DSM-5, Research Version (SCID5-RV PTSD module), Korean version of Impact of Event Scale-Revised (IES-R-K) and Combat Exposure Scale (CES-K). Results : The PCL-5-K demonstrated good internal consistency (${\alpha}=0.972$) and test-retest reliability (r=0.96); the suggested cut-off score for PTSD diagnosis was ${\geq}37$ with 0.88 sensitivity and 0.96 specificity. The PCL-5-K scale correlated highly with the IES-R-K and CES-K. Factor analysis identified only one factor. Conclusion : Among elderly Korean veterans of the Vietnam War, the PCL-5-K demonstrated similar psychometric qualities to those of both the original PCL and subsequent versions. It is expected that the PCL-5-K will be a useful PTSD screening tool.

Deformation Behavior of MEMS Gyroscope Package Subjected to Temperature Change (온도변화에 따른 MEMS 자이로스코프 패키지의 미소변형 측정)

  • Joo Jin-Won;Choi Yong-seo;Choa Sung-Hoon;Kim Jong-Seok;Jeong Byung-Gil
    • Journal of the Microelectronics and Packaging Society
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    • v.11 no.4 s.33
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    • pp.13-22
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    • 2004
  • In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

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Fabrication and Performance Evaluation of Thin Polysilicon Strain Gauge Bonded to Metal Cantilever Beam (금속 외팔보에 접착된 박막 실리콘 스트레인 게이지의 제작 및 성능 평가)

  • Kim, Yong-Dae;Kim, Young-Deok;Lee, Chul-Sub;Kwon, Se-Jin
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.4
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    • pp.391-398
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    • 2010
  • In this paper, we propose a sensor design by using a polysilicon strain gauge bonded to a metal diaphragm. The fabrication process of the thin polysilicon strain gauges having thicknesses of $50\;{\mu}m$ was established using conventional MEMS technologies; further, the technique of glass frit bonding of the polysilicon strain gauge to the stainless steel diaphragm was established. Performance of the polysilicon strain gauge bonded to the metal cantilever beam was evaluated. The gauge factor, temperature coefficient of resistance (TCR), nonlinearity, and hysteresis of the polysilicon strain gauge were measured. The results demonstrate that the resistance increases linearly with tensile stress, while it decreases with compressive stress. The value of the gauge factor, which represents the sensitivity of strain gauges, is 34.0; this value is about 7.15 times higher than the gauge factor of a metal-foil strain gauge. The resistance of the polysilicon strain gauge decreases linearly with an increase in the temperature, and TCR is $-328\;ppm/^{\circ}C$. Further, nonlinearity and hysteresis are 0.21 % FS and 0.17 % FS, respectively.

Effect of welding variables on the crack arrest toughness of thick steel plate (선급 극후물재의 취성균열 전파 정지 인성에 미치는 용접변수의 영향)

  • Ryu, Kang-Mook;An, Gyu-Baek;Kim, Tae-Su;Lee, Tae-Yeung;Lee, Jong-Sub
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.103-103
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    • 2009
  • As the size of containership increased over 14,000TEU, thick steel plate with high strength has been used. The plate thickness increased over 70mm and yield strength of the steel plate was around $47kg_f/mm^2$. Many researchers reported that the thick welded plate has low crack arrest toughness. They noticed the crack arrest ability is dependent on the plate thickness. In other words, brittle crack propagates straightly along the welded line and make abrupt fracture in the thick plate which causes low $K_{ca}$. In this study, the other factors, especially welding heat input, to cause low crack arrest toughness was investigated for thick steel plate welds. EH grade steel plates were used in this study and 50 to 80 thick plates were tested to confirm thickness sensitivity. Electro gas welding (EGW) and flux cored arc welding (FCAW) were adopted to prepare the welded joints. Temperature gradient ESSO test was performed to measure $K_{ca}$ values with the variation of welding variables. As a result of this study, regardless of plate thickness, welding heat input to cause welding residual stress around crack path is a key factor to control the brittle crack propagation in welded joints.

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Salubrinal-Mediated Upregulation of eIF2α Phosphorylation Increases Doxorubicin Sensitivity in MCF-7/ADR Cells

  • Jeon, Yong-Joon;Kim, Jin Hyun;Shin, Jong-Il;Jeong, Mini;Cho, Jaewook;Lee, Kyungho
    • Molecules and Cells
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    • v.39 no.2
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    • pp.129-135
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    • 2016
  • Eukaryotic translation initiation factor 2 alpha ($eIF2{\alpha}$), which is a component of the eukaryotic translation initiation complex, functions in cell death and survival under various stress conditions. In this study, we investigated the roles of $eIF2{\alpha}$ phosphorylation in cell death using the breast cancer cell lines MCF-7 and MCF-7/ADR. MCF-7/ADR cells are MCF-7-driven cells that have acquired resistance to doxorubicin (ADR). Treatment of doxorubicin reduced the viability and induced apoptosis in both cell lines, although susceptibility to the drug was very different. Treatment with doxorubicin induced phosphorylation of $eIF2{\alpha}$ in MCF-7 cells but not in MCF-7/ADR cells. Basal expression levels of Growth Arrest and DNA Damage 34 (GADD34), a regulator of $eIF2{\alpha}$, were higher in MCF-7/ADR cells compared to MCF-7 cells. Indeed, treatment with salubrinal, an inhibitor of GADD34, resulted in the upregulation of $eIF2{\alpha}$ phosphorylation and enhanced doxorubicin-mediated apoptosis in MCF-7/ADR cells. However, MCF-7 cells did not show such synergic effects. These results suggest that dephosphorylation of $eIF2{\alpha}$ by GADD34 plays an important role in doxorubicin resistance in MCF-7/ADR cells.

Finite element model updating of long-span cable-stayed bridge by Kriging surrogate model

  • Zhang, Jing;Au, Francis T.K.;Yang, Dong
    • Structural Engineering and Mechanics
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    • v.74 no.2
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    • pp.157-173
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    • 2020
  • In the finite element modelling of long-span cable-stayed bridges, there are a lot of uncertainties brought about by the complex structural configuration, material behaviour, boundary conditions, structural connections, etc. In order to reduce the discrepancies between the theoretical finite element model and the actual static and dynamic behaviour, updating is indispensable after establishment of the finite element model to provide a reliable baseline version for further analysis. Traditional sensitivity-based updating methods cannot support updating based on static and dynamic measurement data at the same time. The finite element model is required in every optimization iteration which limits the efficiency greatly. A convenient but accurate Kriging surrogate model for updating of the finite element model of cable-stayed bridge is proposed. First, a simple cable-stayed bridge is used to verify the method and the updating results of Kriging model are compared with those using the response surface model. Results show that Kriging model has higher accuracy than the response surface model. Then the method is utilized to update the model of a long-span cable-stayed bridge in Hong Kong. The natural frequencies are extracted using various methods from the ambient data collected by the Wind and Structural Health Monitoring System installed on the bridge. The maximum deflection records at two specific locations in the load test form the updating objective function. Finally, the fatigue lives of the structure at two cross sections are calculated with the finite element models before and after updating considering the mean stress effect. Results are compared with those calculated from the strain gauge data for verification.

Modeling of Multi-Stage Hydraulic Fracture Propagation (다단계 수압파쇄균열 전파 모델링 연구)

  • Jang, Youngho;Sung, Wonmo
    • Journal of the Korean Institute of Gas
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    • v.19 no.5
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    • pp.13-19
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    • 2015
  • This paper presents a hydraulic fracture propagation model to describe propagation more realistically. In propagating the hydraulic fractures, we have used two criteria: maximum tangential stress to determine the fracture initiation angle and whether a hydraulic fracture intersects a natural fracture. The model was validated for the parameters relevant to fracture propagation, such as initiation angle and crossing ability through natural fracture. In order to check whether a hydraulic fracture crosses a natural fracture, the model results on crossing state excellently matched with the experimental data. In the sensitivity analysis for direction of maximum horizontal stress, frictional coefficient of fracture interface, and natural fracture orientation, the results show that hydraulic fracture intersects natural fracture, and then, propagated suitably with theoretical results according to fracture interaction criterion. In comparison of this model against vertical fracture approach, it was ascertained that there are discrepancies in fracture connectivity and stimulated reservoir volume.

The Study of Fatigue Lifetime Evaluation on the Interconnect of semiconductor sensor according to the various materials (재료에 따른 반도체 센서 배선의 피로 수명 평가에 관한 연구)

  • Shim Jae-Joon;Ran Dong-seop;Ran Geun-Jo;Kim Tae-Hyung
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 2005.10a
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    • pp.283-288
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    • 2005
  • Application of semiconductor sensors has widely spreaded into various industries because those have several merits like easy miniaturization and batch production comparison with previous mechanical sensors. But external conditions such as thermal and repetitive load have a bad effect on sensors's lifetime. Especially, this paper was focused on fatigue life of a interconnect made by various materials. Firstly we implemented the stress analysis for interconnect under thermal load and wording pressure. And the fatigue lifetime of each material was induced by Manson & Coffin Equation using the plastic stress-strain curve obtained by the plastic-elastic Finite Element Analysis.

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