• BMB Reports
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• 제55권12호
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• pp.577-586
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• 2022

Stress granules (SGs) are stress-induced subcellular compartments, which carry out a particular function to cope with stress. These granules protect cells from stress-related damage and cell death through dynamic sequestration of numerous ribonucleoproteins (RNPs) and signaling proteins, thereby promoting cell survival under both physiological and pathological condition. During tumorigenesis, cancer cells are repeatedly exposed to diverse stress stimuli from the tumor microenvironment, and the dynamics of SGs is often modulated due to the alteration of gene expression patterns in cancer cells, leading to tumor progression as well as resistance to anticancer treatment. In this mini review, we provide a brief discussion about our current understanding of the fundamental roles of SGs during physiological stress and the effect of dysregulated SGs on cancer cell fitness and cancer therapy.

• 한국지반환경공학회 논문집
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• 제8권6호
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• pp.69-76
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• 2007

해안 연약지반 개량공사에 사용되는 모래는 대부분 다소간의 패각을 함유하게 된다. 본 연구에서는 패각 함유량이 패각질모래의 액상화 저항에 미치는 영향을 연구하기 위하여 중량비에 의해 0%, 5%, 10%, 20%, 30%의 패각을 함유한 모래의 입도를 조성하고 건조퇴적 방법으로 상대밀도가 40%와 55%인 공시체를 성형하여 50kPa, 100kPa, 150kPa의 압밀유효연직응력으로 NGI형 직접단순전단시험기를 이용해서 반복단순전단시험을 수행하였다. 연구 결과, 압밀유효연직응력이 낮을 경우에는 상대밀도가 40%, 55% 모두 패각 함유량이 많아질수록 액상화강도가 크게 증가하는 경향을 보였다. 그러나 압밀유효연직응력이 높을 경우에는 상대 밀도가 40%일 경우 약간 증가하는 경향을 얻었으나 상대밀도가 55%일 경우에는 거의 일정한 값으로 수렴하는 결과를 얻었다. 그리고 상대밀도에 관계없이 압밀유효연직응력이 증가하면 액상화 저항이 감소하는 경향을 보였다. 또한 같은 압밀유효연직응력과 패각함유량에서 상대밀도가 높아질수록 액상화강도가 증가하는 것으로 나타났다.

• 한국재료학회지
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• 제3권2호
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• pp.166-174
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• 1993

반도체 소자의 표면 보호용으로 사용되는 상압 CVD 방법에 의한 PSG(Phosposilicate glass)막 및 플라즈마 CVD방법에 의한 PE-SiN(Plasma enhanced CVD S${i_2}{N_4}$)막의 항균열 특성을 알루미늄박막이 증착되어 있는 실리콘 기판위에서 조사했다. 45$0^{\circ}C$에서 30분간으 열처리를 반복하면서 균열 발생 유무 및 그 형태를 조사하여 이러한 균열의 생성을 각 막의 막응력과 관련하여 검토하였다. 이들 박막에서의 균열 발생은 하부 조직인 알루미튬배선과의 열팽창계수차에 의한 것임을 알 수 있었다. PSG막 두께가 증가할수록 인장응력이 증가하여 항균열성이 저하되었다. PSG막의 P농도가 증가할수록 막응력은 압축응력쪽으로 이동하였고 균열 발생은 억제되었다. PE-SiN 막도 높은 압축응력을 갖게 함으로써 항균열성을 향상시킬 수 있었다. 본 실험의 결과로부터 반복 열처리시 균열 발생여부에 대한 실험식을 제시하였다.

• 대한조선학회지
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• 제9권1호
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• pp.15-20
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• 1972

As the technique of resistance spot welding became more and more advanced the factors hitherto considered secondary become more and more important. Among these factors the distribution of heat and temperature during resistance spot welding is particularly important in conjunction with thermal stress, strain and residual stress, strain problems. The analytical investigations upon the transient temperature due to resistance spot welding were made for the carbon steel plate and aluminum alloy plate. The numerical values obtained by the analytical investigation are nearly identical with the temperature distribution which obtained by D.J. Sullivan and some other experimental data. It was thought therefore useful to estimate the heat effect upon the material such as a residual stress and strain, metalurgical change, change in physical properties and etc.

• Journal of Welding and Joining
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• 제16권2호
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• pp.73-83
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• 1998

This study investigated the relationships between the microstructure and the wear resistance of hardfaced iron/chromium alloys to examine the low stress abrasive wear mechanism. The effects of volume fraction of reinforcing phases(chromium carbide and eutectic phase) were studied. The alloys were deposited once or twice on a mild steel plate using a self-shielding flux cored arc welding process. The low stress abrasion resistance of he alloys against dry sands was measured by the Dry Sand/Ruber Wheel Abrasion Tester (RWAT). The wear resistance of hypoeutectic alloys, below 0.36 volume fraction of chromium-carbide phase (VFC), behaved as Equal Pressure Mode (EPM) for the inverse rule of mixture whereas the wear resistance of hypereutectic alloys, above 0.36 VFC, represented Equal Wear Mode (EWM) for the linear rule of mixture.

• 한국전자통신학회논문지
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• 제16권5호
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• pp.931-940
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• 2021

정보 관리가 조직의 주요 성공 요인으로 인식되면서, 조직은 엄격한 정보보안 정책 및 기술 도입 및 운영을 위한 투자를 높이고 있다. 그러나, 엄격한 정보보안 기술은 업무에 정보보안을 적용하는 조직원에게 기술스트레스를 발생시킬 수 있다. 본 연구의 목적은 정보보안 기술스트레스가 스트레인을 통해 정보보안 정책 저항에 미치는 영향을 제시하고, 업무기술 적합성이 기술스트레스의 영향을 완화하는 것을 확인하는 것이다. 본 연구는 선행연구를 통해 연구 모델 및 가설을 제시하였으며, 설문 조사를 통해 확보된 표본을 활용하여 구조방정식을 통한 가설검증을 하였다. 연구 결과는 정보보안 기술스트레스(과부하, 복잡성)가 정보보안 스트레인(걱정, 피로)을 통해 정보보안 정책 저항에 영향을 주었으며, 업무기술 적합성이 기술스트레스와 스트레인 간의 관계를 조절하는 것을 확인하였다. 본 연구는 정보보안 정책 및 기술의 적용 시 발생 가능한 조직원의 스트레스와 완화 방법을 제시한 관점에서 내부의 정보보안 수준 향상을 위한 전략적 방향을 제시한다.

• Toxicological Research
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• 제33권1호
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• pp.1-5
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• 2017

Nuclear factor E2-related factor 2 (Nrf2), a transcription factor, controls the expression of genes encoding cytoprotective proteins, including antioxidant enzymes that combat oxidative and electrophilic stress to maintain redox homeostasis. However, recent studies demonstrated that, in cancer, aberrant activation of Nrf2 by epigenetic alterations promotes high expression of cytoprotective proteins, which can decrease the efficacy of anticancer drugs used for chemotherapy. In this review, we summarize recent findings regarding the relationship between oxidative stress, Nrf2, epigenetic modification, and anticancer drug resistance, which should aid in development of new strategies to improve chemotherapeutic efficacy.

• 신재생에너지
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• 제6권1호
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• pp.38-45
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• 2010

Abstract Under the physical stress on photovoltaic (PV) module, it will be warped according to elongation of the front glass and then micro-crack will be occurred in the thermally sealed solar cell. This micro-crack leads to drop of short circuit current of the PV module. This is because of increase of resistance component by micro-crack. Micro-crack at specific solar cell in the module lessens the durability of PV module with reduced output, hot-spot caused by solar cell output mismatch and increased resistance component. This study shows the relation between electrical characteristics and micro- cracks due to mechanical stress on PV module.

• 한국안전학회지
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• 제23권4호
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• pp.25-29
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• 2008

Recently, new functionally graded material(FGM) that has a spatial variation in composition and properties is developed because of its good quality. This material yields the demands for resistance to corrosion and high temperature in turbine blade, wear resistance as in gears and high strength machine parts. Especially coating treatment in FGM surface brings forth a mechanical weak at the interface due to discontinuous stress resulting from a steep material change. It often, leads cracks or spallation in a coating area around an interface. The behavior of propagation cracks in FGMs was here investigated. The interface stresses were reduced because of graded material properties. Also graded material parameter with exponential equation was founded to influence the stress intensity factor. And the resistance curve with FGM coating was slightly increased.

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.