• 한국식품과학회지
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• 제40권2호
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• pp.238-242
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• 2008

Ale과 lager 효모를 이용하여 맥주발효 실험한 결과, lager 효모는 발효가 활발하게 일어나는 발효 초기에 많은 양의 황화수소를 발생하였으며 ale 효모보다 더욱 많은 양의 황화수소가 발생되었다. 효모의 증식이 활발한 발효 초기에 많은 양의 황화수소가 만들어지는 것을 보아 효모의 증식과 황화수소의 생성 사이에는 상관관계가 있음을 확인하였다. 온도 차이에 따른 실험 결과에서, lager 효모의 경우에는 발효 온도가 높은 것이 발효율이 더 높아 발효 시간을 줄일 수 있는 장점은 있으나, 많은 양의 황화수소가 발생되는 것을 알 수 있었다. 또한 APL은 $15^{\circ}C$에서 발효시켰을 때, 발효 끝 부분에서 많은 양의 황화수소가 발생되었는데, 이것은 맥주에 좋지 않은 냄새의 원인이 되므로 장시간의 숙성기간을 필요로 한다는 것을 의미한다. EA의 경우에는 낮은 온도에서 오히려 더 많은 양의 황화수소가 생성이 되었으나, HA의 경우에는 lager 효모에서와 같이 높은 온도에서 더 많은 양의 황화수소가 생성되었는데, 이는 각 효모마다 $H_2S$를 생성하기에 적합한 온도가 있음을 의미한다.

• Journal of Mechanical Science and Technology
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• 제16권7호
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• pp.919-926
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• 2002

In this study, the numerical prediction of the thermal fatigue lie? of a $\mu$BGA (Micro Ball Grid Array) solder joint was focused. Numerical method was performed using the three-dimensional finite element analysis for various solder alloys such as Sn-37%Pb, Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-3.5%Ag-3%In-0.5%Bi during a given thermal cycling. Strain values obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5%Ag with the 50-degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. A practical correlation for the prediction of the thermal fatigue life was also suggested by using the dimensionless variable γ. Additionally Sn-3.5Ag-0.75Cu and Sn-2.0Ag-0.5Cu-2.0Bi were applied to 6$\times$8$\mu$BGA obtained from the 63Sn-37Pb Solder. This 6$\times$8$\mu$BGA were tested at different aging conditions at 130$\^{C}$, 150$\^{C}$, 170$\^{C}$ for 300, 600 and 900 hours. Thickness of the intermetallic compound layer was measured thor each condition and the activation energy thor their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS ( Energy Dispersive Spectroscopy).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Microbiology and Biotechnology
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• 제27권12호
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• pp.2094-2103
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• 2017

Aging is associated with distinct changes in immune cells and a decline in immune function, leading to increased susceptibility to infection and reduced responses to vaccination. Certain strains of lactic acid bacteria exert beneficial effects on the immune system. Previously, we reported that Weissella cibaria JW15 isolated from kimchi possesses immune stimulatory activity in vitro. In the present study, we further investigated whether oral administration of JW15 improves immune function in aged mice. Eighteen-month-old female mice were administered JW15 daily at low (JW15-L; $1{\times}10^8CFU/mouse$) or high dosage (JW15-H; $1{\times}10^9CFU/mouse$), or with Lactobacillus rhamnosus GG (LGG) using oral gavage. Two-month-old female mice were included as healthy young mice. After 4 weeks, the mice were euthanized and immune profiles were analyzed using whole blood and spleen. In complete blood count analysis, the numbers of white and red blood cells were significantly increased in the JW15-L group compared with those in the old mouse (OM) control group. In addition, administration of either JW15 of LGG resulted in higher numbers of splenocytes in comparison with the OM group. Furthermore, proliferative potentials were higher in all probiotic groups than OM. Cytokines such as IFN-${\gamma}$ and IL-6 were secreted at higher levels in splenocytes isolated from JW15-fed mice than in OM control mice. Similarly, mRNA expression of various cytokines was altered in the JW15 groups. Collectively, these results suggest that JW15 supplementation induces immunomodulatory effects in aged mice and indicate JW15 as a potential probiotic strain to improve immune function in aged animals.

• Journal of Microbiology and Biotechnology
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• 제25권9호
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• pp.1532-1536
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• 2015

To investigate the memory-enhancing effect of lactic acid bacteria, we selected the probiotic mixture KF, which consisted of Lactobacillus plantarum KY1032 and Lactobacillus curvatus HY7601 (1 × 10¹¹ CFU/g of each strain), and investigated its antilipidemic and memoryenhancing effects in aged Fischer 344 rats. KF (1 × 10¹⁰ CFU/rat/day), which was administered orally once a day (6 days per week) for 8 weeks, significantly inhibited age-dependent increases of blood triglyceride and reductions of HDL cholesterol (p < 0.05). KF restored agereduced spontaneous alternation in the Y-maze task to 94.4% of that seen in young rats (p < 0.05). KF treatment slightly, but not significantly, shortened the escape latency daily for 4 days. Oral administration of KF restored age-suppressed doublecortin and brain-derived neurotrophic factor expression in aged rats. Orally administered KF suppressed the expression of p16, p53, and cyclooxygenase-2, the phosphorylation of Akt and mTOR, and the activation of NF-κB in the hippocampus of the brain. These findings suggest that KF may ameliorate age-dependent memory deficit and lipidemia by inhibiting NF-κB activation.

• 소성∙가공
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• 제7권4호
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• pp.333-339
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• 1998

Hot torsion tests were conducted to investigate the high temperature deformation behavior of $Al_{85}Ni_{10}Y_5$ alloy extrudates fabricated with amorphous ribbons. The powder metallurgy routes, hot pressing and hot extrusion were used to fabricate the extrudates. Thermal properties of amorphous ribbons with different thickness as a function of aging temperature were studied by thin film x-ray dif-fraction (XRD) and differential scanning calorimetry(DSC). The Al phase crystallite firstly formed in the amorphous ribbons and its crystallization temperature($T_x$)Was ~210${\circ}C$ During the processings of consolidation and extrusion, nano-grained structure(~100 nm) was formed in the Al85Ni10Y5 alloy extrudates. The as-extrudated Al85Ni10Y5 alloy and the $Al_{85}Ni_{10}Y_5$ alloy annealed at 250${\circ}C$ for 1 hour showed a flow curve of DRV(dynamic recovery) during hot deformation at 400-550${\circ}C$. On the other hand, the $Al_{85}Ni_{10}Y_5$ alloy annealed at 400${\circ}C$ for 1 hour showed a flow curve of DRX(dynamic recrys-tallization) during hot deformation at 450-500${\circ}C$. Also the flow stress and flow strain of the $Al_{85}Ni_{10}Y_5$ alloy extrudate annealed at 400${\circ}C$ were higher than those at 250${\circ}C$.

• Computers and Concrete
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• 제19권5호
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• pp.579-588
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• 2017

Creep and shrinkage are the main types of volume change with time in concrete. These changes cause deflection, cracking and stresses that affect durability, serviceability, long-term reliability and structural integrity of civil engineering infrastructure. Although laboratory test may be undertaken to determine the deformation properties of concrete, these are time-consuming, often expensive and generally not a practical option. Therefore, relatively simple empirically design code models are relied to predict the creep strain. This paper reviews the accuracy of creep and shrinkage predictions of reinforced concrete (RC) shear walls structures strengthened with carbon fibre reinforced polymer (CFRP) plates, which is characterized by a widthwise varying fibre volume fraction. This review is yielded by three commonly used international "code type" models. The assessed are the: CEB-FIP MC 90 model, ACI 209 model and Bazant & Baweja (B3) model. The time-dependent behavior was investigated to analyze their seismic behavior. In the numerical formulation, the adherents and the adhesives are all modelled as shear wall elements, using the mixed finite element method. Several tests were used to demonstrate the accuracy and effectiveness of the proposed method. Numerical results from the present analysis are presented to illustrate the significance of the time-dependency of the lateral displacements and eigenfrequencies modes.

• Elastomers and Composites
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• 제43권3호
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• pp.173-182
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• 2008

고무나 우레탄과 같은 고 탄성력을 이용하여 튜브를 임의의 형상으로 성형하는 고 탄성체 성형방법은 타 공정에 비해 높은 치수 정밀도와 생산 공정의 단축, 에너지 절감 등을 기대할 수 있는 차세대 성형기술이라 할 수 있다. 본 연구에서는 탄성체에 대한 소재 물성시험과 특성평가를 통해 고 탄성체 성형에 적합한 소재를 선정하고 시험으로 얻어진 응력-변형률을 이용하여 비선형 재료상수를 결정하여 성형해석에 필요한 물성 데이터를 확보하였다. 또한, 랙튜브에 대한 유한요소해석을 통해 탄성체의 두께변화에 따른 공정변수의 영향을 검토하였다.

• 한국주조공학회지
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• 제36권1호
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• pp.1-9
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• 2016

Improvement of the mechanical properties of a commercial aluminium casting alloy, A356, was achieved through an optimised combination of alloying elements, modification, and heat treatment. 0.7 wt.% Cu and an additional 0.2 wt.% Mg were added to an Al-7Si-0.35Mg alloy for strengthening at both room and elevated temperatures, whilst a subsequent decrease in the ductility was compensated for by the modification of eutectic Si by Sr addition at a level of up to 110 ppm. It was found that the dissolution of Cu-rich or Mg-rich phases could be maximised by solid-solutionising an alloy with 40 ppm Sr at $530^{\circ}C$, increasing the tensile and yield strengths to 350 MPa and 297 MPa, respectively, with a reasonably high strain of 5% after peak-aging at $210^{\circ}C$. Further addition of Sr up to 110 ppm is, however, more likely to interfere with the dissolution of the Cu-rich or Mg-rich phases during solid solution treatment, resulting in a slight decrease in both tensile and yield strengths at room temperature. Besides the Cu addition, such undissolved phases, on the other hand, may contribute to elevated temperature strength at $200^{\circ}C$.