• 한국세라믹학회지
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• 제32권12호
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• pp.1377-1382
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• 1995

A high-resolution transmission electron microscopy study on the lattice defects formed in the high energy P ion implanted silicon was carried out on an atomic level. Results show that Lomer dislocations, 60$^{\circ}$perfect dislocations, 60$^{\circ}$ dislocation dipole and extrinsic stacking fault formed in the near Rp of as-implanted specimen. In the annelaed specimens, interstitial Frank loops, 60$^{\circ}$perfect disolations, 60$^{\circ}$dislocation dipoles, stacking faults, precipitates, perfect dislocation loops and <112> rodlike defects existed exclusively near in the Rp with various annealing temperature and time. From these results, it is concluded that extended secondary defects as well as the point defect clusters could be formed without annealing. Even at low temperature annealing such as 55$0^{\circ}C$, small interstitial Frank loops could be formed and precipitates were also formed by $700^{\circ}C$ annealing. The defect band annealed at 100$0^{\circ}C$ for 1 hr could be divided into two regions depending on the distribution of the secondary defects.

• 한국진공학회지
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• 제9권3호
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• pp.267-272
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• 2000

electroplating(EP)법을 이용하여 ULSI용 Cu 박막을 제조하였다. seed Cu는 sputtering으로 증착하였으며, 확산방지막으로 TaN를 사용하였다. 제작된 EP Cu 박막은 seed Cu의 영향으로 열처리 조건에 관계없이 Cu(111)방향으로 강하게 우선 배향 하였다. 열처리 온도와 시간이 증가함에 따라 Cu박막의 미세조직이 non-columnar structure에서 약 2배 이상 결정립 성장하여 columnar structure로 바뀌었으며, 또한 as-deposit시 관찰되었던 stacking fault, twin, dislocation들이 상당히 줄어드는 것이 관찰되었다. Cu의 확산에 의하여 생기는 copper-silicide는 관찰할 수 없었으며, 이것은 두께 45nm의 TaN막이 $450^{\circ}C$, 30분 열처리시 확산방지막으로 충분한 역할을 한 것으로 판단된다. Cu(111)우선 배향과 열처리에 의한 결정립 성장 및 defect감소는 Cu 박막의 결정립계에서 발생하는 electromigration 현상을 상당히 줄일 수 있을 것으로 판단된다.

• Applied Microscopy
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• 제25권3호
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• pp.75-81
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• 1995

이상과 같은 실험에서 다음과 같은 사실을 요약할 수 있다. 1) ZnSSe/GaAs 에피층에는 많은 양의 적층결함과 전위 등의 결정결함이 존재하고 이들은 표면부 보다는 계면부에 더 많이 존재한다. 그러나 에피층은 기판과 pseudomorphic 성장을 이루고 있다. 2) ZnSSe/GaAs 계면에는 5nm 크기의 높이차가 나는 굴곡이 존재하며 ZnSe 버퍼 층에 관계없이 적층결함이 존재하고, 에피층 결정이 약간 기울어져서 므와레 줄무늬 패턴도 존재한다. 3) ZnSSe/GaAs 계면에는 성장 중에 S의 침투로 인한 <111>방향으로 피트가 형성되었음이 관찰되었고 이는 결함 생성 소스로 작용한다 4) 15nm 높이차가 나는 계면이 발견되었으나 기판과 정합을 이루고 있고 주변에는 적층결함도 존재하지 않는다. 그러나 미세한 므와레 줄무의형태가 존재하였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.91-91
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• 2003

Sliding wear behaviors of Inconel 600 and 690 were investigated at room temperature in air. In the present study, Archard's equation which has low reliability was modified. In the prediction of wear volume by Archard's equation, the reliabilities of Inconel 600 and 690 were about from 26.3% to 45.7% and from 69. l% to 88.6%, respectively, The sliding wear behaviors of Inconel 600 and 690 turned out to be influenced by their stacking fault energy, and the fact was confirmed by using TEM and micro-hardness test Based on experimental results, the wear coefficient was modified as a function of the sliding distance. The calculation with the modified wear equation showed that the reliability of Inconel 600 tested with 409 ferritic stainless steel increased from 45.7% to 93.4%.

• 한국자동차공학회논문집
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• 제2권2호
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• pp.95-102
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• 1994

Aluminum sheet application to automobile body panels has now become an important objective to meet the requirements of automobile weight reduction. As the Mg content in Al-Mg based alloys increased up to 7.19%, the strength and elongation increased. For instance. Al-7.19Mg alloy had a high strength of 305MPa and a high elongation of 35%. A study was also made to investigate the interrelation between grain size and tensile properties with varying the contents of Mg, Ti and Zr elements and annealing conditions. The yield stress decreased as the grain size increased, which increased the uniform elongation. The strain hardening exponents n increased as the Mg content increased, which depended on the increasing difficulties of the cross slip of dislocation.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 춘계학술발표대회 논문집
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• pp.121-124
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• 2003

This paper shows shear wave behavior of CFRP(carton fiber reinforced plastics) composite laminates as a polar grid form to evaluate vibration pattern of ultrasonic transducers, which gives measured modelling fundamental contents of nondestructive evaluation. This modelling decomposes the transmission of a linearly polarized wave into orthogonal components through each ply of a laminate. It is found that a high probability shows between the model and measurement system in characterizing lay up of CFRP composite laminates. Also evaluating quantitatively the defects in CFRP laminates who found to be possible of normalized frequency obtained from 2D-FFT technique based on C-scan method. Thus, the technique is proven to be one of the useful means to evaluate any internal defect in CFRP composite laminates.

• 소성∙가공
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• 제18권6호
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• pp.476-481
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• 2009

The present work demonstrates the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal channel angular pressing(ECAP). From transmission electron microscope observation, the resulting microstructures of Cu-3%Ag alloy deformed by ECAP for 8-pass or more consist of reasonably fine, equiaxed grains without having a strong preferred orientation, suggesting that microstructure evolution is slower than that of pure-Al and its alloys owing to low stacking fault energy. The results of room temperature tension tests reveal that, as the amount of applied strain increases, the tensile strength of submicrocrystalline Cu-3%Ag alloy increases whereas losing both the ductility and the electrical conductivity. Such phenomenon can be explained based on microstructure featured by the non-equilibrium grain boundaries.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 춘계학술대회 논문집
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• pp.393-396
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• 2009

The mechanical properties, press formability and texture of a TWIP steel were investigated. This steel combines both high strength and high ductility due to so called TWIP effect which are related to the microstructural changes. The formation of twins during deformation leads to an increase of its mechanical properties. In this study, the texture and mechanical properties evolutions of a TWIP steel subjected to tensile tests and press trials at room temperature were investigated in relation to the feasibility of the application to automotive body parts.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 C
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• pp.1510-1512
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• 2000

Due to the shrinking of the chip size and increasing of the complexity in the modern electronic devices. the defect of wafer are so important to decide the yield in the device process. The engineers has studied the wafer defects and the characteristics. They published lots of the experimental methods. I did an experiment the gettering effect of the defects due to the high temperature and the long time diffusion. Actually, As the thickness of the wafer backside polysilicon is thicker and the diffusion time is faster. the defects on the wafer are decreased. The polysilicon gram boundaries of the wafer backside played an important part as the defect gettering site.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2001년도 제33회 춘계학술대회 개최
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• pp.115-121
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• 2001

The wear test has been performed to evaluate the wear mechanism of steam generator (SG) tube materials against ferritic stainless steel in water environment. The wear rates of SG tube materials depend on the change of mechanical properties between contact surfaces during wear test. From the subsurface hardness test, Inconel 690 is more work-hardened than Inconel 600 even though these materials have similar hardness values before the wear test. Main cause is due to the difference of stacking fault energy with the chromium content. In water environment, wear mechanism is closely related with the continuous formation and fracture of deformation layers at the contact surfaces.