• 한국전기전자재료학회논문지
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• 제26권6호
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• pp.425-428
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• 2013

In this paper, we present a novel hydrophilic coating material (Wellture Finetech, Korea) which can be utilized as a coating layer for anti-contamination for electrical and electronic system. The coating material was deposited on 4 inch silicon wafer with several different film thickness. The film thickness was controlled by spin coating speed. After curing of the film, we have scratched by permanent marker to check self-cleaning property of the film. Also we have executed several mechanical tests of the films. As the spin coating speed is increased, the film thickness was thinned from 230 nm to 125 nm. Contact angle of the film was lowered from $30^{\circ}$ to $12^{\circ}$ as the spin coating speed is increased from 700 to 2,500 rpm. On permanent marker scratched film surface coated at 1,000 rpm, we have poured regular city water to investigate self cleaning property of the film. The scratches were gradually separated from the film surface due to super-hydrophilicity of the film. Hardness of spin coated film was 9H measured by ASTM D3363 method. and adhesion of all film was 5B tested by ASTM D3359 method. Also, to get exact hardness value of the film, we have utilized a nano-indenter. As spin speed is increased, the hardness of film was increased from 3 GPa to 5 GPa.

• Transactions on Electrical and Electronic Materials
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• 제12권2호
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• pp.80-83
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• 2011

We have fabricated phosphorescent white organic light-emitting devices (WOLEDs) with a spin-coated poly(Nvinylcarbazole) [PVK] host layer. Iridium(III) bis[(4,6-difluorophenyl)-pyridinato-N,$C^{2'}$]picolinate (FIrpic), tris(2-phenylpyridine)iridium(III) [$Ir(ppy)_3$], and tris(2-phenyl-1-quinoline)iridium(III) [$Ir(phq)_3$], were used as the blue, green, and red guest materials, respectively. The PVK was mixed with FIrpic, $Ir(ppy)_3$, and $Ir(phq)_3$ molecules in a chlorobenzene solution and spin-coated in order to prepare the emission layer; 3-(4-biphenylyl)-4-phenyl-5-(4-tertbutylphenyl)-1,2,4-triazole (TAZ) was used as an electron transport material. The resultant device structure was ITO/PVK:FIrpic:$Ir(ppy)_3:Ir(phq)_3$/TAZ/LiF/Al. The electroluminescence, efficiency, and electrical conduction characteristics of the WOLEDs based on the doped PVK host layer were investigated. The maximum current efficiency of the three wavelength WOLED with the doped PVK host was 19.2 cd/A.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1388-1390
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• 2007

This paper investigates how various concentrations of lithium ion influence on crystallization of MgO in thin films formed by spin coating and an the discharge characteristic in a flat fluorescent lamp structure. The XRD results indicate $Li^+$ ion enhances the growth of MgO crystal in a spin coated thin film. The discharge property with the $Li^+$ ion doped MgO films show the lithium ion in MgO film clearly reduce the initial discharge voltages of test devices. Interestingly, the test panels with various doped MgO film have somewhat higher static memory margin of than that of pure-MgO owing probably to the pore structure of spin coated MgO films. The CL spectra, which confirm that the doping creates defects energy levels in the band gap of MgO, show the $F^+$ center is the main defects in doped MgO films.

• 전기학회논문지
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• 제58권11호
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• pp.2214-2218
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• 2009

Dye-sensitized solar cell (DSC) has been considered as a possible alternative to current silicon based p-n junction photovoltaic devices due to its advantages of high efficiency, simple fabrication process and low production cost. Numerous researches for high efficient DSC in the various fields are under way even now. Among them, the compact layer, which prevents the back electron transfer between transparent conductive oxides and the redox electrolyte, is fabricated by various methods such as a ZnO dip-coating, $TiCl_4$ dip-coating, and Ti sputtering. In this study, we tried to fabricate the $TiO_2$ compact layer by the spin-coating method using aqueous $TiCl_4$ solution. The effect of the spin-coating method was checked as compared with conventional dip-coating method. As a result, DSC with a spin-coated compact layer had 33.4% and 6% better efficiency than standard DSC and DSC with a dip-coated compact layer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 추계학술대회 논문집
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• pp.48-51
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• 1997

(Pb. La)TiO$_3$ thin films were fabricated by sol-gel Processing and spin-coated on the Pt substrate. The spin-coated PLT films were sintered at 75$0^{\circ}C$ for 5min by rapid thermal ann La content dependence of the electrical properties of the PLT thin films are discussed. Wit La mole% from 20 to 36mo1e%. the dielectric constant of the PLT thin films decreased f 570. P-E hysteresis loops changed from ferroelectric to paraelectric. and the charge storage charging time decreased. The Curie Point decreased with increasing La content. The leak density also decreased and La 36mo1% species shows mood characteristics less than 10- electric field 500 (KV/cm) Because of the broad range of composition-controlled ferroelectric PLT thin films are suitable for memory application.

• 전자공학회논문지
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• 제50권7호
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• pp.102-108
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• 2013

용액 공정 기반으로 유기 전자소자를 제작할 시, 회전 도포 방법을 이용하는데 이 방법의 단점 중의 하나는 후속 회전 도포할 때 용액 속의 용매에 의해 이미 제작된 유기 박막을 물리적 또는 화학적인 손상을 입힐 수 있다는 것이다. 이러한 문제들로 인해 후속적인 박막 제조에 사용될 수 있는 용매의 종류는 매우 제한적일 수 밖에 없다. 본 논문에서는 기존에 알려진 용매들의 적절한 조합으로 인해 다층 박막 제작이 가능함을 보이고, 이를 이용하여 용액 공정 기반 유기 트랜지스터를 제작하여 성능의 향상을 보일 것이다. 트랜지스터의 구조는 하부 게이트 하부 접촉 (bottom gate, bottom contact) 구조로 제작되었고 게이트 절연체는 강유전체 고분자로 제작되었는데 한 번의 회전 도포 방법과 두 번의 회전 도포 방법으로 동일 두께를 형성하여 두 트랜지스터를 제작, 드레인 전압에 따른 소스-드레인 전류를 비교하였다. 그 결과 소스-게이트 누설 전류 감소 효과가 있었고, ON 상태에서의 소스-드레인 전류의 상승효과도 관찰되었다. 전류-전압 그래프로부터 계산된 이동도는 약 2.7배 증가되었다. 그러므로 용액 공정 기반 전계효과 트랜지스터를 제작할 시, 게이트 절연체를 다층 구조로 제작하면 성능 향상에 이점이 많다는 것을 알 수 있었다.

• Journal of Electrochemical Science and Technology
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• 제11권2호
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• pp.180-186
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• 2020

In this work, a metal-ligand solution (Cu-EDTA) was prepared based on the molecular precursor method and the solution was spin-coated onto 3D printed flexible photosensitive resin sheets. After being processed by microwave, a laser with a wavelength of 355 nm was utilized to scan the spin-coated sheets and then the sheets were immersed in an electroless copper plating solution to deposit copper wires. With the help of microwave processing, the adhesion between copper wires and substrate was improved which should result from the increase of roughness, decrease of contact angle and the consistent orientation of coated film according to the results of 3D profilometer and SEM. XPS results showed that copper seeds formed after laser scanning. Using the 3D printed flexible sheets as cathode and galvanized iron as anode, electrochemical machining was conducted.

• 한국결정성장학회지
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• 제11권6호
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• pp.252-258
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• 2001

($Ba_{0.7}Sr_{0.3})TiO_3$박막을 ITO-coated glass 기판위에 spin-coating법으로 제조하였다. 제조된 용액을 초음파 bath 내에서 초음파 처리하여 균일화를 촉진시킨 후 박막을 제조하여 초음파 처리하지 않은 용액으로 제조한 박막과의 비교를 통하여 초음파 효과를 알아보았다. 용액의 초음파 처리로 박막의 결정화 온도를 다소 낮추었으며 박막의 표면이 보다 균일하고 치밀화되었고 거칠기도 8.4nm에서 5.6nm로 더 낮아졌다. 그리고 박막의 투광성 및 전기적 특성 또한 용액의 초음파 처리로 인하여 향상되었다.

• Korea-Australia Rheology Journal
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• 제14권2호
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• pp.71-76
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• 2002

Metal thin films, which are indispensable constituents of ULSI (Ultra Large Scale Integration) circuits, have been fabricated by physical or chemical methods. However, these methods have a drawback of using expensive high vacuum instruments. In this work, the fabrication of tungsten metal film by spin coating was investigated. First of all, inorganic peroxopolytungstic acid (W-IPA) powder, which is soluble in water, was prepared by dissolving metal tungsten in hydrogen peroxide and by evaporating residual solvent. Then, the solution of W-IPA was mixed with organic solvent, which was spin-coated on wafers. And then, tungsten metal films, were obtained after reduction procedure. By selecting an appropriate organic solvent and irradiating UV, the sheet resistance of the tungsten metal film could be remarkably reduced.

• 한국진공학회지
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• 제9권1호
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• pp.69-75
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• 2000

We have investigated the feasibility of spin on glass (SOG) film from polysilazane-type resin as a premetal dielectric (PMD) layer of the next-generation ultra-large scale integrated (ULSI) devices. A commercial polysilazane resin and a polysilazane-type resin with oxidizing agent were spin-coated and cured to form SOG films. In order to study the effect of oxidizing agent and annealing, the SOG films were characterized as cured and after annealing at $400^{\circ}C$ to $900^{\circ}C$. the density and the resistance against wet chemical of the SOG films were improved by the addition of oxidizing agent, because oxidizing agent enhanced the conversion from polysilazane polymer to $SiO_2$. The hole profile issue associated with insufficient curing of polysilazane in narrow gaps was also resolved by oxidizing agent, while the gapfill capability of SOG was not deteriorated by oxidizing agent.