• 한국안전학회지
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• 제14권3호
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• pp.134-139
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• 1999

In this study, PSII(plasma source ion implantation) was used to improve the biocompatibility of bone-anchored Ti implant. According to potentiodynamic anodic polarization test in deaerated Hank's solution, open circuit potential of ion implanted specimens were increased compare to that of unimplanted specimen ; besides, passive current density and critical anodic current density of ion implanted specimens were lower than unimplanted specimen.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 춘계학술대회 논문집 전력기술부문
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• pp.290-293
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• 2001

This paper presents the reach accuracy of a distance relay for protection of transmission line according to power system conditions. The apparent impedance of distance relay is considerably affected by source impedance, load current, power factor, fault point and resistance etc. For protective coordination on the variables power system parameters, trip characteristics of distance relay at sending and receiving terminal are discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 춘계학술대회 논문집
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• pp.10-10
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• 2010

The solar cell energy is considered as a clean energy source in the world. However, because the output of solar cell is not constant, it needs to study the relationships of the DC voltage, the DC current and the DC power of the solar cell. This paper presents the solar cell output characteristics and the maximum power point of the solar cell under different irradiation conditions.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.181-183
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• 2006

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권1호
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• pp.1-11
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• 2004

A FinFET, a novel double-gate device structure is capable of scaling well into the nanoelectronics regime. High-performance CMOS FinFETs , fully depleted silicon-on-insulator (FDSOI) devices have been demonstrated down to 15 nm gate length and are relatively simple to fabricate, which can be scaled to gate length below 10 nm. In this paper, some of the key elements of these technologies are described including sub-lithographic pattering technology, raised source/drain for low series resistance, gate work-function engineering for threshold voltage adjustment as well as metal gate technology, channel roughness on carrier mobility, crystal orientation effect, reliability issues, process variation effects, and device scaling limit.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1197-1199
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• 2009

Self-alignment for the fabrication of printed thin film transistors has become of great interest because of the resolution and registration limits of printing technologies. In this work, self-patterning and selfregistration processes are introduced, which do not need surface energy patterning and the resulting minimum gate channel length could be down to $11.2{\mu}m$ with the sheet resistance of 2.6 ${\Omega}/{\square]$ for the source and drain electrodes.

• Journal of Advanced Marine Engineering and Technology
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• 제12권1호
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• pp.37-45
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• 1988

A calculating method of transient temperature distribution due to spot welding of thin plates is studied in this paper. Considering the contact stress between upper and lower plate and temperature-dependence of specific resistance and elastic limit of base metal, the model of calorific density of heat source was decided. Using 2-dimensional polar coordinates system, the governing equation of heat transfer was developed. The thermal cycles of various points were recorded using C-A thermocouples during spot welding procedure for mild steel plates of 1mm thickness, and those results were compared with the results of calculations presented in this paper.

• 한국자기학회지
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• 제5권5호
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• pp.567-569
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• 1995

By using the ac field source which can change the applied field magnitude, frequency and dc offset field, the dynamic magnetoresistance characteristics of permalloy based multilayers which have different R-H(resistance-magnetic field) curves were monitored and compared with static magnetoresistance curves that were measured with electromagnet of VSM. Output of each sample according to the external field strength was identified and optimum bias position could be obtained.

• 농업과학연구
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• 제16권1호
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• pp.1-18
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• 1989

본(本) 시험(試驗)은 일본형수도품종(日本型水稻品種)의 도열병저항성(稻熱病抵抗性) 내력(來歷)을 밝히고 밭못자리 검정(檢定)에서 잎도열병(稻熱病)의 저항성(抵抗性) 반응(反應)에 따라 수도품종(水稻品種)을 분류(分類)하기 위(爲)하여 수행하였다. 1. 일진(日進), 천척(千拓) 9 호(號), 고실(高失), 배달(倍達), 팔달(八達), 재건(再建), 신풍(新豊)의 저항성(抵抗性)은 구대내조성욱(九大耐潮性旭) 3 호(號)에서 유래(由來)되었으며 조광(潮光)과 팔금(八錦)은 쌍엽에서, 광명(光明)벼와 영덕(盈德)벼는 2067에서 각각(各各) 유래(由來)되었다. 2. 관옥(關玉)의 저항성(抵抗性)은 관동(關東) 55 호(號), 만경(萬頃)은 조광(潮光)과 Kusabue, 농백(農白)의 저항성(抵抗性)은 석수백모(石狩白毛)에서 각각(各各) 유래(由來)되었다. 3. 섬진(蟾津)벼와 신선(新鮮)찰벼, 도봉(道峰)배, 탐진(耽津)벼의 도열병저항성(稻熱病抵抗性)은 밀양(密陽) 20 호(號)에서, 진주(眞珠)벼와 대청(大晴)벼는 HR769 또는 HR1590에서 유래(由來)되었다. 4. 도봉(道峰)벼의 도열병저항성(稻熱病抵抗性)은 Tjina, 관악(冠岳)벼는 Kongo, 치악(雉岳)벼는 Kuik 90에서 각각(各各) 유래(由來)되었다. 5. 설악(雪嶽)벼, 서남(西南)벼, 기호(畿湖)배, 남양(南陽)벼, 서해(西海)벼, 화성(花成)벼, 대관(大關)벼, 대성(大成)배의 도열병저항성(稻熱病抵抗性)은 Fuji280에서 소백(小白)벼, 오대(烏臺)벼, 운봉(雲峰)벼는 Fuji 269에서 각각(各各) 유래(由來)되었다. 6. 천마(天摩)벼와 백암(白岩)벼의 도열병저항성원(稻熱病抵抗性源)은 $BL_7$과 농백(農白)에서 동진(東津)벼와 상풍(常豊)뼈의 도열병저항성(稻熱病抵抗性)은 Satominori와 Simokita에서 유래(由來)되었다. 7. 일본형수도품종(日本型水稻品種)은 도열병반응(稻熱病反應)에 따라 진흥(振興) 품종군(品種群)에 8 품종(品種), 동진(東津)벼 품종군(品種群)과 진주(眞珠)벼 품종군(品種群)에 각각(各各) 2 품종(品種), 관악(冠岳)벼 품종군(品種群)에 3품종(品種), 소백(小白)벼 품종군(品種群)에 4 품종(品種), 농백(農白) 품종군(品種群)에 1 품종(品種), 백암(白岩)벼 품종군(品種群)에 2 품종(品種), 신선(新鮮)찰벼 품종군(品種群)에 5 품종(品種), 서남(西南)벼 품종군(品種群)에 5 품종(品種), 대성(大成)벼 품종군(品種群)에 2 품종(品種), 그 밖에 낙과(落果)벼, 품종군(品種群)으로 분류(分類)하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 추계학술대회 논문집 전기설비전문위원
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• pp.93-96
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• 2004

In this paper, we analyzed the current limiting characteristics according to increase of source voltage in the flux-lock type high-Tc superconducting fault current limiter (SFCL). The flux-lock type SFCL consisted of two coils, which were wound in parallel each other through an iron core, and high-Tc superconducting (HTSC) element connected with coil 2 in series. The flux-lock type SFCL has the characteristics better in comparison with the resistive type SFCL because the fault current in the flux-lock type SFCL can be divided into two coils by the inductance ratio of coil 1 and coil 2. The fault current limiting operation of the flux-lock type SFCL can be different due to winding direction of the two coils. The winding method where the decrease of linkage flux between two coils in the accident happens is called the subtractive polarity winding and the winding method in case of the increase of linkage flux is called the additive polarity winding. The fault current limiting experiments according to the source voltage were performed for these two winding methods. Through the comparison and the analysis of the experimental data, we confirmed that the quench time was shorter, irrespective of the winding direction as the source voltage increased and that the fault current and the HTSC's resistance increased as the amplitude of the source voltage increased. The additive polarity winding made the fast quench time and the lower resistance of HTSC element in comparison with the subtractive polarity winding. The fault current of the subtractive polarity winding was larger than that of the additive polarity winding. In conclusion, we found that the additive polarity winding reduced the burden of SFCL because the quench time was shorter and the fault current was smaller than those of the subtractive polarity winding.