• Journal of IKEEE
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• v.19 no.4
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• pp.514-519
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• 2015

We propose the multiple gate structure of double gate junctionless metal oxide silicon field oxide transistor (JL MOSFET) for device optimization. Since different workfunction within multiple metal gates, electric potential nearby source and drain region is modulated in accordance with metal gate length. On current, off current and threshold voltage are influenced with gate structure and make possible to meet some device specification. Through the device simulation work, performance optimization of double gate JL MOSFETs are introduced and investigated.

• Journal of IKEEE
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• v.16 no.2
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• pp.127-130
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• 2012

In this paper, we reported on a single balanced monolithic diode mixer using Marchand balun for millimeter-wave applications. The single balanced monolithic mixer was fabricated using drain-source-connected pseudomorphic high electron mobility transistor (PHEMT) diodes considering the PHEMT MMIC full process. The average conversion loss is 16 dB in the RF frequency range of 81~86 GHz at LO frequency of 75 GHz with LO power of 10 dBm. The RF-to-LO isolation characteristics are greater than -30 dB and the total chip size is $1.0mm{\times}1.35mm$.

• Journal of IKEEE
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• v.21 no.4
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• pp.375-380
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• 2017

A differential current-to-time interval converter is presented for current mode sensors. It consists of a ramp voltage generator, a current mode sensor, a reference current source, two current-tunable Schmitt triggers, a one-shot multivibrator, and two logic gates. The design principle is to apply a ramp voltage to each input of the two current-tunable Schmitt triggers whose threshold voltages are proportional to the drain current values of the current mode sensors. A proposed circuit converts a current change in the ISFET biosensor into its equivalent pulse width change. A prototype circuit built using TSMC 0.18 nm CMOS process exhibit a conversion sensitivity amounting to $726.9{\mu}s/pH$ over pH variation range of 2-12 and a linearity error less than ${\pm}0.05%$.

• Journal of Magnetics
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• v.7 no.1
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• pp.4-8
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• 2002

The magnetoresistance (MR) and the magnetization reversal of a lateral spin-injection device based on a spin-polarized field effect transistor (spin FET) have been investigated. The device consists of a two-dimensional electron gas (2DEG) system in an InAs single quantum well (SQW) and two ferromagnetic $(Ni_{80}Fe_{20})$ contacts: all injector (source) and a detector (drain). Spin-polarized electrons are injected from the first contact and, after propagating through the InAs SQW are collected by the second contact. By engineering the shape of the permalloy contacts, we were able to observe distinct switching fields $(H_c)$ from the injector and the collector by using scanning Kerr microscopy and MR measurements. Magneto-optic Kerr effect (MOKE) hysteresis loops demonstrate that there is a range of magnetic field (20~60 Oe), at room temperature, over which the magnetization in one contact is aligned antiparallel to that in the other. The MOKE results are consistent with the variation of the magnetoresistance in the spin-injection device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.445-448
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• 1999

In this Paper, we present simple physical model of the Capacitance characteristics for GaAs MESFET\`s in wide temperatures. In this model, gate-source and gate-drain capacitances are represented by analytical expressions which are classified into three different regions for bias voltage. This model contained the temperature dependent variable that is the built-in voltage and the depletion width. Using the equations obtained in this work a submicron gate length MESFET has simulated and theoretical result are in good agreement with the experimental measurement.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.775-778
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• 1987

Double-diffused metal oxide power semiconductor field effect transistors are used extensively in recent years in various circuit applications. The temperature variation of the drain current at a fixed bais shows both positive and negative resistance characteristics depending on the gate threhold voltage and gate-to source bias voltage. In this study, the decision method of the internal temperature measurement by $V_{GS}$ and $V_{DS}$ are presented.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.1
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• pp.26-29
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• 2006

Transparent ZnO thin films were prepared by KrF pulsed laser deposition (PLD) technique and applied to a bottom-gate type thin film transistor device as an active channel layer. A high conductive crystalline Si substrate was used as an metal-like bottom gate and SiN insulating layer was then deposited by LPCVD(low pressure chemical vapour deposition). An aluminum layer was then vacuum evaporated and patterned to form a source/drain metal contact. Oxygen partial pressure and substrate temperature were varied during the ZnO PLD deposition process and their influence on the thin film properties were investigated by X-ray diffraction(XRD) and Hall-van der Pauw method. Optical transparency of the ZnO thin film was analyzed by UV-visible phometer. The resulting ZnO-TFT devices showed an on-off ration of $10^6$ and field effect mobility of 2.4-6.1 $cm^2/V{\cdot}s$.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.339-343
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• 1999

This paper reports the characteristics of poly-Si TFT unitary CMOS circuits fabricated with various techniques, in order to investigate the optimum process conditions. The active films were deposited by PECVD and LPCVD using $SiH_4\; and\; Si_2H_6$ as source gas, and annealed by SPC and ELA methods. The impurity doping of the oource and drain electrodes was performed by ion implantation and ion shower. In order to investigate the AC characteristics of the poly-Si TFTs processed with various methods, we have examined the current driving characteristics of the polt-Si TFT and the frequency characteristics of 23-stage CMOS ring oscillators. Ithas been observed that the circuits fabricated using $Si_2H_6$ with low-temperature process of ELA exhibit high switching speed and current driving performances, thus suitable for real application of large area electronics.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.1
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• pp.20-25
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• 2006

We suggest a novel temperature detection method utilized in temperature monitoring system. Suggested method detects temperature variation by using $R_{ds(on)}$ characteristics of MOSFET, while conventional methods are using extra devices such as a temperature sensor or an over-temperature detection transistor. For voltage detection between drain and source, 10 bits resolution ADC is needed. Therefore possible measurement signal range is about ten mV. If detected temperature's voltage exceed protection temperature's voltage then controller generates OT (Over Temperature) signal to stop MOSFET's trigger signal. Whole process of measurement is controlled by software. Experimental results show that the developed temperature monitoring system can provide the suitable temperature monitoring method and difference between detected and data sheet value of the suggested system is about $3\%$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1990.10a
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• pp.55-59
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• 1990

N-Channel polysilicon MOSFETs (W/L=20/1.5, 3, 5.10$\mu\textrm{m}$) were fabricated using RTP(Rapid Thermal Processor) and hydrogen passivation. The N+ Source, drain and gate were annealed and recrystallized using RTP at temperature of 1000$^{\circ}C$-1100$^{\circ}C$. But the active areas were now specially crystallized before growing the gate oxide. Without the hydrogen passivation, excellent transistor characteristics (ON/OFF=5${\times}$10$\^$6/, s=85mv/dec, I$\_$L/=51pA/$\mu\textrm{m}$) were obtained for 1.5$\mu\textrm{m}$ MOSFET. Also the transistor characteristics were improved by hydrogen passivation.