• Applied Chemistry for Engineering
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• v.20 no.2
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• pp.172-176
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• 2009

In this research, we defined the basic structure of soft etching material as $H_2SO_4/H_2O_2$, and used additives as inhibitor, surfactant, and stabilizer. By analyzing influence to surface roughness and change of etching rate related to type and density of additives, we research to develop soft etching material having the same adhesiveness as existing etching material. As a result of research, it is estimated that after densities of $H_2O_2$ and $H_2SO_4$ are 3%, 4% respectively, 500 ppm of amine type 5-Azol, as inhibitor, and 600 ppm of PEI, as surfactant, and 10 ppm of phosphoric acid, as stabilizer, are added, is the most reasonable surface roughness and etching rate. As result of solder test, it is estimated that solder resist ink did not peel away or curl up and have reliable adhesiveness.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.188-190
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• 2004

As an effort to reduce cost and lead-time and to increase flexibility and responsiveness, manufacturers are using digital printing in numerous process steps. Typically, these processes require the precise dispensing of various fluids. Piezo ink jet printheads are proving to be reliable tools for depositing active materials such as light emitting polymers (LEP) for mobile phone displays and color filter inks for liquid crystal displays. Ink jets are also being used to provide uniform coatings of polyimide alignment layers and spacers for LCDs. Success with legend printing on PCBs using ink jets has encouraged the design of equipment for directly printing both etch resist and solder mask for PCBs. Development of printers for passive components such as capacitors and resistors is underway. This paper will present the attributes of an ink jet printhead designed to a precision deposition tool and discuss how it is being used to digitally print electronic and flat panel display components. Status of commercialization of digital printing will be discussed along with issues to be resolved before wide adoption takes place.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.

• Journal of Advanced Technology Convergence
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• v.2 no.4
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• pp.1-6
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• 2023

Research on power inductor surface UV printing equipment using cylindrical magnets can prevent damage to quality consumable materials (making plates, Squeegees) during printing and improve printing quality by applying technology to prevent product from flipping or standing up when fixing the product by making the magnetic formation of cylindrical magnets form up and down. The development of cylindrical magnets that changed the direction of magnetic force will stabilize the fixing method for metal products made by powder compression, increasing the production capacity for small products. Finally, by studying the power inductor surface UV printing device using cylindrical magnets, it can be differentiated from the spray and deeping methods that were being worked on, production will be greatly improved, and as a result, cost reduction and competitive production will be possible.