Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
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Study on Soft Etching Material Development to Improve Peel Strength between Surface of Copper and Solder Resist Ink

구리 표면과 Solder Resist Ink 사이의 밀착력 향상 위한 Soft Etching제 개발을 위한 연구

  • Kang, Yun-Jae (Department of Chemical Engineering & Biotechnology, Korea polytechnic University) ;
  • Hong, Min-Eui (ITMC) ;
  • Kim, Duk-Hyun (Department of Chemical Engineering & Biotechnology, Korea polytechnic University)
  • 강윤재 (한국산업기술대학교 생명화학공학과) ;
  • 홍민의 ((주)ITMC) ;
  • 김덕현 (한국산업기술대학교 생명화학공학과)
  • Received : 2009.01.08
  • Accepted : 2009.02.04
  • Published : 2009.04.10
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Abstract

In this research, we defined the basic structure of soft etching material as $H_2SO_4/H_2O_2$, and used additives as inhibitor, surfactant, and stabilizer. By analyzing influence to surface roughness and change of etching rate related to type and density of additives, we research to develop soft etching material having the same adhesiveness as existing etching material. As a result of research, it is estimated that after densities of $H_2O_2$ and $H_2SO_4$ are 3%, 4% respectively, 500 ppm of amine type 5-Azol, as inhibitor, and 600 ppm of PEI, as surfactant, and 10 ppm of phosphoric acid, as stabilizer, are added, is the most reasonable surface roughness and etching rate. As result of solder test, it is estimated that solder resist ink did not peel away or curl up and have reliable adhesiveness.

Solder resist ink와 회로표면과의 밀착력 향상을 위해 사용되는 soft etching 제의 기본 조성으로 과산화수소와 황산을 선정하고 inhibitor, 계면활성제, 안정제를 첨가하여 에칭 속도 $0.7{\sim}1{\mu}m/min$, 표면조도(Ra)값 $0.5{\sim}0.6{\mu}m$을 만족시키는 soft etching 제 개발을 위한 연구를 하였다. Inhibitor로는 butyl amine, cyclohexyl amine, 5-aminotetrazole (5-Azol)을 첨가하였으며 계면활성제로는 polyethylene glycol (PEG), polyethylene imine (PEI), piperidine을 안정제로는 butyl alcohol, isopropanol, 인산을 첨가하여 각각의 첨가제가 에칭 속도 및 표면조도에 미치는 영향을 비교 분석하였다. 본 연구 결과 과산화수소 3% 황산 4%에 5-Azol 500 ppm, PEI 600 ppm, 인산 10 ppm 첨가 시 $0.7~1{\mu}m/min$을 만족시키는 에칭속도와 가장 좋은 표면조도를 갖는 것을 확인하였으며 solder test 결과 solder resist ink의 들뜸 현상이 발생하지 않는 것을 확인하였다.

Keywords

Acknowledgement

Supported by : 중소기업청, 한국산업기술대학교, (주)ITMC

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