• Title/Summary/Keyword: slurry materials

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Fabrication of Fe Foam using Slurry Coating Process (슬러리 코팅 공정을 이용한 Fe 폼의 제조에 대한 연구)

  • Yun, Jung-Yeul;Park, Dahee;Yang, Sangsun;Wang, Jei-Pil
    • Resources Recycling
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    • v.26 no.6
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    • pp.97-101
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    • 2017
  • Metal foams have a cellular structure consisting of a solid metal containing a large volume fraction of pores. In particular, open pores which are penetrable pores are necessary for industrial applications such as in high temperature filters and as support for catalysts. In this study, Fe foam with greater than 90% porosity and 2-mm pore size was successfully fabricated using a slurry coating process and the pore properties were characterized. The Fe and $Fe_2O_3$ powder mixing ratios were controlled to produce Fe foam samples with different pore sizes and porosity. First, the slurry was prepared through the uniform mixing of powders, distilled water, and polyvinyl alcohol(PVA). The amount of slurry coated with the PU foam increased with increasing $Fe_2O_3$ mixing powder ratio, but the shrinkage and porosity of the Fe foams decreased, respectively, with increasing $Fe_2O_3$ mixing powder ratio.

Study on the Producing SiC Based Briquette for Raised Temperature of Molten Steel using Si Sludge Induced in the Process of Si Fabrication (실리콘 제조 공정에서 발생한 실리콘 슬러지를 활용한 용강 SiC계 승온제 제조 연구)

  • Lee, Chang-Hyun;Lee, Sang-Ro;Park, Man-Bok;Koo, Yeon-Soo;Lee, Man-Seung
    • Resources Recycling
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    • v.26 no.6
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    • pp.45-49
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    • 2017
  • Most Waste slurry is produced in the process of silicon manufacturing for semiconductor industry, containing silicon (Si) and silicon carbide (SiC). Waste slurry is simply stored with solidifying by cement or buried. On the other hand, it was suggested in this study that the waste slurry should be used for heating source as supplementary material in steel making process. The waste slurry was refined and pulverized, which was recycled into SiC-based sludge briquette. Chemical composition for SiC-based sludge briquette was analyzed and the feature of heating source was observed in accordance with the injection time and input amount. As a result, SiC-based sludge briquette in terms of low cost and high efficiency had an effect on increasing liquid steel temperature in steel making plants.

Characterization of Environment-Friendly Ceramic Coating Materials (친환경적인 분말형 세라믹 페인트의 특성평가)

  • 이제철;신영훈;김태현
    • Proceedings of the Korea Concrete Institute Conference
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    • 2002.10a
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    • pp.521-526
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    • 2002
  • In this paper, we described about the characteristic evaluation of environment-friendly ceramic paint with calcium-silicate mineral as a main binder. Particularly, we performed discharge of the environmental poisoning materials(e.g. VOCs, heavy metal, etc.), and properties of paint slurry and coating film of the ceramic paint. In the comparison of the ceramic paint with natural paint and mineral paint which were known as our environment-friendly paints, ceramic paint had good characteristics in the environmental safety and properies of wet slurry and dried coating film.

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The formation of barrier ribs for PDP by capillary infiltration method

  • Kim, Yong-Ho;Kim, Yong-Seog
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.1088-1090
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    • 2002
  • In this study, a new processing route of barrier ribs for the plasma display panels was attempted. A slurry containing ceramic powders for the barrier ribs, binder, hardener, and other additives, was molded into a PDMS mold by capillary infiltration process. The molded slurry was cured prior to mold removal. It was demonstrated that the process can fabricate successfully the cell type barrier ribs of PDP.

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Fabrication of Porous Cu by Freeze-Drying Method of CuO-Camphene Slurry (CuO-Camphene 슬러리의 동결건조에 의한 Cu 다공체 제조)

  • Kim, Min-Soo;Oh, Sung-Tag;Chang, Si-Young;Suk, Myung-Jin
    • Journal of Powder Materials
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    • v.18 no.4
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    • pp.327-331
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    • 2011
  • In order to fabricate the porous metal with controlled pore characteristics, unique processing by using metal oxide powder as the source and camphene as the sublimable material is introduced. CuO powder was selected as the source for the formation of Cu metal via hydrogen reduction. Camphene-based CuO slurry, prepared by milling at $47^{\circ}C$ with a small amount of dispersant, was frozen at $-25^{\circ}C$. Pores were generated subsequently by sublimation of the camphene. The green body was hydrogen-reduced at $200^{\circ}C$ for 30 min, and sintered at $500-700^{\circ}C$ for 1 h. Microstructural analysis revealed that the sintered Cu showed aligned large pore channels parallel to the camphene growth direction, and fine pores are formed around the large pore. Also, it showed that the pore size was controllable by the slurry concentration.

The effect of pH adjustor on the Cu CMP (Chemical Mechanical Planarization) (Slurry에 첨가되는 pH 적정제가 Cu CMP에 미치는 영향 분석)

  • Kang, Young-Jae;Eom, Dae-Hong;Song, Jae-Hoon;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.132-135
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    • 2004
  • 현재 사용 되고 있는 Cu CMP slurry에서 pH 적정제의 역할은 slurry의 연마 거동을 결정 하는 중요한 요소이다. 일반적으로 사용 되고 있는 적정제로는 $NH_4OH$, KOH가 있다. 구리 CMP용 슬러리내에서 CMP 공정 중에 과산화수소 $(H_2O_2)$의 영향에 관한 연구는 있으나, 과산화수소의 농도 (vol %) 변화에 따라서 pH적정제가 하는 역할과 반응이 CMP 공정중에 미치는 영향에 관해서 연구된 바 없다. 이 논문에서는 pH 적정제가 과산화수소의 농도에 따라서 산성, 중성, 염기성에서 어떠한 변화를 일으키는지에 관해서 dynamic etch rate과 removal rate을 비교 하였고, static etch rate을 이용하여 Cu 표면이 etching 되는 속도를 비교 하였다. 그 결과, 산성과 중성에서는 $NH_4OH$와 KOH의 경향성은 비슷하였으나, 염기성에서는 KOH를 첨가한 경우 변화가 나타나지 않았다. 따라서, pH가 염기성으로 갈수록 과산화수소의 저 농도에서 $NH_4OH$의 영향이 더 커짐을 알 수 있었다.

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CMP Behaviors of CMP Slurry for Ru Barrier Metal (Ru barrier metal을 위한 CMP 슬러리의 CMP 거동 관찰)

  • Son, Hye-Yeong;Kim, In-Gwon;Park, Jin-Gu
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.57-57
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    • 2009
  • 반도체 device가 고집적화 및 다층화 되어짐에 따라 현재 사용되고 있는 구리 interconnect의 확산방지막인 Ta/TaN은 많은 문제가 발생하고 있다. 고집적화 된 반도체 소자에 적용시키기에는 Ta/TaN 확산 방지막의 고유 저항값이 매우 크고, 구리의 증착에 필요한 seed layer의 크기도 문제화 된다고 보고되어지고 있다. 이러한 이유로 인해 점차 고집적화 되어지는 반도체 기술에 맞추어 새로운 확산 방지막에 대한 연구가 현재 활발히 이루어지고 있다. 이에 새로운 확산 방지막으로써 대두되고 연구되고 있는 재료가 Ruthenium (Ru)이다. Ru은 공기 중에서 매우 안정하고 고유저항 값 또한 $13\;{\mu}{\Omega}\;cm$의 Ta에 비해 $7.1\;{\mu}{\Omega}\;cm$의 매우 작은 고유저항 특성을 가지고 있다. 또한, Ru은 구리와의 우수한 접착성으로 인해 구리의 interconnect의 형성에 있어 seed layer가 필요하지 않을 뿐만 아니라 높은 annealing 온도에서도 무시할 만큼 작은 solid solubility를 가지며 구리와의 계면에서 새로운 화합물을 형성하지 않으며 annealing시 구리의 delamination을 유발시키지도 않는다. 이에 따라, 평탄화와 소자 분리를 위하여 chemical mechanical planarization (CMP) 공정이 필요하게 되었다. 하지만, Ru의 noble한 성질과 Ru 확산방지막 CMP공정 시 노출되는 다른 이종 물질 사이의 최적화 된 selectivity를 구현하는데 많은 어려움이 있다. 이로인해 Ru 확산 방지막을 위한 CMP slurry에 대한 연구는 아직 미흡한 수준이다. 본 연구에서는 Ru이 확산방지막으로 사용되었을 때 이를 위한 CMP slurry에 대한 평가와 연구가 이루어졌다. Slurry 조성과 농도 및 pH에 따른 전기 화학적 분석을 통하여 slurry 내에서 각각의 막질들이 어떠한 상태로 존재하는지 분석해 보았다. 또한, Ru을 비롯한 이종막질들의 etch rate, removal rate와 selectivity에 대한 연구가 진행되었다. 최종적으로 Ru 확산방지막 CMP를 위한 최적화된 slurry를 제안하였다.

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Effect of aerobically treated manure on odorous material emissions from a swine finishing barn equipped with a continuous pit recirculation system

  • Choi, Yongjun;Ha, Duck-Min;Lee, Sangrak;Kim, Doo-Hwan
    • Animal Bioscience
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    • v.35 no.2
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    • pp.308-316
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    • 2022
  • Objective: This study was conducted to determine reduction of various odorous materials from a swine farm equipped with a continuous pit recirculation system (CPRS) with aerobically treated liquid manure. Methods: The CPRS is used in swine farms in South Korea, primarily to improve air quality in pig houses. In this study, CPRS consists of a manure aerobic treatment system and a fit recirculation system; the solid fraction is separated and composted, whereas the aerobically treated liquid fraction (290.0%±21.0% per day of total stored swine slurry) is continuously returned to the pit. Four confinement pig barns in three piggery farms were used; two were equipped with CPRS and the other two operated a slurry pit under the slatted floor. Results: All chemical contents of slurry pit manure in the control were greater than those of slurry pit manure in the CRPS treatment (p<0.05). Electrical conductivity and pH contents did not differ among treatments. The biological oxygen demand of the slurry pit treatment was greater than that of the other treatments (p<0.05). Total nitrogen, total phosphorus, and ammonia nitrogen contents of the slurry pit treatment were greater than those of other treatments (p<0.05). Odor intensity of the CPRS treatment was lower than that of the control at indoor, exhaust, and outside sampling points (p<0.05). The temperature and carbon dioxide of the CPRS treatment in the pig barn was significantly lower than those of control (p<0.05). All measured odorous material contents of the CPRS group were significantly lower than those of the control group (p<0.05). Conclusion: The CPRS application in pig farms is considered a good option as it continuously reduces the organic load of animal manure and lowers the average odorant concentration below the threshold of detecting odorous materials.

Post Sliced Cleaning of Silicon Wafers using Ozone and Ultrasound (오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning)

  • Choi, Eun-Suck;Bae, So-Ik
    • Korean Journal of Materials Research
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    • v.16 no.2
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    • pp.75-79
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    • 2006
  • The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.