• Proceedings of the Korea Association of Crystal Growth Conference
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• 1998.06a
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• pp.81-86
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• 1998

The light aggregates were fabricated by sintering green bodies made form the fly ash-clay alip. The content of fly ashes in the slip could be increased up to 70wt.% due to controlled rheological behavior of the slip, and the green body of uniform microstructure could be obtained by DCC(Direct Coagulation Casting)method. The apparent density, microstructure and compressive strength for sintered bodies fired at 1100∼1200$^{\circ}C$ were evaluated. The properties of light aggregates fabricated depend on slip density, particle behavior in the slip and sintering conditions. The sintered body prepared by firing a green body made from slip of density 1.60 at 1150$^{\circ}C$/2hr satisfied conditions of a light aggregate as apparent density of 1.49${\pm}$0.02 and compressive strength of 584${\pm}$62kg/$\textrm{cm}^2$.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.30-36
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• 2002

In this paper, some idea about the use of Metal and ceramic filled epoxy adhesive, Anaerobic adhesive and RTV silicone in the assembly, maintain and repair of machinery and equipment is given. Many examples which have been successfully used in Chinese industry are introduced: ${\bullet}$ Wear, Abrasion, Corrosion/Erosion Resistance and Metal Rebuilding Worn shafts, Scored Hydraulic Ram, Bearing Housings, Slurry Pumps (Bodies & Impellers), Slide-ways, Heat Exchangers, Cracked Castings and Molds. Leaking Pipes and Tanks. ${\bullet}$ Locking and Retaining Thread, Bearing, Keyways, Bolts, Nuts, Studs, Gears, Collars, Motors. ${\bullet}$ Scaling and Gasketing Flanges, Pipe Joints, Machined surfaces.

• The Korean Journal of Ceramics
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• v.5 no.2
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• pp.119-124
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• 1999

Silicon nitride ceramics with highly oriented microstructure were prepared by tape casting a slurry containing 5 wt% of the silicon nitride whiskers. The whiskers were aligned in the casting direction and worked as seeds for the grain growth. The anisotropy was observed from the sintering shrinkage, Vickers indentation crack lengths, and XRD patterns. The cracks were much longer on the surface normal to the aligned grains than on the tape casting surface where the lateral cracks were also observed. The effect of sintering additives and the annealing treatment on the indentation crack length was examined. The sample with higher silica content had longer cracks than the one with lower silica content. The crack length anisotropy increased after annealing at 2123K.

• Journal of the Korean Ceramic Society
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• v.52 no.5
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• pp.315-319
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• 2015

Yttria-stabilized zirconia (YSZ)-based micro tubular SOFC single cells were fabricated by electrophoretic deposition (EPD) process. Stable slurries for the EPD process were prepared by adding phosphate ester (PE) as a dispersant in order to control the pH, conductivity, and zeta-potential. NiO-YSZ anode support, NiO-YSZ anode functional layer (AFL), and YSZ electrolyte were consecutively deposited on a graphite rod using the EPD process; materials were then co-sintered at $1400^{\circ}C$ for 4 h. The thickness of the deposited layer increased with increasing of the applied voltage and the deposition time. A YSZ-based micro tubular single cell fabricated by the EPD process exhibited a maximum power density of $0.3W/cm^2$ at $750^{\circ}C$.

• Journal of Ceramic Processing Research
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• v.19 no.5
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• pp.413-418
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• 2018

All-solid-state lithium batteries (ASSBs) using inorganic sulfide-based solid electrolytes are considered prospective alternatives to existing liquid electrolyte-based batteries owing to benefits such as non-flammability. However, it is difficult to form a favorable solid-solid interface among electrode constituents because all the constituents are solid particles. It is important to form an effective electron conduction network in composite cathode while increasing utilization of active materials and not blocking the lithium ion path, resulting in excellent cell performance. In this study, a mixture of fibrous VGCF and spherical nano-sized Super P was used to improve rate performance by fabricating valid conduction paths in composite cathodes. Then, composite cathodes of ASSBs containing 70% and 80% active materials ($LiNi_{0.6}Co_{0.2}Mn_{0.2}O_2$) were prepared by a solution-based process to achieve uniform dispersion of the electrode components in the slurry. We investigated the influence of binary carbon additives in the cathode of all-solid-state batteries to improve rate performance by constructing an effective electron conduction network.

• Journal of the Korean Wood Science and Technology
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• v.42 no.1
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• pp.27-33
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• 2014

The characteristic of vegetation mat prepared from miscanthus, waste wood chip, perlite and pulp slurry was investigated. The pore rate was increased with amount of pulp slurry. The hydraulic conductivity decreased with the amount of miscanthus in the condition mixed with each other raw materials. With the miscanthus amount, the soil hardness was increased. The peel strength decreased with the mount of miscanthus amount in all case. Hydrogen ion concentration (pH) was the overall alkaline. The MOR of miscanthus based vegetation mat was decreased with the amount miscanthust.

• Journal of the Korean Ceramic Society
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• v.47 no.2
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• pp.183-188
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• 2010

$Ce_{0.8}Gd_{0.2}O_{1.9}$(GDC20) powder was synthesized by milling of $CeO_2$ slurry and Gd oxalate precipitation. The mixture of $CeO_2$ powder and Gd precipitates calcined at $600^{\circ}C$ for 2 h showed the particle size distribution similar to that of $CeO_2$ powder, which had been milled during the synthesis process. Attrition milling of the calcined powder with an average particle size of $0.36\;{\mu}m$ for 2 h resulted in a decrease in the particle size to $0.24\;{\mu}m$. Although the milled powder consisted of small particles(<$1\;{\mu}m$), a small amount of fine platy $Gd_2O_3$ particles, which had been survived in the milling process, was observed. Sintering of the powder compacts for 4 h showed relative densities of 80.7% at $1300^{\circ}C$ and 97% at $1400^{\circ}C$, respectively. Densification was found to almost complete at $1500^{\circ}C$, resulting in a dense and homogeneous microstructure with a relative density of 99.5%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.1296-1299
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• 2004

MIM capacitor has been investigated for the next generation DRAM. Conventional poly-Si bottom electrode cannot satisfy the requirement of electrical properties and comparability to the high k materials. New bottom electrode material such as ruthenium has been suggested in the fabrication of MIM structure capacitor. However, the ruthenium has to be planarized due to the backend scalability. For the planarization CMP has been widely used in the manufacture of integrated circuit. In this research, ruthenium thin film was Polished by CMP with cerium ammonium nitrate (CAN)base slurry. HNO3 was added on the CAN solution as an additive. In the various concentration of chemical and alumina abrasive, ruthenium surface was etched and polished. After static etching and polishing, etching and removal rate was investigated. Also microroughness of surface was observed by AFM. The etching and removal rate depended on the concentration of CAN, and HNO3 accelerated the etching and polishing of ruthenium. The reasonable removal rate and microroughness of surface was achieved in the 1wt% alumina slurry.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.12
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• pp.2085-2091
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• 2003

An ultrasonic machining process has been known as efficient and economical means fer precision machining of glass or ceramic materials. However, because of its complexity, the mechanism of the machining process is still not well understood. Therefore, it is hard to optimize the process parameters effectively. The conventional ultrasonic machining which uses the abrasive slurry only, furthermore, is time-consuming and gives the relatively rough surface. In order to increase the material removal rate and improve the integrity of the machined surface, we have introduced the novel ultrasonic machining technique, Chemical-assisted UltraSonic Machining(CUSM). The desktop-style micro ultrasonic machine has been developed and the z-axis feed is controlled by the constant load control algorithm. To obtain the chemical effects, the low concentration HF(hydrofluoric acid) solution, which erodes glass, added to alumina slurry. Through various experiments and comparison with conventional results, the superiority of CUSM is verified. MRR increases over 200%, the surface roughness is improved and the machining load decreases dramatically.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.203-207
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• 2008

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.