Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Development of Microstructure Pad and Its Performances in STI CMP

미세 표면 구조물을 갖는 패드의 제작 및 STI CMP 특성 연구

  • 정석훈 (부산대학교 기계공학부 정밀가공시스템) ;
  • 정재우 (삼성전자 반도체총괄 스토리지사업부) ;
  • 박기현 (부산대학교 기계공학부 정밀가공시스템) ;
  • 서현덕 (부산대학교 기계공학부 정밀가공시스템) ;
  • 박재홍 (부산대학교 기계공학부 정밀가공시스템) ;
  • 박범영 (부산대학교 기계공학부 정밀가공시스템) ;
  • 주석배 (하이브리드소재 솔루션 협동과정) ;
  • 최재영 (동부일렉트로닉스(주) Nano T/F) ;
  • 정해도 (부산대학교 기계공학부)
  • Published : 2008.03.01
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Abstract

Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials. There are many elements such as slurry, polishing pad, process parameters and conditioning in CMP process. Especially, polishing pad is considered as one of the most important consumables because this affects its performances such as WIWNU(within wafer non-uniformity) and MRR(material removal rate). In polishing pad, grooves and pores on its surface affect distribution of slurry, flow and profile of MRR on wafer. A subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure(MS) pad. MS pad is designed to have uniform structure on its surface and manufactured by micro-molding technology. And then STI CMP performances such as pattern selectivity, erosion and comer rounding are evaluated.

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References

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