• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Computational Structural Engineering
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• v.9 no.4
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• pp.181-187
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• 1996

This paper concerns the singular thermal stresses at the interface corner between the elastic fiber and the viscoelastic matrix of a two-dimensional unidirectional laminate model induced during cooling from cure temperature down to room temperature. Time-domain boundary element method is employed to investigate the nature of residual thermal stresses at the interface. Numerical results show that very large stress gradients are present at the interface corner and such stress singularity might lead to local yielding or fiber-matrix debonding.

• Structural Engineering and Mechanics
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• v.5 no.6
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• pp.705-713
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• 1997

The residual thermal stresses at the interface corner between the elastic fiber and the viscoelastic matrix of a two-dimensional unidirectional laminate due to cooling from cure temperature down to room temperature were studied. The matrix material was assumed to be thermorheologically simple. The time-domain boundary element method was employed to investigate the nature of stresses on the interface. Numerical results show that very large stress gradients are present at the interface corner and this stress singularity might lead to local yielding or fiber-matrix debonding.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2002.10a
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• pp.146-152
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• 2002

In this study, the singular thermal stresses induced during cooling down from high temperature to room temperature have been analyzed for the viscoelastic thin layer. The time domain boundary element method has been employed to investigate the behavor of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between the elastic substrate and the viscoelastic thin layer intersects the free surface.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.4
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• pp.887-902
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• 1994

Within the framework of anisotropic thermoelasticity, the problem of an interlaminar crack in a laminated fiber-reinforced composite subjected to a uniform heat flow is investigated. Under a state of generalized plane deformation, dissimilar anisotropic half-spaces with different fiber orientations are considered to be bound together by a matrix interlayer containing the crack. The interlayer models the matrix-rich interlaminar region of the fibrous composite laminate. Based on the flexibility/stiffness matrix approach, formulation of the current crack problem results in having to solve two sets of singular integral equations for temperature and thermal stress analyses. Numerical results are obtained, illustrating the parametric effects of laminate stacking sequence, relative crack size, crack location, crack surface partial insulation, and fiber volume fraction on the values of mixed mode thermal stress intensity factors.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.146-153
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• 2003

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to the combined influence of temperature change and moisture absorption. A boundary element analysis is employed to investigate the behavior of interface stresses. The film is assumed to be thermorheologically simple. It is further assumed that moisture effects are analogous to thermal effects. Numerical results are presented for a given viscoelastic model, indicating the singular residual stresses induced during cooling down from the curing temperature, and how they can be altered by subsequent moisture absorption at room temperature.

• Structural Engineering and Mechanics
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• v.44 no.3
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• pp.289-303
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• 2012

Existing plane stress solutions for thin plates and disks have shown several qualitative features which are difficult to handle with the use of commercial numerical codes (non-existence of solutions, singular solutions, rapid growth of the plastic zone with a loading parameter). In order to understand the effect of temperature and pressure-dependency of the yield criterion on some of such features as well as on the distribution of residual stresses and strains, a semi-analytic solution for a thin hollow disk fixed to a rigid container and subject to thermal loading and subsequent unloading is derived. The material model is elastic-perfectly/plastic. The Drucker-Prager pressure-dependent yield criterion and the equation of incompressibity for plastic strains are adopted. The distribution of residual stresses and strains is illustrated for a wide range of the parameter which controls pressure-dependency of the yield criterion.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.8
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• pp.2524-2539
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• 1996

A design process and an axisymmetric boundary integral equation method for precise structural analysis of the aircraft gas turbine rotor disk were developed. This axisymmetric boundary integral equation method for stress and steady-state thermal analysis was improved in solution accuracy by appling an implicit technique for Cauchy principal value evaluation, a subelement technique for weak singular integral evaluation and a double exponentical integral technoque for internal point solution near boundary surfaces. Stresses, temperatures, low cycle fatigue lifes and critical speeds for the turbine rotor disk of the thrust 1421 N class turbojet engine were analysed in a pratical calculation model problem.

• Journal of the Semiconductor & Display Technology
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• v.9 no.3
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• pp.35-39
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• 2010

Interfacial stress singularity induced in an analysis model consisting of the polymeric thin film and the elastic substrate has been investigated using the boundary element method. The interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression are investigated for the case of a small interfacial edge crack. It is assumed that moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack is computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.