• Smart Structures and Systems
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• v.24 no.6
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• pp.783-791
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• 2019

Prefabricated reinforced-concrete shear walls are used extensively in building structures because they are convenient to construct and environmentally sustainable. To make large walls easier to transport, they are divided into smaller segments and then assembled at the construction site using a variety of connection methods. The present paper proposes a precast shear wall assembled using steel shear keys, wherein the shear keys are fixed on the embedded steel plates of adjacent wall segments by combined plug and fillet welding. The anchoring strength of shear keys is known to affect the mechanical properties of the wall segments. Loading tests were therefore performed to observe the behavior of precast shear wall specimens with different anchoring components for shear keys. The specimen with insufficient strength of anchoring components was found to have reduced stiffness and lateral resistance. Conversely, an extremely high anchoring strength led to a short-column effect at the base of the wall segments and low deformation ability. Finally, for practical engineering purposes, a design approach involving the safety coefficient of anchoring components for steel shear keys is suggested.

• Journal of Welding and Joining
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• v.19 no.5
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• pp.520-525
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• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

• Journal of Welding and Joining
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• v.19 no.1
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• pp.112-117
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• 2001

The factor affecting on the fatigue strength of spot welded specimen have been studied. To analyze and predict crack initiation position and propagation directions on the spot welded area are very important for strength design of the automobile body structure. In fact, there are a various of loads in running automobile but, it is impossible to replay like an actual conditions in the laboratory. So, in this study tensile-shear type and in-plane bending type specimens were used in fatigue test and includes an analysis of fatigue crack initiation position and propagation directions about earth specimens. The results obtained in the present study are summarized as follows: 1. In tensile-shear type fatigue test, the region of fatigue crack initiation position was affected by out-of-plane bending deformation due to bending angle. 2 In in-plane bending type fatigue test, the behavior of fatigue crack initiation position and propagation derections due to angle between upper plate and lower plate was dominated by magnitude of in-plane bending moment.

• Journal of Advanced Marine Engineering and Technology
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• v.31 no.4
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• pp.394-400
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• 2007

The properties and weldability of lap joints by PFSW with 1050 Al sheet was investigated according to tool shape. dimension and welding condition. Tensile shear test was carried out for lap jointed specimen, and the hardness in the joint regions was examined. Moreover interfacial joining length, metallograph and failure location of the lap-jointed cross section were discussed. Two tool types were a simple cylindrical type and a notched cylindrical type. Under joining conditions such as plunging depth of 2.2mm. rotating speed of 1600rpm and dwelling time of 3s, the tensile shear strength of lap-jointed specimen by the notched type tool was superior to that by simple cylindrical type tool. The maximum tensile shear load of lap jointed specimen was 5807N. Optimal dimensions of the notched type tool were as follows : diameters of the shoulder and pin were $18{\phi}mm$ and $10{\phi}mm$, and pin length was 2.2mm.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.47-54
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• 2002

Powder type Ag system insert metals were manufactured by ball milling process. The variables of milling process such as milling media, revolution speed and powder/ball weight ratio were constant except the milling time. The milling times were selected for 24, 48 and 72 hours. The insert metals made by milling process were evaluated by performing scanning electron microscope, x-ray and DSC(differential scanning calorimetry) analysis, and further in terms of wettability test. The selected insert metals that have the good characteristics compared to commercial insert metals were applied to make the brazed joints of the steel/steel and the steel/WC superhard particles. The characterizations of those brazed joints were also conducted by microstructural observations, shear tensile tests and microhardness measurements. The results indicated that milling time of 48 hours for making powder type insert metals was the best condition showing the small amount of oxides residue, low wetting angle and stable microstructure. The brazed joints that applied the 48 hours milled insert metal were very sound condition indicating the shear tensile value of $2.29{\times}102$ MPa and the microhardness of 138VHN. Further, the amount of the porosity was appeared to be lower than that of the commercial insert metals.

• Journal of Welding and Joining
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• v.31 no.6
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.94-97
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• 2000

• Proceedings of the KWS Conference
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• 1990.04a
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• pp.76-80
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• 1990

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.93-95
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• 2003

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.18-20
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• 2006