Characteristic of Intermetallic Compounds for Aging of Lead Free Solders Applied to 48 $\mu$ BGA
(48 $\mu$ BGA에 적용한 무연솔더의 시효처리에 대한 금속간화합물의 특성)
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- Journal of the Microelectronics and Packaging Society
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- v.8 no.3
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- pp.37-42
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- 2001