• Title/Summary/Keyword: shear heating

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Effects of Dietary Oriental Medicine Refuse and Mugwort Powder on Physico-Chemical Properties of Korean Native Pork (한약부산물과 쑥 분말 급여가 재래종 돈육의 이화학적 특성에 미치는 영향)

  • 김병기;강삼순;김영직
    • Food Science of Animal Resources
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    • v.21 no.3
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    • pp.208-214
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    • 2001
  • This study was conducted to investigate the influence of dietary oriental medicine refuse(OMR) and mugwort powder on physico-chemical characteristics of Korean Native Pork(KNP). KNP were randomly assigned to one of the three dietary treatments : 1) control (commercial feed) 2) T1 (commercial fed supplemented with 10% OMR powder) 3) T2 (commercial feed with 10% mugwort powder). 15 heads(♂) were feed one of the experimental diets for 5 months and slaughtered. In the proximate composition, moisture content showed slightly high in the T1, however, fat content were tended to be high in the control. The heating loss, shear value, WHC (water holding capacity) were not significantly between control and the treatments group. The T1 showed the lowest pH among treatments (P<0.05). In sensory evaluation, juiciness and tenderness of T1 and T2 were higher compared with that of control. Hunter a* did not show any difference among the treatments group. But Hunter L*, b* in treatment group(T1, T2) were higher than that of the control. Oleic acid, linoleic acid and unsaturated fatty acid contents of T1 and T2 were higher than the control. The total amino acid of the control, T1 and T2 were 18.290, 18.177 and 18.942mg%, respectively.

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Applications of Low-voltage Ohmic Process Combined with Temperature Control System to Enhance Salting Process of Pork

  • Hong, Geun-Pyo;Chun, Ji-Yeon;Choi, Mi-Jung
    • Food Science of Animal Resources
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    • v.32 no.3
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    • pp.293-300
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    • 2012
  • This study investigated the effects of a low-voltage ohmic heating process (2.5 and 3.8 V/cm) on the thawing characteristics and NaCl diffusion of pork. The thawing rate of pork was dependent on the applied voltages and brine salinities, and few differences were obtained in pork quality parameters (color, water-holding capacity, and shear force) regarding the different treatments. The NaCl concentration of pork after ohmic thawing was higher than that following brine-immersion thawing, however, the NaCl diffusion did not differ from when fresh meat was immersed in brine. For application of the ohmic process in fresh pork, various ohmic pulses were generated in order to prevent the meat from overheating, and the results indicated that the ohmic process was a better way to enhance NaCl diffusion compared with immersing pork at high temperature. Although the mechanisms involved in NaCl diffusion at low-voltage electric field strength were unclear, the present study demonstrated that the ohmic process has a potential benefit in the application of meat processing.

Study on compensation of thermal stresses in multilayered materials

  • Han, Jin-Woo;Kim, Jong-Yeon;Kim, Byoung-Yong;Han, Jeong-Min;Moon, Hyun-Chan;Park, Kwang-Bum;Seo, Dae-Shik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.06a
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    • pp.413-413
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    • 2007
  • In recent years, flexible display devices such as liquid crystal display (LCD), organic light emitting diode (OLED), etc. have attracted considerable interest in a wide variety of applications. Polymer substrate is absolutely necessary to realize this kind of flexible display devices. Using the polymer as a substrate, there are lots of advantages including not only mechanical flexibility such as rolling and bending characteristics but also light weights, low cost and so on. In detail, thickness and weights is only one forth and one second of glass substrate, respectively. However, it needs low temperature below $150^{\circ}C$ in the fabrication process comparing to conventional deposition process. The polymer substrate is not thermally stable as much as the glass substrate so that some deformation can be occurred according to variation of temperature. In particular, performance of devices can be easily deteriorated by shrinkage of substrate when heating it. In this paper, pre-annealing and deposition of buffer layer was introduced and studied to solve previously mentioned problems of the shrinkage and followed shear stress.

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Effect of bound water on mechanical properties of typical subgrade soils in southern China

  • Ding, Le;Zhang, Junhui;Deng, Zonghuang
    • Geomechanics and Engineering
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    • v.27 no.6
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    • pp.573-582
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    • 2021
  • From the effect of bound water, this study aims to seek the potential reasons for difference of mechanical experiment results of subgrades soils. To attain the comparatively test condition of bound water, dry forming (DF) and wet forming (WF) were used in the specimen forming process before testing, series of laboratory tests, i.e., CBR tests, direct shear tests and compaction tests. The measured optimal moisture contents, maximum dry densities, CBR, cohesion c, and internal friction angle 𝜑 were given contrastive analysis. Then to detect the adsorptive bound water in the subgrade soils, the thermal gravimetric and differential scanning calorimetry (TG-DSC) test were employed under different heating rates. The free water, loosely bound water and tightly bound water in soils were qualitatively and quantitatively analyzed. It was found that due to the different dehydration mechanics, the lost bound water in DF and WF process show their own characteristics. This may lead to the different mechanical properties of tested soils. The clayey particles have a great influence on the bound water adsorbed ability of subgrade soils. The more the clay content, the greater the difference of mechanical properties tested between the two forming methods. Moreover, in highway construction of southern China, the wet forming method is recommended for its higher authenticity in simulating the subgrade filed humidity.

Hydrogen Aging During Hole Expanding Tests of Galvanized High Strength Steels Investigated Using a Novel Thermal Desorption Analyzer for Small Samples

  • Melodie Mandy;Maiwenn Larnicol;Louis Bordignon;Anis Aouafi;Mihaela Teaca;Thierry Sturel
    • Corrosion Science and Technology
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    • v.23 no.2
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    • pp.145-153
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    • 2024
  • In the automotive industry, the hole expanding test is widely used to assess the formability of punched holes in sheets. This test provides a good representation of formability within the framework defined by the ISO 16630 standard. During hole expanding tests on galvanized high strength steels, a negative effect was observed when there was a delay between hole punching and expansion, as compared to performing both operations directly. This effect is believed to be caused by hydrogen aging, which occurs when hydrogen diffuses towards highly-work hardened edges. Therefore, the aim of this study is to demonstrate the migration of hydrogen towards work-hardened edges in high strength Zn-coated steel sheets using a novel Thermal Desorption Analyzer (TDA) designed for small samples. This newly-developed TDA setup allows for the quantification of local diffusible hydrogen near cut edges. With its induction heating and ability to analyze Zn-coated samples while reducing artifacts, this setup offers flexible heat cycles. Through this method, a hydrogen gradient is observed over short distances in shear-cut galvanized steel sheets after a certain period of time following punching.

Numerical simulation of a toroidal single-phase natural circulation loop with a k-kL-ω transitional turbulence model

  • Yiwa Geng;Xiongbin Liu;Xiaotian Li;Yajun Zhang
    • Nuclear Engineering and Technology
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    • v.56 no.1
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    • pp.233-240
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    • 2024
  • The wall friction correlations of oscillatory natural circulation loops are highly loop-specific, making it difficult to perform 1-D system simulations before obtaining specific experimental data. To better predict the friction characteristics, the nonlinear dynamics of a toroidal single-phase natural circulation loop were numerically investigated, and the transition effect was considered. The k-kL-ω transitional turbulence and k-ω SST turbulence models were used to compute the flow characteristics of the loop under different heating powers varying from 0.48 to 1.0 W/cm2, and the results of both models were compared with previous experiments. The mass flow rates and friction factors predicted by the k-kL-ω model showed a better agreement with the experimental data than the results of the k-ω SST model. The oscillation frequencies calculated using both models agreed well with the experimental data. The k-kL-ω transitional turbulence model provided better friction-factor predictions in oscillatory natural circulation loops because it can reproduce the temporal and spatial variation of the wall shear stress more accurately by capturing the movement of laminar, transition turbulent zones inside unstable natural circulation loops. This study shows that transition effects are a possible explanation for the highly loop-specific friction correlations observed in various oscillatory natural circulation loops.

DEVELOPMENT OF SN BASED MULTI COMPONENT SOLDER BALLS WITH CD CORE FOR BGA PACKAGE

  • Sakatani, Shigeaki;Kohara, Yasuhiro;Uenishi, Keisuke;Kobayashi, Kojiro F.;Yamamoto, Masaharu
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.450-455
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    • 2002
  • Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

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Bonding Strength of Cu/SnAgCu Joint Measured with Thermal Degradation of OSP Surface Finish (OSP 표면처리의 열적 열화에 따른 Cu/SnAgCu 접합부의 접합강도)

  • Hong, Won-Sik;Jung, Jae-Seong;Oh, Chul-Min
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.1
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    • pp.47-53
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    • 2012
  • Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

Effects of Dietary Panax ginseng Leaves, Dioscorea japonica Hulls and Oriental Medicine Refuse on Physico-Chemical Properties of Korean Native Chicken Meat (인삼, 산약, 한약 부산물의 급여가 재래종 계육의 이화학적 특성에 미치는 영향)

  • 김병기;황인업;김영직;황영현;배만종;김수민;안종호
    • Food Science of Animal Resources
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    • v.22 no.2
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    • pp.122-129
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    • 2002
  • This study was conducted to investigate the effect of dietary Panax ginseng Leaves, (PGL), Dioscorea japonica Hulls(DJH) and Oriental Medicine Refuse(OMR) on meat quality and physico-chemical properties in meat sample of Korean Native Chicken(KNC). KNC were randomly assigned to one of the 4 dietary treatment : 1) control(commercial feed), 2) PGL(commercial feed supplemented with 5% Panax ginseng leaves) 3) DJH(commercial feed with 5% Dioscorea japonica hulls) 4) OMR (commercial feed with 5% oriental medicine refuse). They were feed one of the experimental diets for 12 weeks and slaughtered. 160 KNC raised for 20 weeks. In the proximate composition, moisture, crude protein and crude ash was no significantly difference. But fat content were tended to high in control. The heating loss of control, PGL, DJH and OMR were 28.44%, 30.44%, 28.83% and 25.71% and control, PGL, and DJH were higher compared with that of OMR. The WHC(whiter holding capacity) was contrary to heating loss. The shear value and pH did not show any difference among the treatment groups. There were no significantly different in meat color(L*, a*, b*) between control and treatment groups (L*=63.20∼70.67, a*=2.20∼4.15, b*=2.70∼6.01). In sensory evaluation, juiciness, tenderness and flavor were not detected to panelist. Among fatty acid, oleic acid of DJH and OMR were higher than that of control and PGL(p<0.05). Also, saturated fatty acid/unsaturated fatty acid of control, PGL, DJH and OMR were 1.58, 1.58, 1.64 and 1.67, respectively. DJH and OMR groups was higher than control and PGL groups(p<0.05). Total amino acid contents was control>OMR>DJH>PGL. Major amino acid of KNC was comprised to glutamic acid, lysine, aspartic acid, leucine and arginine.

Room-temperature Bonding and Mechanical Characterization of Polymer Substrates using Microwave Heating of Carbon Nanotubes (CNT 마이크로파 가열을 이용한 고분자 기판의 상온 접합 및 기계적 특성평가)

  • Sohn, Minjeong;Kim, Min-Su;Ju, Byeong-Kwon;Lee, Tae-Ik
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.89-94
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    • 2021
  • The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.