Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2002.10a
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- Pages.450-455
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- 2002
DEVELOPMENT OF SN BASED MULTI COMPONENT SOLDER BALLS WITH CD CORE FOR BGA PACKAGE
- Sakatani, Shigeaki (Graduate School of Engineering, Osaka University) ;
- Kohara, Yasuhiro (SANYO Electric Co., Ltd.) ;
- Uenishi, Keisuke (Graduate School of Engineering, Osaka University) ;
- Kobayashi, Kojiro F. (Graduate School of Engineering, Osaka University) ;
- Yamamoto, Masaharu (SUMITOMO SPECIAL METALS CO., LTD)
- Published : 2002.10.01
Abstract
Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of