Interfacial Adhesion Enhancement Process of Local Stiffness-variant Stretchable Substrates for Stretchable Electronic Packages (신축성 전자패키지용 강성도 국부변환 신축기판의 계면접착력 향상공정)
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- Journal of the Microelectronics and Packaging Society
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- v.25 no.4
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- pp.111-118
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- 2018